公开(公告)号：US06675469B1

公开(公告)日：2004-01-13

申请号：US09636790

申请日：2000-08-11

申请人： Belgacem Haba ,  John W. Smith

发明人： Belgacem Haba ,  John W. Smith

IPC分类号： H05K336

CPC分类号： H05K3/4076 ,  H01L21/486 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

摘要： Electrical connections are made between a pair of elements disposed on opposite side of the hole extending through a dielectric layer by evaporating a conductive material such as a metal having high vapor pressure within the hole while maintaining the hole in a substantially sealed condition. The process may be performed simultaneously to form numerous connections within a microelectronic unit as, for example, within a multilayer circuit panel.

摘要翻译： 通过在保持孔处于基本上密封的状态下蒸发导电材料（例如在孔内具有高蒸气压的金属），在布置在电介质层的相对侧上的一对元件之间形成电连接。 该过程可以同时执行以在微电子单元内形成多个连接，例如在多层电路板内。

公开(公告)号：US06627478B2

公开(公告)日：2003-09-30

申请号：US09848387

申请日：2001-05-03

申请人： John W. Smith ,  Christopher M. Pickett

发明人： John W. Smith ,  Christopher M. Pickett

IPC分类号： H01L2144

CPC分类号： H01L23/49572 ,  H01L24/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/3025

摘要： A microelectronic assembly is made by bonding the tip ends of leads on a first element to bonding contacts on a second element. The tip ends of the leads are releasably connected to the first element, so that the leads are held in place during the bonding process. After bonding, the first and second elements are heated or cooled to cause differential thermal expansion, which breaks at least some of the releasable attachments of the tip ends, leaving the leads free to flex.

摘要翻译： 通过将第一元件上的引线的末端结合到第二元件上的接合触点来制造微电子组件。 引线的末端可释放地连接到第一元件，使得引线在接合过程中保持就位。 在接合之后，第一和第二元件被加热或冷却以引起不同的热膨胀，这会破坏尖端的可释放附件的至少一些，留下引线自由弯曲。

公开(公告)号：US06589819B2

公开(公告)日：2003-07-08

申请号：US09955695

申请日：2001-09-19

申请人： John W. Smith ,  Bruce McWilliams

发明人： John W. Smith ,  Bruce McWilliams

IPC分类号： H01L2144

CPC分类号： H01L24/28 ,  G01R1/0483 ,  H01L21/563 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/03001 ,  H01L2224/0311 ,  H01L2224/03334 ,  H01L2224/0384 ,  H01L2224/0401 ,  H01L2224/05016 ,  H01L2224/05022 ,  H01L2224/05556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13022 ,  H01L2224/13111 ,  H01L2224/73203 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of making a microelectronic package having an array of resilient leads includes providing a first element having a plurality of conductive leads at a first surface thereof, the conductive leads having terminal ends permanently attached to the first element and tip ends remote from the terminal ends, the tip ends being movable relative to the terminal ends. A second element having a plurality of contacts on a first surface thereof is then juxtaposed with the first surface of the first element, and the tip ends of the conductive leads are connected with the contacts of the second microelectronic element. The first and second elements are then moved away from one another so as to vertically extend the conductive leads between the first and second elements. After the moving step, a layer of a spring-like conductive material is formed over the conductive leads to form composite leads. The layer of a spring-like material desirably has greater yield strength than the conductive leads, thereby enhancing the resiliency of the composite lead structure.

公开(公告)号：US06307260B1

公开(公告)日：2001-10-23

申请号：US09395105

申请日：1999-09-14

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L2348

CPC分类号： H01L23/22 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L23/642 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/118 ,  H05K3/361 ,  H05K3/4084 ,  H05K2201/0133 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09081 ,  H05K2203/063 ,  H01L2924/00

摘要： A structure including a conductive, preferably metallic conductive layer is provided with leads on a bottom surface. The leads have fixed ends permanently attached to the structure and free ends detachable from the structure. The structure is engaged with a microelectronic element such as a semiconductor chip or wafer, the free ends of the leads are bonded to the microelectronic element, and the leads are bent by moving the structure relative to the microelectronic element. Portions of the conductive layer are removed, leaving residual portions of the conductive layer as separate electrical terminals connected to at least some of the leads. The conductive layer mechanically stabilizes the structure before bonding, and facilitates precise registration of the leads with the microelectronic element. After the conductive layer is converted to separate terminals, it does not impair free movement of the terminals relative to the microelectronic element.

摘要翻译： 包括导电优选金属导电层的结构在底表面上设置有引线。 引线具有永久地附接到结构的固定端部和从结构可拆卸的自由端。 该结构与诸如半导体芯片或晶片的微电子元件接合，引线的自由端接合到微电子元件，并且通过相对于微电子元件移动结构而使引线弯曲。 导电层的一部分被去除，导致导电层的剩余部分作为分开的电端子连接到至少一些引线。 导电层在结合之前机械稳定结构，并且有助于引线与微电子元件的精确对准。 在将导电层转换成单独的端子之后，它不会损害端子相对于微电子元件的自由移动。

公开(公告)号：US06114763A

公开(公告)日：2000-09-05

申请号：US87739

申请日：1998-05-29

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L21/56 ,  H01L23/36 ,  H01L23/498 ,  H05K1/11 ,  H05K1/14 ,  H05K3/00 ,  H01L23/34 ,  H01L23/04 ,  H01L23/10

CPC分类号： H01L23/49827 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49833 ,  H05K1/112 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2924/01087 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/141 ,  H05K2201/0394 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K3/0058

摘要： An electronic assembly which includes a semiconductor chip package having an array of package terminals and a translator. The translator has a first array of terminals exposed on a first surface of the translator and a second array of terminals exposed on a second surface of the translator. The pitch of the first array matches the pitch of the semiconductor package. The pitch of the second array matches the pitch of the printed circuit board to which the electronic assembly is to be mounted. The array of package terminals on the semiconductor chip package is aligned with and bonded to the first array of terminals on the translator to form the electronic assembly. The electronic assembly can then be mounted on a board by aligning and bonding the second array of terminals on the translator with the connection pads on the printed circuit board.

摘要翻译： 一种电子组件，其包括具有封装端子阵列和转换器的半导体芯片封装。 翻译器具有暴露在转换器的第一表面上的第一阵列端子和暴露在转换器的第二表面上的第二端子阵列。 第一阵列的间距与半导体封装的间距相匹配。 第二阵列的间距与电子组件将要安装的印刷电路板的间距相匹配。 半导体芯片封装上的封装端子阵列与转换器上的第一阵列端对准并结合到一起形成电子组件。 然后可以通过将平移器上的第二端子阵列与印刷电路板上的连接焊盘对准和结合来将电子组件安装在板上。

公开(公告)号：US5994781A

公开(公告)日：1999-11-30

申请号：US86863

申请日：1998-05-29

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： H01L23/498 ,  H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49811 ,  H01L23/4985 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/3011

摘要： An assembly for packaging a microchip has a dielectric element including a top dielectric layer having a bottom surface. Traces extend at the bottom surface to connect terminals of the dielectric layer to conductive elements, the conductive elements being connected to contacts on a chip. Each trace has a terminal to which it is electrically connected. Traces extend beneath terminals to which they are not electrically connected.

摘要翻译： 用于封装微芯片的组件具有包括具有底表面的顶部电介质层的电介质元件。 迹线在底表面延伸以将电介质层的端子连接到导电元件，导电元件连接到芯片上的触点。 每个迹线具有与其电连接的端子。 轨迹在其未电气连接的端子下方延伸。

公开(公告)号：US5807453A

公开(公告)日：1998-09-15

申请号：US634784

申请日：1996-04-19

申请人： John W. Smith ,  Joseph Fjelstad

发明人： John W. Smith ,  Joseph Fjelstad

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/498 ,  H05K3/40 ,  H05K3/32

CPC分类号： H05K3/4092 ,  H01L23/4985 ,  H01L24/80 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  Y10T156/1052 ,  Y10T29/49121 ,  Y10T29/49222

摘要： A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

摘要翻译： 第一金属（例如铜）的基本上连续的层通过第二金属的选择性电镀或通过施加单独形成的条（例如电线长度）来设置有诸如金的第二金属条。 提供与第一金属层接触的电介质支撑层，并且蚀刻第一金属层以留下与第二金属的条带相邻的第一金属的条带，由此提供复合引线，其中第一和第二金属条连接在 系列。 该方法提供了简单和经济的制造微电子连接部件的方法，该引线具有由贵金属形成的柔性耐疲劳引线部分。 引线可以包括圆形横截面形状的部分，以便于在部件使用期间通过焊接工具的接合。

公开(公告)号：US5351404A

公开(公告)日：1994-10-04

申请号：US123052

申请日：1993-09-20

申请人： John W. Smith

发明人： John W. Smith

IPC分类号： B25F1/02 ,  B25G1/08 ,  B25H7/04 ,  B26F1/04

CPC分类号： B25H7/04 ,  B25F1/02 ,  B25G1/085

摘要： An awl member having an elongate shank includes a shank first end spaced from a shank second end, the shank second end having a handle fixedly mounted thereto coaxially aligned with the shank, with the shank first end including an internally threaded bore threadedly receiving and engaging an insert, with the insert including a polymeric lock projection extending through an externally threaded portion of said insert.

摘要翻译： 具有细长柄部的锥形构件包括与柄第二端间隔开的柄部第一端，柄部第二端部具有固定地安装到柄部上并与轴同轴对准的手柄，柄部第一端部包括螺纹孔， 插入，其中插入件包括延伸穿过所述插入件的外螺纹部分的聚合物锁定突出部。

公开(公告)号：US5112892A

公开(公告)日：1992-05-12

申请号：US578294

申请日：1990-09-06

申请人： Peter T. Cardew ,  David R. Holmes ,  John W. Smith

发明人： Peter T. Cardew ,  David R. Holmes ,  John W. Smith

IPC分类号： C08J5/18 ,  B01D67/00 ,  B01D71/68 ,  B01D71/82 ,  C08J3/09 ,  C08L81/00 ,  C08L81/06

CPC分类号： C08J3/091 ,  B01D67/0011 ,  B01D67/0013 ,  B01D69/02 ,  B01D71/68 ,  B01D2325/022 ,  C08J2381/06

摘要： A polymer solution contains a sulphonated polyarylethersulphone in a solvent mixture containing at least three components, where the solvent mixture has a delta-H in the range from 3 to 8.5; a delta-P in the range from 4 to 8 and a delta-D in the range 7.2 to 9.5 and each component of the solvent mixture is a liquid or low melting solid which is a non-solvent or poor solvent for the sulphonated polyarylethersulphone, and at least one of the components satisfies at least one of the conditions:a) said component has a delta-D of less than 8 when the value of delta-P is not more than 3; andb) said component has a delta-H of greater than 3 when the value of delta-P is at least 8.5; andc) said component has a delta-H of less than 8 when it contains at least one hydroxylic group; andd) said component is free of hydroxylic groups and has a delta-P which is greater than 3 and less than 8.5.The solution can be used for the production of membranes suitable for use in reverse osmosis applications.

摘要翻译： 聚合物溶液在含有至少三种组分的溶剂混合物中含有磺化的聚芳醚砜，其中溶剂混合物的δ-H在3至8.5的范围内; δ-P在4至8的范围内，Δ-D在7.2至9.5的范围内，溶剂混合物的每个组分是液体或低熔点固体，其是用于磺化聚芳基醚砜的非溶剂或不良溶剂， 并且所述组分中的至少一个满足以下条件中的至少一个：a）当Δ-P的值不大于3时，所述组分的δ-D小于8; 和b）当Δ-P的值至少为8.5时，所述组分的Δ-H大于3; 和c）当其含有至少一个羟基时，所述组分的δ-H小于8; 和d）所述组分不含羟基并且具有大于3且小于8.5的δ-P。 该溶液可用于生产适用于反渗透应用的膜。

公开(公告)号：US5006677A

公开(公告)日：1991-04-09

申请号：US472727

申请日：1990-01-31

申请人： John W. Smith ,  James P. Meagher

发明人： John W. Smith ,  James P. Meagher

IPC分类号： B60T7/04 ,  B60T13/22 ,  H01H3/02

CPC分类号： B60T13/22 ,  B60T7/04 ,  H01H3/0206

摘要： A housing includes a switch chamber and a plunger chamber communicating with the switch chamber. A plunger is slidable within the plunger chamber. Cam surfaces on the plunger operate electrical switches in the switch chamber. There is an axial channel in the plunger, and a slot through the plunger wall communicates with the channel. A vacuum passageway passes from one side of the housing, into the channel, and a solid extension of the passageway passes through the slot, and into a hole in the opposite wall of the housing. As the plunger moves in and out, the slot slides on the extension to guide to stabilize the plunger. A vent hole in the vacuum passageway opens into the channel. A sealing member slides in the channel along the axis of the plunger, alternately sealing and unsealing the vent hole as the plunger moves. A spring seated between the plunger and the sealing member permits the plunger to continue moving when the sealing member is seated in the passageway vent hole. A maze causes air passing through the switch chamber to the vent hole to turn and slow, thereby causing dust particles to settle out of it.

摘要翻译： 壳体包括开关室和与开关室连通的柱塞室。 柱塞可在柱塞室内滑动。 柱塞上的凸轮表面操作开关室中的电气开关。 在柱塞中存在一个轴向通道，并且通过柱塞壁的狭槽与通道连通。 真空通道从壳体的一侧通过到通道中，并且通道的实心延伸通过狭槽，并进入壳体的相对壁中的孔中。 当柱塞进出时，槽在延伸部上滑动以引导柱塞稳定。 真空通道中的通风孔通向通道。 密封构件沿着柱塞的轴线在通道中滑动，当柱塞移动时交替地密封和开封通气孔。 位于柱塞和密封构件之间的弹簧允许柱塞在密封构件位于通道通气孔中时继续移动。 迷宫使空气通过开关室通向通风孔，使其转动和减慢，从而使灰尘颗粒沉淀出来。