公开(公告)号：US09379083B2

公开(公告)日：2016-06-28

申请号：US14455184

申请日：2014-08-08

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Yuji Iizuka ,  Masafumi Horio ,  Hideyo Nakamura

IPC: H01L23/00 ,  H01L25/18 ,  H05K1/02 ,  H02M7/00 ,  H01L25/07 ,  H01L23/31 ,  H01L23/34 ,  H01L29/66 ,  H01L23/498 ,  H01L23/051 ,  H01L25/11 ,  H01L23/538

CPC classification number: H01L24/80 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/34 ,  H01L23/49811 ,  H01L23/5385 ,  H01L24/02 ,  H01L25/072 ,  H01L25/115 ,  H01L25/117 ,  H01L25/18 ,  H01L29/66325 ,  H01L2224/06 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H02M7/003 ,  H05K1/0263 ,  H05K2201/10166 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor device is a composite module in which three power semiconductor modules are arranged at a predetermined interval in the same plane and pin-shaped conductors that are drawn from the power semiconductor modules to the outside are connected to three main terminal plates such that they are integrated with each other. When the entire composite module is accommodated in a protective case and a radiation fin is provided, bolts are inserted into through holes to fix the protective case to the radiation fin. In this way, it is possible to accommodate the composite module in the protective case while reliably bringing the bottom of an insulating substrate into close contact with the radiation fin.

Abstract translation: 半导体器件是复合模块，其中三个功率半导体模块以相同的平面以预定的间隔布置，并且从功率半导体模块到外部的引脚形状的导体连接到三个主端子板，使得它们是 相互融合。 当整个复合模块被容纳在保护壳体中并且设置有辐射翅片时，将螺栓插入通孔中以将保护壳固定到辐射翅片上。 以这种方式，可以将复合模块容纳在保护壳体中，同时可靠地使绝缘基板的底部与辐射翅片紧密接触。

公开(公告)号：US20160174384A1

公开(公告)日：2016-06-16

申请号：US14568620

申请日：2014-12-12

Applicant: Palo Alto Research Center Incorporated

Inventor： Ping Mei ,  Tse Nga Ng ,  Gregory Whiting

IPC: H05K3/12 ,  H05K1/18 ,  H05K1/09

CPC classification number: H05K3/125 ,  H01L51/0005 ,  H05K1/0287 ,  H05K1/092 ,  H05K1/16 ,  H05K2201/10166

Abstract: A circuit can include a pre-patterned substrate having a supporting material, multiple segments thereon, and interdigitated line structures within each segment. Some of the line structures can be bundled together, and an electrical component can be formed by ink jetting onto the bundled line structures.

Abstract translation: 电路可以包括具有支撑材料的预图案化衬底，其上的多个段和每个段内的交叉线结构。 一些线结构可以捆绑在一起，并且可以通过喷墨到捆束线结构上形成电气部件。

公开(公告)号：US20160150632A1

公开(公告)日：2016-05-26

申请号：US14549934

申请日：2014-11-21

Applicant: FREESCALE SEMICONDUCTOR, INC.

Inventor： LAKSHMINARAYAN VISWANATHAN ,  AUDEL A. SANCHEZ ,  FERNANDO A. SANTOS ,  JERRY L. WHITE

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/28 ,  H05K1/18

CPC classification number: H05K3/284 ,  H01L21/56 ,  H01L23/22 ,  H01L23/28 ,  H01L31/0203 ,  H01L31/048 ,  H01L33/52 ,  H01L2224/04105 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/73227 ,  H01L2224/73267 ,  H01L2224/92164 ,  H01L2224/92244 ,  H05K1/185 ,  H05K3/3421 ,  H05K9/0052 ,  H05K9/0081 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10977 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Abstract translation: 电子设备的实施例包括耦合到衬底的顶表面的电路部件（例如，晶体管或其他部件）。 在衬底和组件上形成封装。 封装中的开口从封装顶表面延伸到元件顶表面上的导电特征。 封装开口内的导电端接结构从导电特征延伸到封装顶表面。 器件还可以包括物理耦合到封装顶表面的第二电路，并且通过导电端接结构电耦合到部件。 在替代实施例中，导电端接结构可以位于封装中的沟槽中，该沟槽在嵌入封装内的两个电路之间延伸，其中导电端接结构被配置为在器件操作期间减小两个电路之间的电磁耦合。

公开(公告)号：US09307630B2

公开(公告)日：2016-04-05

申请号：US13768777

申请日：2013-02-15

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Masayuki Nagamatsu ,  Mayumi Nakasato ,  Yasuyuki Yanase

IPC: H01M10/50 ,  H05K1/02 ,  H05K1/05 ,  H01M2/10 ,  H01M10/653 ,  H01M10/6554 ,  H01M10/617

CPC classification number: H05K1/0203 ,  H01M2/1077 ,  H01M2/1094 ,  H01M10/617 ,  H01M10/653 ,  H01M10/6554 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/0116 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2203/0315

Abstract: A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.

Abstract translation: 装置安装板包括：散热基板，由含有选自Al，Mg和Ti的组的至少一种金属材料的材料形成; 层叠在散热基板上的绝缘树脂层; 以及层叠在绝缘树脂层上的布线层，并且其上将安装功率模块。 散热基板包括布置成使其面向绝缘树脂层并且具有在各个随机方向上延伸的空腔的无规多孔层。

公开(公告)号：US09246073B2

公开(公告)日：2016-01-26

申请号：US13000784

申请日：2009-06-18

Applicant: Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

Inventor： Tatsuo Sasaoka ,  Kaori Toyoda ,  Kentaro Nishiwaki ,  Hiroki Ikeuchi ,  Hiroshi Nasu

IPC: B23K31/02 ,  H01L33/62 ,  B23K35/02 ,  B23K1/00 ,  H01L23/00 ,  H01L33/64 ,  H05K3/32 ,  H01L21/56 ,  H01L31/024 ,  H05K3/40

CPC classification number: H01L33/62 ,  B23K1/0016 ,  B23K35/0244 ,  B23K35/025 ,  H01L21/563 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L31/024 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/29076 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8314 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83207 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/351 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2036 ,  H05K2203/1131 ,  H05K2203/1178 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01014 ,  H01L2224/29298 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00014

Abstract: A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.

Abstract translation: 提供一种安装结构，其可以允许当执行热处理时产生的气体有效地逸出到外部。 安装结构10包括具有电极2a和2b的基板1，具有电极21a和21b的电子部件3，将基板1的电极2a和2b与电子部件的电极21a和21b电连接的接头15a和15b 并且还将电子部件3固定到基板1的表面，以及与基板1的电极2a和电子部件3的电极21a抵接并用作间隔件的凸部4。

公开(公告)号：US20160005721A1

公开(公告)日：2016-01-07

申请号：US14743919

申请日：2015-06-18

Applicant: X-Celeprint Limited

Inventor： Christopher Bower ,  Matthew Meitl ,  David Gomez ,  Salvatore Bonafede ,  David Kneeburg ,  Alin Fecioru ,  Carl Prevatte

IPC: H01L25/16 ,  G02F1/167 ,  H01L33/36 ,  G02B26/04 ,  H01L25/075 ,  H01L33/48

CPC classification number: H01L33/385 ,  F21K9/50 ,  F21V9/08 ,  F21Y2101/025 ,  F21Y2105/003 ,  F21Y2105/10 ,  F21Y2113/13 ,  F21Y2115/10 ,  G02B26/04 ,  G02F1/167 ,  G09G3/22 ,  G09G3/32 ,  G09G2300/0452 ,  G09G2300/0842 ,  G09G2310/0264 ,  H01L23/4821 ,  H01L23/5381 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L33/20 ,  H01L33/36 ,  H01L33/38 ,  H01L33/405 ,  H01L33/48 ,  H01L33/50 ,  H01L33/502 ,  H01L33/508 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/73267 ,  H01L2224/92244 ,  H05B33/089 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/181 ,  H05K1/182 ,  H05K5/0017 ,  H05K2201/0329 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/10166

Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 μm to 50 μm), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.

公开(公告)号：US09210818B2

公开(公告)日：2015-12-08

申请号：US14667185

申请日：2015-03-24

Applicant: IXYS Semiconductor GmbH

Inventor： Olaf Zschieschang ,  Andreas Laschek-Enders

IPC: H05K7/00 ,  H05K5/00 ,  H01L23/373 ,  H01L21/02 ,  H05K1/11 ,  H05K1/18 ,  H05K7/14 ,  H01L23/057 ,  H01L23/31

CPC classification number: H05K5/0069 ,  H01L21/02 ,  H01L23/057 ,  H01L23/3121 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/11 ,  H05K1/181 ,  H05K7/1427 ,  H05K2201/10166 ,  Y10T29/41 ,  H01L2924/00

Abstract: A power semiconductor has power terminals arranged in a row at one side of the housing, with control terminals arranged in a row at the other side of the housing. The spacing between adjacent power terminals is greater than the spacing between adjacent control terminals.

Abstract translation: 功率半导体具有在壳体的一侧排列成行的电源端子，控制端子在壳体的另一侧排列成一排。 相邻电源端子之间的间距大于相邻控制端子间的间距。

公开(公告)号：US20150351223A1

公开(公告)日：2015-12-03

申请号：US14728125

申请日：2015-06-02

Applicant: SUMITOMO BAKELITE CO., LTD.

Inventor： Yoshihide Nii ,  Toshio Komiyatani ,  Yukiharu Yuzuriha

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/05 ,  H05K2201/09745 ,  H05K2201/10166

Abstract: The metal-based mounting board includes: a metal-based circuit board including a metal substrate having a first surface and a second surface, an insulating film provided on the first surface and a metal film provided on the insulating film; and an electronic component provided on the metal film of the metal-based circuit board. Within the metal substrate, a region which overlaps with a collection of a plurality of lines each having an angle of 45° or less with respect to a normal line of the metal-based mounting board, the lines each passing through a surface of the electronic component facing the metal film, is defined as a first region. A region other than the first region is defined as a second region. At least one groove is provided within the first region so as to surround the electronic component in a planar view of the metal-based mounting board.

Abstract translation: 金属基安装板包括：金属基电路板，包括具有第一表面和第二表面的金属基板，设置在第一表面上的绝缘膜和设置在绝缘膜上的金属膜; 以及设置在金属基电路板的金属膜上的电子部件。 在金属基板内，与金属基安装基板的法线相比，重叠于多个相互成45度以下的角度的集合的区域，各条线通过电子表面 面向金属膜的部件被定义为第一区域。 除了第一区域之外的区域被定义为第二区域。 在第一区域内设置至少一个凹槽，以便在金属基安装板的平面视图中围绕电子部件。

公开(公告)号：US09192049B2

公开(公告)日：2015-11-17

申请号：US14536791

申请日：2014-11-10

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Tatsuaki Denda ,  Kazutaka Kobayashi

IPC: H01L23/34 ,  H01L23/48 ,  H01L33/64 ,  H05K1/18 ,  H05K1/02 ,  H05K1/11 ,  H01L23/498 ,  H01L23/00 ,  H01L23/367 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62

CPC classification number: H05K1/181 ,  H01L23/3677 ,  H01L23/49827 ,  H01L24/04 ,  H01L24/26 ,  H01L24/47 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0206 ,  H05K1/021 ,  H05K1/115 ,  H05K2201/0154 ,  H05K2201/066 ,  H05K2201/10106 ,  H05K2201/10166 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A wiring substrate for a semiconductor device includes a heat spreader; a polyimide layer provided with through holes and provided on the heat spreader via an adhesion layer; through wirings formed to fill the through holes of the polyimide layer; a thermal diffusion wiring provided on the polyimide layer and is configured not to be electrically connected to the semiconductor device; an electrical connection wiring provided on the polyimide layer at a same plane with the thermal diffusion wiring and is configured to be electrically connected to the semiconductor device; and an insulating layer provided on the polyimide layer with a first open portion and a second open portion that expose the electrical connection wiring and the thermal diffusion wiring, respectively, the thermal diffusion wiring being formed to extend at an outer side of the second open portion and have a larger area than the electrical connection wiring.

Abstract translation: 一种半导体装置用配线基板，具备散热器， 聚酰亚胺层，设置有通孔，并通过粘合层设置在散热器上; 通过形成以填充聚酰亚胺层的通孔的布线; 设置在所述聚酰亚胺层上并且被配置为不与所述半导体器件电连接的热扩散布线; 在与所述热扩散配线相同的平面上设置在所述聚酰亚胺层上并且被配置为电连接到所述半导体器件的电连接线; 以及绝缘层，设置在所述聚酰亚胺层上，所述绝缘层具有分别暴露所述电连接布线和所述热扩散布线的第一开口部分和第二开口部分，所述热扩散布线分别形成为在所述第二开口部分的外侧延伸 并且具有比电连接布线更大的面积。

公开(公告)号：US09185803B2

公开(公告)日：2015-11-10

申请号：US14122026

申请日：2012-05-22

Applicant: Roland Brey ,  Andreas Bernhardt

Inventor： Roland Brey ,  Andreas Bernhardt

IPC: H05K1/18 ,  H05K1/02 ,  H01L23/538 ,  H05K3/20 ,  B60L3/00 ,  B60L11/00 ,  B60L11/14 ,  H05K3/46

CPC classification number: H05K1/18 ,  B60L3/0084 ,  B60L11/005 ,  B60L11/14 ,  B60L2240/36 ,  H01L23/5389 ,  H01L2224/32245 ,  H01L2924/13091 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/185 ,  H05K3/202 ,  H05K3/4641 ,  H05K3/4691 ,  H05K2201/10166 ,  H05K2201/10272 ,  Y02T10/70 ,  Y02T10/7022 ,  Y02T10/7077

Abstract: A circuit board for electric components has at least one current conductor, which is configured as a molded part, and at least one unhoused electric component affixed to the current conductor. The circuit board exhibits improved operating reliability.

Abstract translation: 用于电气部件的电路板具有至少一个电流导体，其被配置为模制部件，并且至少一个未安置的电气部件固定到电流导体。 电路板表现出更好的运行可靠性。