发明授权
- 专利标题： Fabrication of leads on semiconductor connection components
- 专利标题（中）： 半导体连接元件引线的制造
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申请号： US634784申请日： 1996-04-19
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公开(公告)号： US5807453A公开(公告)日： 1998-09-15
- 发明人: John W. Smith , Joseph Fjelstad
- 申请人： John W. Smith , Joseph Fjelstad
- 申请人地址： CA San Jose
- 专利权人： Tessera, Inc.
- 当前专利权人： Tessera, Inc.
- 当前专利权人地址： CA San Jose
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/60 ; H01L23/498 ; H05K3/40 ; H05K3/32
摘要：
A substantially continuous layer of a first metal such as copper is provided with strips of a second metal such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal contiguous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.
公开/授权文献
- US5036532A Portable telephone with power source/mode change during calls 公开/授权日：1991-07-30
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