公开(公告)号：US5512224A

公开(公告)日：1996-04-30

申请号：US608070

申请日：1990-11-01

Applicant: Jonas Medney ,  Fred E. Klimpl

Inventor： Jonas Medney ,  Fred E. Klimpl

IPC: B32B15/08 ,  B29B15/10 ,  B29B15/12 ,  B29C53/56 ,  B29C53/58 ,  B29C53/76 ,  B29C53/80 ,  B29C70/06 ,  B29C70/10 ,  B29C70/16 ,  B29C70/20 ,  B29C70/34 ,  B29K105/08 ,  B29L9/00 ,  B29L31/34 ,  B32B5/12 ,  B32B5/28 ,  C08J5/24 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/36 ,  H05K3/46 ,  B29C39/12 ,  B29C39/42 ,  B29C53/60

CPC classification number: B29C70/347 ,  B29C53/564 ,  B29C53/58 ,  B29C53/76 ,  B29C53/8016 ,  B29C70/202 ,  H05K1/0366 ,  H05K3/4626 ,  B29C2793/009 ,  B29C53/821 ,  B29L2031/3425 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2203/085 ,  H05K2203/1327 ,  H05K3/0047 ,  Y10S428/901 ,  Y10T29/49158 ,  Y10T29/49176 ,  Y10T428/24074

Abstract: A warp-free laminate is produced by winding a first set of strands or filaments about a flat mandrel with a second set of strands being wound transverse to the first set. The two sets may be perpendicular to each other. The filaments are maintained under a controlled tension while being impregnated with a resin and during subsequent cure of the resin. In order to permit the formation of a warp-free product, the winding pattern is such that it forms a mirror image about a neutral axis or plane of symmetry. The winding pattern may be chosen to provide interstices in a predetermined pattern determining punching out or high speed drilling of hole openings for subsequent printed circuit applications.

Abstract translation: 通过在第一组横向缠绕第二组股线的情况下围绕扁平心轴缠绕第一组股线或细丝来生产无翘曲的层压体。 两组可以彼此垂直。 将长丝保持在可控制的张力下，同时用树脂浸渍并在随后的树脂固化期间。 为了允许形成无翘曲的产品，卷绕图案使得其形成关于中性轴或对称平面的镜像。 可以选择卷绕图案以在预定图案中提供间隙，以确定用于后续印刷电路应用的孔孔的冲孔或高速钻孔。

公开(公告)号：US4812792A

公开(公告)日：1989-03-14

申请号：US44689

申请日：1987-05-01

Applicant: Joseph D. Leibowitz

Inventor： Joseph D. Leibowitz

IPC: B32B15/08 ,  H05K1/03 ,  H05K1/05 ,  H05K3/42 ,  H05K3/46 ,  H01P3/08 ,  H05K3/06

CPC classification number: B32B15/08 ,  H05K1/0207 ,  H05K3/4641 ,  H05K1/0243 ,  H05K1/034 ,  H05K2201/015 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K3/429

Abstract: A circuit board having multiple layers of a dielectric material, multiple layers of a conductive metal and multiple layers of graphite bonded together to form a composite multilayer printed circuit board having a desired coefficient of expansion and having strip and microstrip transmission lines for electrically connecting very high frequency electronic components mounted on the circuit board. The multiple layers of graphite are positioned in a symmetrical manner with respect to the thickness of the circuit board and selected in number to provide the circuit board with a desired coefficient of expansion. In addition, at least some of the layers of graphite are positioned in close proximity to some of the layers of conductive metal to provide enhanced thermal conduction from the mounted components.

Abstract translation: 具有多层介电材料的电路板，多层导电金属和多层石墨结合在一起以形成具有所需膨胀系数的复合多层印刷电路板，并具有用于电连接非常高的带状和微带传输线 频率电子元件安装在电路板上。 多层石墨相对于电路板的厚度以对称的方式定位，并且在数量上选择以为电路板提供所需的膨胀系数。 此外，至少一些石墨层被定位成紧邻导电金属的一些层，以提供来自所安装部件的增强的热传导。