公开(公告)号：US20080315409A1

公开(公告)日：2008-12-25

申请号：US11765055

申请日：2007-06-19

Applicant: Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Matthew J. Farinelli ,  Sherif A. Goma ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: H01L23/48

CPC classification number: H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06183 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16137 ,  H01L2224/16238 ,  H01L2224/17183 ,  H01L2224/81005 ,  H01L2224/811 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/83851 ,  H01L2224/81

Abstract: The present invention allows for direct chip-to-chip connections using the shortest possible signal path.

Abstract translation: 本发明允许使用尽可能短的信号路径进行直接芯片到芯片的连接。

公开(公告)号：US20080272177A1

公开(公告)日：2008-11-06

申请号：US12173346

申请日：2008-07-15

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K37/06

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

公开(公告)号：US07410090B2

公开(公告)日：2008-08-12

申请号：US11409244

申请日：2006-04-21

Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

IPC: B23K31/02

CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

Abstract: A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.

Abstract translation: 公开了一种在电路支撑衬底中的多个空腔中提供导电接合材料的系统，方法和装置。 该方法包括将填充头放置成与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 导电接合材料被迫从填充头朝向电路支撑基板排出。 所述导电接合材料被提供到与所述至少一个空腔同时的至少一个空腔中，所述至少一个空腔在所述填充头附近。

公开(公告)号：US20080179035A1

公开(公告)日：2008-07-31

申请号：US11626986

申请日：2007-01-25

Applicant: Peter A. Gruber ,  John U. Knickerbocker

Inventor： Peter A. Gruber ,  John U. Knickerbocker

IPC: B22D17/00 ,  B22D41/00

CPC classification number: B22D17/2023 ,  B22D17/30 ,  B22D18/04 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

Abstract: A flexible nozzle for injection molded solder and a method of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

Abstract translation: 一种用于注塑焊料的柔性喷嘴和一种利用柔性喷嘴进行注射成型焊料应用的方法。 为了能够有效地执行注射成型的焊接工艺，采用柔性或柔性的焊料分配喷嘴结构，其特别有利地适于与圆形或圆形模具一起使用。 在这方面，提供用于排出焊料的喷嘴的尖端提供一系列小孔或孔，用于在至少一个焊料储存器的压力下挤出焊料。 在一个实施例中，可以使用单个焊料储存器，其中连通多个排出孔或孔，用于挤出焊料，以填充形成在用于注射成型焊料的模具的相对表面中的合适的空腔或凹部。 或者，而不是通过多个孔或排放孔从单个储存器分配或挤出焊料，每个相应的孔或一组孔可以分别连接到经受压力的多个储存器的单独的焊料储存器 有助于将焊料挤出到模具表面上。

公开(公告)号：US20080176411A1

公开(公告)日：2008-07-24

申请号：US12056773

申请日：2008-03-27

Applicant: Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

Inventor： Raymond R. Horton ,  John U. Knickerbocker ,  Edmund J. Sprogis ,  Cornelia K. Tsang

IPC: H01L21/31

CPC classification number: H01L23/49827 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/5382 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/15311

Abstract: Techniques for electronic device fabrication are provided. In one aspect, an electronic device is provided. The electronic device comprises at least one interposer structure having one or mole vias and a plurality of decoupling capacitors integrated therein, the at least one interposer structure being configured to allow for one or more of the plurality of decoupling capacitors to be selectively deactivated. In another aspect, a method of fabricating an electronic device comprising at least one interposer structure having one or more vias and a plurality of decoupling capacitors integrated therein comprises the following step. One or more of the plurality of decoupling capacitors are selectively deactivated.

Abstract translation: 提供电子器件制造技术。 一方面，提供一种电子设备。 电子设备包括具有一个或多个通孔和集成在其中的多个去耦电容器的至少一个插入器结构，所述至少一个插入器结构被配置为允许选择性地去激活多个去耦电容器中的一个或多个。 在另一方面，一种制造电子器件的方法，包括至少一个具有一个或多个通孔的内插器结构和集成在其中的多个去耦电容器，其包括以下步骤。 选择性地去激活多个去耦电容器中的一个或多个。

公开(公告)号：US07332821B2

公开(公告)日：2008-02-19

申请号：US10711076

申请日：2004-08-20

Applicant: William E. Bernier ,  Tien-Jen Cheng ,  Marie S. Cole ,  David E. Eichstadt ,  Mukta G. Farooq ,  John A. Fitzsimmons ,  Lewis S. Goldmann ,  John U. Knickerbocker ,  Tasha E. Lopez ,  David J. Welsh

Inventor： William E. Bernier ,  Tien-Jen Cheng ,  Marie S. Cole ,  David E. Eichstadt ,  Mukta G. Farooq ,  John A. Fitzsimmons ,  Lewis S. Goldmann ,  John U. Knickerbocker ,  Tasha E. Lopez ,  David J. Welsh

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/40 ,  H01L23/485 ,  H01L23/488 ,  H01L21/48 ,  H01L21/44

CPC classification number: H01L21/563 ,  H01L23/3171 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13566 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01R43/0256 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2224/0401

Abstract: Disclosed is a method of forming an integrated circuit structure that forms lead-free connectors on a device, surrounds the lead-free connectors with a compressible film, connects the device to a carrier (the lead-free connectors electrically connect the device to the carrier), and fills the gaps between the carrier and the device with an insulating underfill.

Abstract translation: 公开了一种形成集成电路结构的方法，其在器件上形成无铅连接器，用可压缩膜围绕无铅连接器，将器件连接到载体（无铅连接器将器件电连接到载体上 ），并用绝缘底部填充物填充载体和装置之间的间隙。

公开(公告)号：US07316572B2

公开(公告)日：2008-01-08

申请号：US10906111

申请日：2005-02-03

Applicant: William E. Bernier ,  David E. Eichstadt ,  Mukta G. Farooq ,  John U. Knickerbocker

Inventor： William E. Bernier ,  David E. Eichstadt ,  Mukta G. Farooq ,  John U. Knickerbocker

IPC: H01R12/00

CPC classification number: H01L24/13 ,  G01R1/06716 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/11505 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K3/06 ,  H05K3/3436 ,  H05K2201/10242 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.

Abstract translation: 形成顺应性电触头的方法包括将导电层图案化为顺应构件阵列。 然后将顺应构件阵列定位成与集成电路晶片上的电连接焊盘接触，并且柔性构件连接到焊盘。 然后，移除支撑柔顺构件的支撑层，以使与柔性构件连接的衬垫离开。

公开(公告)号：US06984792B2

公开(公告)日：2006-01-10

申请号：US10427459

申请日：2003-05-01

Applicant: Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

Inventor： Peter J. Brofman ,  Shaji Farooq ,  John U. Knickerbocker ,  Scott I. Langenthal ,  Sudipta K. Ray ,  Kathleen A. Stalter

IPC: H01R12/06

CPC classification number: H05K3/3436 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/09701 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A pre-thermal reflown dielectric interposer having a plurality of vias traversing through the interposer which correspond to the I/O pads on a chip and substrate. Cone shaped solder elements reside within the vias, whereby these solder elements are cone shaped prior to thermal reflow to permit a reduced force for allowing some non-planarity for joining the chip to the substrate. The interposer may comprise a polyester film, glass, alumina, polyimide, a heat curable polymer or an inorganic powder filler in an organic material. The interposer may also have an adhesive or adhesive layers disposed on the linear surfaces thereof. The present pre-thermal reflown interposer prohibits contact between the solder joints by isolating each of the joints and corresponding bonding pads, as well as preventing over compression of the solder joints by acting as a stand off.

Abstract translation: 具有穿过插入件的多个通孔对应于芯片和基板上的I / O焊盘的预热退火介电插入器。 锥形焊料元件驻留在通孔内，由此这些焊料元件在热回流之前是锥形的，以允许减小的力以允许用于将芯片连接到衬底的一些非平面性。 中间层可以在有机材料中包含聚酯膜，玻璃，氧化铝，聚酰亚胺，热固化聚合物或无机粉末填料。 插入器也可以具有设置在其线性表面上的粘合剂或粘合剂层。 本发明的预热反射中介层通过隔离每个接头和相应的接合焊盘来防止焊点之间的接触，并且通过作为脱开来防止焊点过度压缩。

公开(公告)号：US06829413B2

公开(公告)日：2004-12-07

申请号：US10307951

申请日：2002-12-02

Applicant: Cameron J. Brooks ,  Philip G. Emma ,  Casimer M. DeCusatis ,  Lawrence Jacobowitz ,  John U. Knickerbocker

Inventor： Cameron J. Brooks ,  Philip G. Emma ,  Casimer M. DeCusatis ,  Lawrence Jacobowitz ,  John U. Knickerbocker

IPC: G02B626

CPC classification number: G02B6/3636 ,  G02B6/3608 ,  G02B6/3652 ,  G02B6/3676 ,  G02B6/43

Abstract: A ferrule-less optical backplane connector assembly includes a substrate having at least a pair of optical guide receiving structures formed therein, the pair of optical guide receiving structures further being formed at substantially a right angle with respect to one another so as to guide a corresponding first and second optical guide into optical alignment with one another.

Abstract translation: 一种无套圈的光背板连接器组件包括具有形成在其中的至少一对光导接收结构的基板，所述一对光导接收结构进一步相对于彼此基本成直角地形成，以便引导相应的 第一和第二光导件彼此光学对准。

公开(公告)号：US06821026B2

公开(公告)日：2004-11-23

申请号：US10235435

申请日：2002-09-04

Applicant: William T. Devine ,  Jeffrey A. Kash ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Jeannine M. Trewhella ,  Ronald P. Luijten

Inventor： William T. Devine ,  Jeffrey A. Kash ,  John U. Knickerbocker ,  Steven P. Ostrander ,  Jeannine M. Trewhella ,  Ronald P. Luijten

IPC: G02B636

CPC classification number: H01S5/423 ,  H01S5/02248 ,  H01S5/02284

Abstract: A redundant configurable VCSEL laser array optical light source which provides for integrating optical communications capabilities into manufacturing processes for a substrate or submount such as a silicon or ceramic substrate, a multi-chip module, a package board, backplane or similar component. Multiple, spatially proximate lasers and photodetectors are provided as part of an optical transmitter or receiver module to simplify assembly of the module, particularly alignment of a laser or photodetector to an optical fiber or waveguide. A feedback loop and control logic select those laser(s) or photodiodes(s) which are most strongly coupled to the transmission medium to produce the best signals. This approach greatly simplifies optical alignment, to improve yield and relax mechanical tolerances, leading to lower assembly costs and higher manufacturing yields.