摘要:
The present invention provides a thermoelectric conversion element, a thermoelectric conversion element module, and a method of manufacturing the same that can easily realize high-density arrangement of thermoelectric conversion elements and securement of connection reliability. The thermoelectric conversion element has, for example, rod-shaped thermoelectric conversion material, tube that has an insulation property and an adiabatic property and houses thermoelectric conversion material, and electrodes that are in close adhesion to the end surfaces of thermoelectric conversion material and tube. A surface roughness Ra of the end surfaces is larger than 0.8 micrometers. In the present invention, the thermoelectric conversion elements can be arranged at a high density such that tubes are in close adhesion to each other. Also, since the close adhesion surface of electrodes on the end surfaces is large, the connection reliability of electrodes is further improved.
摘要:
The invention provides a thermoelectric conversion module, which can implement a high power generation capacity and high reliability of electric connection between thermoelectric conversion elements and meet various diameters and lengths of a tube as a heat source. The thermoelectric conversion module includes a straight-chain module unit. In the module unit, plural P-type elements and plural N-type elements, which are alternately arrayed, are electrically connected in series by a braided wire A and a braided wire B. The braided wire A connects one end surface of the P-type element and one end surface of the N-type element. The braided wire B connects the other end surface of the P-type element and the other end surface of the N-type element. The braided wire B is shorter than the braided wire A. The thermoelectric conversion module including only the module unit is spirally wound around a tube as a heat source.
摘要:
The invention provides a thermoelectric conversion element having a lot of pn junction pairs per unit area and having a thermoelectric material chip which is hardly broken, and a producing method thereof. In the thermoelectric conversion element of the invention, plural substrates in each of which a film-shaped thermoelectric material is formed in a surface thereof are disposed. As a result, because the number of pn junction pairs per unit area is increased, a high output can be obtained. Because the thermoelectric material is formed into the film shape, reliability degradation caused by a breakage of the thermoelectric material can be prevented, even in the thermoelectric material having many pn junction pairs per unit area, namely, a sectional area is small.
摘要:
The invention provides a thermoelectric conversion module, which can implement a high power generation capacity and high reliability of electric connection between thermoelectric conversion elements and meet various diameters and lengths of a tube as a heat source. The thermoelectric conversion module includes a straight-chain module unit. In the module unit, plural P-type elements and plural N-type elements, which are alternately arrayed, are electrically connected in series by a braided wire A and a braided wire B. The braided wire A connects one end surface of the P-type element and one end surface of the N-type element. The braided wire B connects the other end surface of the P-type element and the other end surface of the N-type element. The braided wire B is shorter than the braided wire A. The thermoelectric conversion module including only the module unit is spirally wound around a tube as a heat source.
摘要:
A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.
摘要:
The present invention relates to an apparatus and a method for manufacturing a thermoelectric conversion element. The present invention provides an apparatus for manufacturing a thermoelectric conversion element that can easily realize a high-density array of thermoelectric conversion elements and secure connection reliability. This is an apparatus for manufacturing a thermoelectric conversion element that sucks a p-type or n-type thermoelectric conversion material into heat-resisting insulating tube 102 and includes preheating apparatus 205 that can heat tube 102 to a predetermined temperature before sucking the melted thermoelectric conversion element. Tube 102 whose temperature condition is adjusted by being heated by preheating apparatus 205 is inserted into crucible 204 and the molten thermoelectric conversion material is sucked into tube 102 by decompression apparatus 201.
摘要:
When bump electrodes 26 of a semiconductor light emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light emitting element 2 to emit light, the optical properties of the semiconductor light emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light emitting element.
摘要:
A mounting structure is provided that can allow gaseous matter generated when performing a heat treatment to escape to outside efficiently. A mounting structure 10 includes a substrate 1 having electrodes 2a and 2b, an electronic component 3 having electrodes 21a and 21b, joints 15a and 15b that electrically connect the electrodes 2a and 2b of the substrate 1 and the electrodes 21a and 21b of the electronic component 3 and also fix the electronic component 3 to the surface of the substrate 1, and a convex portion 4 that abuts against the electrode 2a of the substrate 1 and the electrode 21a of the electronic component 3 and is used as a spacer.
摘要:
The present invention relates to an apparatus and a method for manufacturing a thermoelectric conversion element. The present invention provides an apparatus for manufacturing a thermoelectric conversion element that can easily realize a high-density array of thermoelectric conversion elements and secure connection reliability. This is an apparatus for manufacturing a thermoelectric conversion element that sucks a p-type or n-type thermoelectric conversion material into heat-resisting insulating tube 102 and includes preheating apparatus 205 that can heat tube 102 to a predetermined temperature before sucking the melted thermoelectric conversion element. Tube 102 whose temperature condition is adjusted by being heated by preheating apparatus 205 is inserted into crucible 204 and the molten thermoelectric conversion material is sucked into tube 102 by decompression apparatus 201.
摘要:
When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light-emitting element 2 to emit light, the optical properties of the semiconductor light-emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light-emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.