公开(公告)号：US20140332252A1

公开(公告)日：2014-11-13

申请号：US13965194

申请日：2013-08-13

Applicant: Unimicron Technology Corp.

Inventor： Chun-Ting Lin

IPC: H05K1/11 ,  H05K3/40

CPC classification number: H05K3/40 ,  H01L21/67265 ,  H01L21/673 ,  H01L21/67346 ,  H01L21/67763 ,  H01L21/6779 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/12042 ,  H05K1/11 ,  H05K3/06 ,  H05K3/4007 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0979 ,  H05K2203/0369 ,  H05K2203/0376 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/00

Abstract: A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers. The circuit structure layer is disposed on the insulation layer and includes at least one dielectric layer, at least two circuit layers and first conductive vias. Each of the second conductive towers correspondingly connects to at least two of the first conductive vias, and each of the first conductive towers correspondingly connects to one of the first conductive vias. An interface exists between the first conductive vias and the first and the second conductive towers.

Abstract translation: 载体基板包括绝缘层，导电塔和电路结构层。 每个导电塔的直径从顶表面逐渐增加到底表面，并且导电塔包括第一导电塔和围绕第一导电塔的第二导电塔。 电路结构层设置在绝缘层上，并且包括至少一个电介质层，至少两个电路层和第一导电通孔。 每个第二导电塔对应地连接到第一导电通孔中的至少两个，并且每个第一导电塔对应地连接到第一导电通孔之一。 在第一导电通孔和第一和第二导电塔之间存在界面。

公开(公告)号：US08870512B2

公开(公告)日：2014-10-28

申请号：US12257376

申请日：2008-10-23

Applicant: Michael Robert Rice ,  Jeffrey C. Hudgens

Inventor： Michael Robert Rice ,  Jeffrey C. Hudgens

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67763 ,  B65D85/70 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67775 ,  Y10S414/137

Abstract: An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.

Abstract translation: 公开了一种电子设备制造系统。 该系统包括具有一个或多个处理室的处理工具，每个处理室适于在一个或多个基板上执行电子设备制造过程; 衬底载体，其适于耦合到所述系统并携带一个或多个衬底; 以及适于相对于所述衬底载体的至少一部分产生密封环境并且基本上使所述密封环境与所述衬底载体内的环境相等的部件。 本发明的方法被描述为许多其它方面。

公开(公告)号：US20140154842A1

公开(公告)日：2014-06-05

申请号：US14174988

申请日：2014-02-07

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chiang-Cheng Chang ,  Meng-Tsung Lee ,  Jung-Pang Huang ,  Shih-Kuang Chiu

IPC: H01L21/56 ,  H01L21/78 ,  H01L21/673 ,  H01L21/768

CPC classification number: H01L21/56 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/673 ,  H01L21/67333 ,  H01L21/67763 ,  H01L21/68 ,  H01L21/683 ,  H01L21/76877 ,  H01L21/78 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L24/05 ,  H01L24/13 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/02379 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/1815 ,  H01L2224/11 ,  H01L2224/03 ,  H01L2924/014

Abstract: A fabrication method of a semiconductor package includes the steps of: providing a carrier having a concave portion and a releasing layer formed on a surface thereof; disposing a chip on the releasing layer in the concave portion; forming an encapsulant on the chip and the releasing layer; removing the releasing layer and the carrier; and forming a circuit structure on the encapsulant and the chip. The design of the concave portion facilitates alignment of the chip to prevent it from displacement, thereby improving the product reliability. A semiconductor package fabricated by the fabrication method is also provided.

Abstract translation: 半导体封装的制造方法包括以下步骤：提供在其表面上形成有凹部和释放层的载体; 在凹部中的脱模层上设置芯片; 在芯片和释放层上形成密封剂; 去除释放层和载体; 并在密封剂和芯片上形成电路结构。 凹部的设计有助于芯片对准以防止其移位，从而提高产品的可靠性。 还提供了通过制造方法制造的半导体封装。

公开(公告)号：US20130220959A1

公开(公告)日：2013-08-29

申请号：US13731517

申请日：2012-12-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yu-dong WON ,  Jong-in LEE ,  Min-gu CHANG ,  Seung-jun LEE

IPC: B66C19/00 ,  B66C13/18 ,  H01L21/677

CPC classification number: B66C19/00 ,  B66C1/28 ,  B66C13/18 ,  H01L21/6773 ,  H01L21/67733 ,  H01L21/67763 ,  H01L21/68707

Abstract: A hoist apparatus including a traveling unit that travels from one place to another, an elevating unit installed in the traveling unit to be lifted up and lowered down from the traveling unit, a grip device which is installed in the elevating unit and selectively grips a stumbling projection formed at one side of an accommodating container accommodating an object, and a separation preventing apparatus which is connected to the elevating unit and selectively closes an open inlet of the accommodating container so that the object accommodated in the accommodating container is not separated from the accommodating container.

Abstract translation: 一种提升装置，包括从一个地方行进到另一个地方的行进单元，安装在行进单元中的升降单元，以便从行进单元升起和降下;一个夹紧装置，安装在提升单元中，并选择性地夹住绊脚石 形成在容纳物体的容纳容器的一侧的突起，以及分离防止装置，其与升降单元连接并选择性地封闭容纳容器的开放入口，使得容纳在容纳容器中的物体不与容纳物分离 容器。

公开(公告)号：US20110005967A1

公开(公告)日：2011-01-13

申请号：US12812729

申请日：2009-01-13

Applicant: Barry Gregerson ,  Michael Shawn Adams ,  Jason Todd Steffens

Inventor： Barry Gregerson ,  Michael Shawn Adams ,  Jason Todd Steffens

IPC: H01L21/673

CPC classification number: B65D25/103 ,  B65D25/28 ,  B65D43/02 ,  B65D85/70 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67763

Abstract: A front opening semiconductor wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract translation: 用于大直径晶片的前开口半导体晶片容器包括容器部分和门。 容器部分包括左封闭侧，右封闭侧，闭合背部，开放前部和包括用于接收和容纳晶片的多个狭槽的开放内部。 门可附接到容器部分以封闭敞开的前部，并可选择性地闩锁到容器部分。 容器部分包括用于容纳大直径晶片的装置，特别是450mm的晶片。 提供优化的下垂控制以及增强的结构刚度和晶片座位功能。

公开(公告)号：US07784606B2

公开(公告)日：2010-08-31

申请号：US12331395

申请日：2008-12-09

Applicant: Anthony C. Bonora ,  Michael Krolak ,  Roger G. Hine

Inventor： Anthony C. Bonora ,  Michael Krolak ,  Roger G. Hine

IPC: B65G15/00

CPC classification number: H01L21/67763 ,  B65G15/12 ,  B65G43/10 ,  B65G47/268 ,  B65G2201/0297 ,  H01L21/67706 ,  H01L21/6773

Abstract: A conveyor and conveyor system is defined for moving a container used to hold semiconductor wafers. The conveyor includes a first belt having a first support surface for movably supporting the container and a second belt having a second support surface for movably supporting the container. The first belt and the second belt each have a raised guide. The conveyor further includes a drive assembly for moving at least the first belt and causing the container to move over the first and second belts when placed on the first and second support surfaces. Methods for making the conveyor and operating the conveyor are also defined herein.

Abstract translation: 输送机和输送机系统被定义为用于移动用于保持半导体晶片的容器。 所述输送机包括具有用于可移动地支撑所述容器的第一支撑表面的第一带和具有用于可移动地支撑所述容器的第二支撑表面的第二带。 第一带和第二带每个都具有升高的引导件。 输送机还包括用于移动至少第一带的驱动组件，并且当放置在第一和第二支撑表面上时使容器移动到第一和第二带上。 制造输送机和操作输送机的方法也在本文中定义。

公开(公告)号：US07659966B2

公开(公告)日：2010-02-09

申请号：US11366580

申请日：2006-03-03

Applicant: Ken Matsumoto

Inventor： Ken Matsumoto

IPC: G03B27/62

CPC classification number: H01L21/67353 ,  G03F1/66 ,  G03F7/70741 ,  G03F7/7075 ,  G03F7/70916 ,  H01L21/67763 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/6831

Abstract: An exposure apparatus for performing exposure of a substrate to light via a reticle. The apparatus includes a first stage configured to hold a chuck. The chuck has a support base with an electrode, and forms a container, for one of the substrate and the reticle, together with a cover. The container electrostatically chucks the one on the support base by the electrode. A transporter transports the container in which the one is contained, and loads the chuck, which chucks the one, on the first stage without the cover. A second stage holds the other of the substrate and the reticle. The apparatus obtains a first positional shift amount between the chuck and the one chucked on the chuck before the transportation by the transporter, to measure a second positional shift amount between a reference mark on the chuck held by the first stage and a reference mark on the second stage, and corrects positions of the first and second stages based on the first and second positional shift amounts, to perform the exposure.

Abstract translation: 一种用于通过掩模版进行基板曝光的曝光装置。 该装置包括构造成保持卡盘的第一级。 卡盘具有带电极的支撑基座，并与盖子一起形成用于基板和掩模版之一的容器。 容器通过电极静电将卡在支撑基座上。 运输机运送容纳在其中的容器，并且在没有盖子的情况下将夹住该卡盘的卡盘装载在第一台上。 第二阶段保持基板和掩模版中的另一个。 该装置在运送器运送之前获得卡盘与夹在卡盘上的卡盘之间的第一位置偏移量，以测量由第一级保持的卡盘上的基准标记与第一级保持的基准标记之间的第二位置偏移量 并且基于第一和第二位置偏移量来校正第一和第二阶段的位置，以执行曝光。

公开(公告)号：US20080038097A1

公开(公告)日：2008-02-14

申请号：US11776953

申请日：2007-07-12

Applicant: Ho-Seong KIM ,  Eduard KURGI ,  Jung-Hyeon KIM ,  Hee-Jin KIM ,  No-Shin PARK ,  Jae-Nam LEE

Inventor： Ho-Seong KIM ,  Eduard KURGI ,  Jung-Hyeon KIM ,  Hee-Jin KIM ,  No-Shin PARK ,  Jae-Nam LEE

IPC: H01L21/683 ,  H01L21/677

CPC classification number: H01L21/67763 ,  B65B13/02 ,  H01L21/67333

Abstract: Provided is an apparatus for clamping a stack of trays that allows automation and prevents distribution of particles or foreign materials during a semiconductor fabrication process. In one embodiment, the apparatus includes a frame body surrounding the stack of trays, a plurality of belt drums, and a hook. Each belt drum is attached to one side of the frame body has a belt and spiral spring. The belt is structured to securely surround the stack of trays using the elastic tension of the spiral spring member mounted in the belt drum. The hook is structured to be rotatably connected to the frame body and slid under a bottom surface of the stack of trays to secure the stack of trays.

Abstract translation: 提供了一种用于夹紧托盘堆叠的装置，其允许在半导体制造过程期间自动化并防止颗粒或异物的分布。 在一个实施例中，该装置包括围绕托盘堆叠的框架体，多个带鼓和钩。 每个皮带鼓连接到框体的一侧，带有一个皮带和螺旋弹簧。 带被构造成使用安装在带鼓中的螺旋弹簧构件的弹性张力可靠地围绕托盘堆叠。 钩被构造成可旋转地连接到框架主体并在托盘堆叠的底表面下滑动以固定托盘堆叠。

公开(公告)号：US20070002516A1

公开(公告)日：2007-01-04

申请号：US11366580

申请日：2006-03-03

Applicant: Ken Matsumoto

Inventor： Ken Matsumoto

IPC: H01L21/683 ,  H01L21/00

CPC classification number: H01L21/67353 ,  G03F1/66 ,  G03F7/70741 ,  G03F7/7075 ,  G03F7/70916 ,  H01L21/67763 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/6831

Abstract: A substrate such as a mask or wafer is transported while it is protected from a particle. Use of the substrate after transportation is facilitated. A container (300) includes a chuck (310) which chucks and holds a substrate (71) such as a mask or wafer, and a cover (320) which forms a storage space (108) together with the chuck (310). The substrate (71) is transported as it is held in the storage space (108) with the cover (320) being mounted on the chuck (310).

Abstract translation: 诸如掩模或晶片的衬底在受到颗粒保护的同时被传送。 便于运输后使用基材。 容器（300）包括夹持和保持诸如掩模或晶片的基板（71）的卡盘（310）和与卡盘（310）一起形成存储空间（108）的盖子（320）。 当基板（71）被保持在存储空间（108）中时，其中盖（320）安装在卡盘（310）上。

公开(公告)号：US20060288664A1

公开(公告)日：2006-12-28

申请号：US11424752

申请日：2006-06-16

Applicant: Tsutomu Okabe ,  Hitoshi Suzuki

Inventor： Tsutomu Okabe ,  Hitoshi Suzuki

IPC: B65B31/00

CPC classification number: H01L21/67393 ,  H01L21/67763 ,  H01L21/67775

Abstract: For the purpose of preventing a pressure difference from occurring between an interior of an FOUP and an exterior at the time of purging the interior of the FOUP, a communication path that communicates with the exterior of the FOUP and the interior of an outlet path is provided with respect to the outlet path that extends from a table side outlet port which is disposed on a table on which the FOUP is placed, and an external atmosphere is introduced to the outlet path through the communication path when a pressure difference starts occurring between the interior and the exterior of the FOUP.

Abstract translation: 为了防止在吹扫FOUP的内部时在FOUP的内部和外部之间发生压力差，提供了与FOUP的外部和出口路径的内部连通的连通路径 相对于从设置在其上放置有FOUP的工作台上的台面出口延伸的出口路径，并且当在内部之间开始发生压力差时，通过连通路径将外部气体引入到出口路径 和FOUP的外观。