公开(公告)号：US20110005967A1

公开(公告)日：2011-01-13

申请号：US12812729

申请日：2009-01-13

Applicant: Barry Gregerson ,  Michael Shawn Adams ,  Jason Todd Steffens

Inventor： Barry Gregerson ,  Michael Shawn Adams ,  Jason Todd Steffens

IPC: H01L21/673

CPC classification number: B65D25/103 ,  B65D25/28 ,  B65D43/02 ,  B65D85/70 ,  H01L21/6732 ,  H01L21/67369 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67763

Abstract: A front opening semiconductor wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion includes a means for accommodating large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

Abstract translation: 用于大直径晶片的前开口半导体晶片容器包括容器部分和门。 容器部分包括左封闭侧，右封闭侧，闭合背部，开放前部和包括用于接收和容纳晶片的多个狭槽的开放内部。 门可附接到容器部分以封闭敞开的前部，并可选择性地闩锁到容器部分。 容器部分包括用于容纳大直径晶片的装置，特别是450mm的晶片。 提供优化的下垂控制以及增强的结构刚度和晶片座位功能。

公开(公告)号：USD723239S1

公开(公告)日：2015-02-24

申请号：US29430855

申请日：2012-08-30

Applicant: Russ V. Raschke ,  Eric S. Olson ,  Jason Todd Steffens

Designer： Russ V. Raschke ,  Eric S. Olson ,  Jason Todd Steffens