公开(公告)号：US20140080231A1

公开(公告)日：2014-03-20

申请号：US14117656

申请日：2012-03-21

申请人： Hiroki Ikeuchi ,  Tomonori Itoh

发明人： Hiroki Ikeuchi ,  Tomonori Itoh

IPC分类号： H01L21/66 ,  H01L33/50

CPC分类号： H01L22/12 ,  H01L33/10 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05B33/10 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of white-light emitting elements that is one example of the present invention is a manufacturing method of a white-light emitting element with the light emitting diode chip covered with the fluorescent-body-containing resin member that has been formed with the fluorescent-body-containing resin material containing a resin and fluorescent bodies, and includes: an irradiating step of irradiating the fluorescent-body-containing resin material with the blue laser beam; a measuring step of measuring the fluorescence strength of the fluorescence light emission from the fluorescent bodies that have been excited by the blue laser beam with which the irradiation has been carried out; and an applying step of applying, to the light emitting diode chip, a quantity of the fluorescent-body-containing resin material, the quantity being based on the fluorescence strength that has been measured.

摘要翻译： 作为本发明的一个例子的白色发光元件的制造方法是白色发光元件的制造方法，其中发光二极管芯片被包含荧光体的树脂构件覆盖，所述荧光体的树脂构件已经形成有 含有树脂和荧光体的含荧光体的树脂材料，包括：用蓝色激光束照射含荧光体的树脂材料的照射步骤; 测量从已经进行了照射的蓝色激光束激发的荧光体的荧光发光的荧光强度的测量步骤; 以及施加步骤，向所述发光二极管芯片施加一定量的含荧光体的树脂材料，所述量基于所测量的荧光强度。

公开(公告)号：US08525217B2

公开(公告)日：2013-09-03

申请号：US13593104

申请日：2012-08-23

申请人： Kentaro Nishiwaki ,  Tomonori Itoh ,  Masaru Nonomura

发明人： Kentaro Nishiwaki ,  Tomonori Itoh ,  Masaru Nonomura

IPC分类号： H01L33/00 ,  H01L27/14 ,  H01L31/0232 ,  H01L21/00

CPC分类号： H01L33/0095 ,  H01L24/27 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

摘要翻译： 用于树脂涂覆的装置用于制造包括用含有荧光体的树脂覆盖的LED元件的LED封装。 在通过夹持单元63定位试验涂层材料43的状态下，用激发光照射施加到试验涂层材料43上的树脂的试验涂层，并且通过发射来测量从包含在树脂中的荧光体发射的光 确定发光特性测量单元的测量结果与规定的发射特性的偏差，然后根据偏差导出适用于LED元件的适量的树脂用于实际生产。

公开(公告)号：US20130052761A1

公开(公告)日：2013-02-28

申请号：US13593104

申请日：2012-08-23

申请人： Kentaro NISHIWAKI ,  Tomonori ITOH ,  Masaru NONOMURA

发明人： Kentaro NISHIWAKI ,  Tomonori ITOH ,  Masaru NONOMURA

IPC分类号： H01L33/52 ,  B05C11/00

CPC分类号： H01L33/0095 ,  H01L24/27 ,  H01L24/743 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/92247 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A device for resin coating is used for producing an LED package including an LED element covered with resin containing phosphor. In a state in which a trial coating material 43 is located by a clamp unit 63, a trial coating of resin applied to the trial coating material 43 is irradiated with excitation light and light emitted from the phosphor contained in the resin is measured by an emission characteristic measuring unit 39. A deviation of the measurement result of the emission characteristic measuring unit from a prescribed emission characteristic is determined, and then a proper amount of resin to be applied to the LED element is derived for actual production based on the deviation.

摘要翻译： 用于树脂涂覆的装置用于制造包括用含有荧光体的树脂覆盖的LED元件的LED封装。 在通过夹持单元63定位试验涂层材料43的状态下，用激发光照射施加到试验涂层材料43上的树脂的试验涂层，并且通过发射来测量从包含在树脂中的荧光体发射的光 确定发光特性测量单元的测量结果与规定的发射特性的偏差，然后根据偏差导出适用于LED元件的适量的树脂用于实际生产。

公开(公告)号：US20120070917A1

公开(公告)日：2012-03-22

申请号：US13321163

申请日：2011-04-26

申请人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

发明人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

IPC分类号： H01L21/66 ,  B23P19/00

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/753 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75801 ,  H01L2224/75821 ,  H01L2224/759 ,  H01L2224/7592 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2933/0033 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

摘要： When bump electrodes 26 of a semiconductor light emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light emitting element 2 to emit light, the optical properties of the semiconductor light emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light emitting element.

摘要翻译： 当半导体发光元件2的凸块电极26和安装板3的电极部分21彼此接合时，向安装板3的电极部分21供电，以使半导体发光元件2发光 检测出具有发光的半导体发光元件2的光学性质，并且对光学特性的检测值进行处理，以获得半导体发光元件2的凸块电极26和电极部分21的接合状态 安装板3，从而确定接合的完成。 因此，半导体发光元件可以通过形成在半导体发光元件上的金属电极令人满意地接合到安装板上的电极部分。

公开(公告)号：US20050036057A1

公开(公告)日：2005-02-17

申请号：US10898522

申请日：2004-07-23

申请人： Kazuya Ushirokawa ,  Isamu Aokura ,  Koujirou Nakamura ,  Hidenobu Nishikawa ,  Tomonori Itoh

发明人： Kazuya Ushirokawa ,  Isamu Aokura ,  Koujirou Nakamura ,  Hidenobu Nishikawa ,  Tomonori Itoh

IPC分类号： H04N5/225

CPC分类号： H04N5/2254

摘要： The present invention of a manufacturing method and a apparatus for manufacturing an image pickup device integrated with lens in which a lens holding part having an optical lens is automatically adjusted with respect to a package on which an imaging chip is mounted so that an optical image from an optical axis adjusting pattern is formed on the image plane of the imaging chip and the lens holding part and the package are fixed to each other with an adhesive used therebetween as a position adjusting member at the adjusted position, and an image pickup device integrated with lens thus manufactured having excellent properties.

摘要翻译： 本发明的一种制造方法和用于制造与透镜一体化的图像拾取装置的装置，其中具有光学透镜的透镜保持部分相对于其上安装有成像芯片的封装被自动调整，使得来自 在成像芯片的图像平面上形成光轴调整图案，并且透镜保持部分和包装件之间用粘合剂彼此固定，作为调节位置处的位置调整部件，并且将图像拾取装置与 由此制造的具有优异性能的透镜。

公开(公告)号：US08893377B2

公开(公告)日：2014-11-25

申请号：US13321163

申请日：2011-04-26

申请人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

发明人： Tomonori Itoh ,  Kaori Toyoda ,  Hiroki Ikeuchi ,  Takeshi Kawabata

IPC分类号： H01L21/67 ,  H01L23/00

CPC分类号： H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/753 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/75801 ,  H01L2224/75821 ,  H01L2224/759 ,  H01L2224/7592 ,  H01L2224/81191 ,  H01L2224/81201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01033 ,  H01L2924/01055 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2933/0033 ,  Y10T29/4913 ,  Y10T29/53039 ,  Y10T29/53174 ,  Y10T29/53178

摘要： When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the mounting board 3 to allow the semiconductor light-emitting element 2 to emit light, the optical properties of the semiconductor light-emitting element 2 having emitted light are detected, and the detected value of optical properties is processed to obtain the joining state of the bump electrodes 26 of the semiconductor light-emitting element 2 and the electrode portions 21 of the mounting board 3, so that the completion of joining is determined. Thus, the semiconductor light-emitting element can be satisfactorily joined to the electrode portions on the mounting board via the metal electrodes formed on the semiconductor light-emitting element.

摘要翻译： 半导体发光元件2的凸块电极26和安装基板3的电极部21彼此接合时，向安装基板3的电极部21供电，使半导体发光元件2 发光，检测出具有发光的半导体发光元件2的光学特性，并且对光学特性的检测值进行处理，以获得半导体发光元件2的凸块电极26和电极的接合状态 安装板3的部分21，从而确定接合的完成。 因此，半导体发光元件可以通过形成在半导体发光元件上的金属电极令人满意地接合到安装板上的电极部分。

公开(公告)号：US4657475A

公开(公告)日：1987-04-14

申请号：US775832

申请日：1985-09-13

申请人： Masaru Ohtsuji ,  Tomonori Itoh ,  Takashi Honda ,  Shinobu Ando ,  Kazumi Matsui

发明人： Masaru Ohtsuji ,  Tomonori Itoh ,  Takashi Honda ,  Shinobu Ando ,  Kazumi Matsui

IPC分类号： A63B45/00 ,  A63B45/02 ,  B25J9/04

CPC分类号： A63B45/00 ,  A63B45/02

摘要： A method for positioning seamed balls each having an endless curved seam line, comprising steps of: supporting each ball to locate its center at an origin of a three-dimensional orthogonal coordinate consisting of two horizontal axes X, Y and one vertical axis Z; rotating the ball on at least one of the axes X, Y until an optical sensor disposed on the axis Z specifies such a particular locus that intersects the seam line at four points during one full rotation of the ball to provide four arcs along the locus; finding the shortest arc among the four and locating its mid point on the axis Z by rotating the ball on the axis X; rotating the ball on the axis Y so that an intersection of a bisector and a part of the seam line is located on the axis Z; and rotating the ball on the axis Y until a hip center of the ball is located on the axis Z.

摘要翻译： 一种用于定位每个具有无缝弯曲接缝线的接缝球的方法，包括以下步骤：支撑每个球以将其中心定位在由两个水平轴线X，Y和一个垂直轴线Z组成的三维正交坐标的原点; 在至少一个轴X，Y上旋转球，直到设置在轴线Z上的光学传感器指定在球的一次完全旋转期间在四点处与接缝线相交的特定轨迹，以沿着轨迹提供四个弧; 通过在X轴上旋转球，找到四个中最短的弧，并将其中点定位在轴Z上; 使球在轴线Y上旋转，使得平分线和接缝线的一部分的交点位于轴线Z上; 并且在轴线Y上旋转球，直到球的髋部中心位于轴线Z上。

公开(公告)号：US09219014B2

公开(公告)日：2015-12-22

申请号：US14117656

申请日：2012-03-21

申请人： Hiroki Ikeuchi ,  Tomonori Itoh

发明人： Hiroki Ikeuchi ,  Tomonori Itoh

IPC分类号： H01L21/66 ,  H01L33/10 ,  H01L33/50

CPC分类号： H01L22/12 ,  H01L33/10 ,  H01L33/502 ,  H01L33/505 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2933/0041 ,  H05B33/10 ,  H01L2924/00014 ,  H01L2924/00

摘要： A manufacturing method of white-light emitting elements that is one example of the present invention is a manufacturing method of a white-light emitting element with the light emitting diode chip covered with the fluorescent-body-containing resin member that has been formed with the fluorescent-body-containing resin material containing a resin and fluorescent bodies, and includes: an irradiating step of irradiating the fluorescent-body-containing resin material with the blue laser beam; a measuring step of measuring the fluorescence strength of the fluorescence light emission from the fluorescent bodies that have been excited by the blue laser beam with which the irradiation has been carried out; and an applying step of applying, to the light emitting diode chip, a quantity of the fluorescent-body-containing resin material, the quantity being based on the fluorescence strength that has been measured.

摘要翻译： 作为本发明的一个例子的白色发光元件的制造方法是白色发光元件的制造方法，其中发光二极管芯片被包含荧光体的树脂构件覆盖，所述荧光体的树脂构件已经形成有 含有树脂和荧光体的含荧光体的树脂材料，包括：用蓝色激光束照射含荧光体的树脂材料的照射步骤; 测量从已经进行了照射的蓝色激光束激发的荧光体的荧光发光的荧光强度的测量步骤; 以及施加步骤，向所述发光二极管芯片施加一定量的含荧光体的树脂材料，所述量基于所测量的荧光强度。