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    Thermoelectric device, a thermoelectric module comprising such a thermoelectric device and a method for producing such a thermoelectric device
    3.
    发明授权
    Thermoelectric device, a thermoelectric module comprising such a thermoelectric device and a method for producing such a thermoelectric device 有权

    公开(公告)号：US10062823B2

    公开(公告)日：2018-08-28

    申请号：US14734387

    申请日：2015-06-09

    申请人： Valeo Systemes Thermiques ,  Michel Simonin

    发明人： Michel Simonin ,  Cedric De Vaulx

    IPC分类号： H01L35/32 ,  H01L35/04

    CPC分类号： H01L35/04 ,  H01L35/32

    摘要： The invention relates to a thermoelectric device comprising at least two thermoelectric elements (10, 20), called first (10) and second (20) elements, capable of generating an electric current under the effect of a temperature gradient applied between two of their faces, called first and second active faces, the first active faces being intended to exchange heat with a heat source of the temperature gradient, and the second active faces being intended to exchange heat with a cold source of the temperature gradient, said device comprising a first electrical connector (31) connecting the two elements (10, 20), said first connector (31) covering a first part (11, 21) of each first and, respectively, each second active face of said first (10) and second (20) elements, a second part (13, 23) of said first and, respectively, second active faces being left free. The invention further relates to a thermoelectric module comprising such a device and to a method for producing such a device.

    Method for producing thermoelectric components by powder metallurgy
    7.
    发明授权
    Method for producing thermoelectric components by powder metallurgy 有权
    粉末冶金法生产热电元件的方法

    公开(公告)号：US09553249B2

    公开(公告)日：2017-01-24

    申请号：US15025162

    申请日：2014-08-14

    申请人： Evonik Degussa GmbH

    发明人： Jens Busse ,  Sascha Hoch ,  Magdalena Kern ,  Mareike Giesseler ,  Thorsten Schultz ,  Patrik Stenner ,  Paw V. Mortensen ,  Ali Asghar Enkeshafi

    IPC分类号： H01L35/34 ,  H01L35/16 ,  H01L35/04 ,  H01L35/08 ,  H01L35/12

    CPC分类号： H01L35/34 ,  H01L35/04 ,  H01L35/08 ,  H01L35/12 ,  H01L35/16

    摘要： The invention relates to a method for producing a thermoelectric component or at least one semi-finished product of same, in which a multiplicity of thermolegs made of a thermoelectrically active material are introduced into an essentially planar substrate made of an electrically and thermally insulating substrate material such that the thermolegs extend through the substrate essentially perpendicular to the substrate plane, and in which the active material is provided in pulverulent form, is pressed to give green bodies and is then sintered within the substrate to give thermolegs. It is based on the object of refining the method of the generic type mentioned in the introduction so as to increase the freedom of choice of the thermally and electrically insulating substrate material. The object is achieved in that the pulverulent active material is pressed, in a mould arranged outside the substrate, to give green bodies, the green bodies are pushed out of the mould and into holes provided in the substrate, where they are sintered to give thermolegs.

    摘要翻译： 本发明涉及一种用于制造热电组件或其至少一种半成品的方法，其中将由热电活性材料制成的多个热固性材料引入由电绝热基板材料制成的基本平面的基板中 使得热电极基本上垂直于衬底平面延伸穿过衬底，并且其中以粉末形式提供活性材料，被压制以产生生坯体，然后在衬底内烧结以产生热电极。 基于在引言中提到的通用类型的方法的目的是为了增加热和电绝缘基板材料的选择的自由度。 其目的在于，将粉末状活性物质压制在配置在基板的外侧的模具内，形成生坯体，将生坯从模具中推出并设置在基板内的孔中，在其中进行烧结，得到热固体 。

    CMOS compatible thermopile with low impedance contact
    9.
    发明授权
    CMOS compatible thermopile with low impedance contact 有权
    CMOS兼容热电堆，具有低阻抗接触

    公开(公告)号：US09437652B2

    公开(公告)日：2016-09-06

    申请号：US14292281

    申请日：2014-05-30

    申请人： Texas Instruments Incorporated

    发明人： Jeffrey R. Debord ,  Henry Litzmann Edwards ,  Kenneth J. Maggio

    IPC分类号： H01L27/16 ,  H01L35/04 ,  H01L21/768 ,  H01L27/06 ,  H01L27/092 ,  H01L21/8238

    CPC分类号： H01L27/16 ,  H01L21/76816 ,  H01L21/76843 ,  H01L21/76847 ,  H01L21/76879 ,  H01L21/823878 ,  H01L23/485 ,  H01L23/5226 ,  H01L27/0617 ,  H01L27/092 ,  H01L35/04 ,  H01L35/30 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An integrated circuit containing CMOS transistors and an embedded thermoelectric device may be formed by forming active areas which provide transistor active areas for an NMOS transistor and a PMOS transistor of the CMOS transistors and provide n-type thermoelectric elements and p-type thermoelectric elements of the embedded thermoelectric device. Stretch contacts with lateral aspect ratios greater than 4:1 are formed over the n-type thermoelectric elements and p-type thermoelectric elements to provide electrical and thermal connections through metal interconnects to a thermal node of the embedded thermoelectric device. The stretch contacts are formed by forming contact trenches in a dielectric layer, filling the contact trenches with contact metal and subsequently removing the contact metal from over the dielectric layer. The stretch contacts are formed concurrently with contacts to the NMOS and PMOS transistors.

    摘要翻译： 可以通过形成有源区域来形成包含CMOS晶体管和嵌入式热电装置的集成电路，该有源区域为CMOS晶体管的NMOS晶体管和PMOS晶体管提供晶体管有源区，并提供n型热电元件和p型热电元件 嵌入式热电装置。 在n型热电元件和p型热电元件上形成横截面比大于4:1的拉伸接触，以通过金属互连提供到嵌入式热电器件的热节点的电连接和热连接。 拉伸接触通过在电介质层中形成接触沟槽，用接触金属填充接触沟槽并随后从电介质层上方去除接触金属而形成。 拉伸触点与NMOS和PMOS晶体管的触点同时形成。

    METHOD FOR PRODUCING THERMOELECTRIC COMPONENTS BY POWDER METALLURGY
    10.
    发明申请
    METHOD FOR PRODUCING THERMOELECTRIC COMPONENTS BY POWDER METALLURGY 有权
    通过粉末冶金制造热电组件的方法

    公开(公告)号：US20160240763A1

    公开(公告)日：2016-08-18

    申请号：US15025162

    申请日：2014-08-14

    申请人： Jens BUSSE ,  Sascha Hoch ,  Magalena KERN ,  Mareike GIESSELLER ,  Thorsten SCHULTZ ,  Patrik STENNER ,  Paw V. MORTENSEN ,  Ali Asghar ENKESHAFI ,  EVONIK DEGUSSA GMBH

    发明人： Jens Busse ,  Sascha Hoch ,  Magdalena Gellner ,  Mareike Giesseler ,  Thorsten Schultz ,  Patrik Steneer ,  Paw V. Mortensen ,  Ali Asghar Enkeshafi

    IPC分类号： H01L35/34

    CPC分类号： H01L35/34 ,  H01L35/04 ,  H01L35/08 ,  H01L35/12 ,  H01L35/16

    摘要： The invention relates to a method for producing a thermoelectric component or at least one semi-finished product of same, in which a multiplicity of thermolegs made of a thermoelectrically active active material are introduced into an essentially planar substrate made of an electrically and thermally insulating substrate material such that the thermolegs extend through the substrate essentially perpendicular to the substrate plane, and in which the active material is provided in pulverulent form, is pressed to give green bodies and is then sintered within the substrate to give thermolegs. It is based on the object of refining the method of the generic type mentioned in the introduction so as to increase the freedom of choice of the thermally and electrically insulating substrate material. The object is achieved in that the pulverulent active material is pressed, in a mould arranged outside the substrate, to give green bodies, the green bodies are pushed out of the mould and into holes provided in the substrate, where they are sintered to give thermolegs.

    摘要翻译： 本发明涉及一种用于制造热电组件或其至少一种半成品的方法，其中将由热活性活性材料制成的多个热固性材料引入基本平坦的由绝热基板 材料，使得热电极基本上垂直于衬底平面延伸穿过衬底，并且其中以粉末形式提供活性材料，被压制以产生生坯，然后在衬底内烧结以产生热电极。 基于在引言中提到的通用类型的方法的目的是为了增加热和电绝缘基板材料的选择的自由度。 其目的在于，将粉末状活性物质压制在配置在基板的外侧的模具内，形成生坯体，将生坯从模具中推出并设置在基板内的孔中，在其中进行烧结，得到热固体 。