公开(公告)号：US20120250326A1

公开(公告)日：2012-10-04

申请号：US13433890

申请日：2012-03-29

申请人： Noriaki SEKINE

发明人： Noriaki SEKINE

IPC分类号： F21V21/14

CPC分类号： H01L25/0753 ,  H01L33/56 ,  H01L33/64 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/056 ,  H05K2201/0141 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A luminous-body flexible board includes a flexible board including a metal substrate of a bendable plate, an insulating layer of liquid crystal polymer of which one surface is joined directly to the metal substrate and a conductor layer joined to the other surface of the insulating layer and formed in a wiring pattern. The flexible board further has a plurality of cavities dented on a side of the conductor layer and protruded on a side of the metal substrate of the flexible board, being arranged in juxtaposition and configured to be mounted a luminous element respectively therein.

摘要翻译： 发光体柔性基板包括柔性基板，该柔性基板包括可弯曲板的金属基板，一个表面直接接合到金属基板的液晶聚合物的绝缘层和与该绝缘层的另一个表面接合的导体层 并以布线图案形成。 柔性基板还具有在导体层的侧面凹陷并在柔性基板的金属基板的一侧突出的多个空腔，并列配置成分别安装在发光元件上。

公开(公告)号：US20120241082A1

公开(公告)日：2012-09-27

申请号：US13275316

申请日：2011-10-18

申请人： Yu-Chung Chen ,  Yi-Ling Lo ,  Hung-Kun Lee ,  Tzu-Ping Cheng

发明人： Yu-Chung Chen ,  Yi-Ling Lo ,  Hung-Kun Lee ,  Tzu-Ping Cheng

IPC分类号： H05K3/46 ,  C25D1/00

CPC分类号： H05K3/007 ,  C25D5/02 ,  C25D5/10 ,  C25D5/12 ,  C25D5/36 ,  C25D5/38 ,  C25D5/40 ,  C25D5/44 ,  C25D5/50 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/0152 ,  H05K2203/0315

摘要： A fabricating method of a flexible circuit board includes the following steps. The metal carrier foil with metal oxide layer on its surfaces is provided first. The metal oxide layer is formed from the spontaneous oxidization of the metal carrier foil in ambient air and provides passive protection in a sulfuric acid solution or an acidic copper sulphate solution. A conductive seed layer is electroplated onto the metal oxide layer. A flexible insulating layer is formed onto the conductive seed layer by performing a polyimide casting process. The metal carrier foil is then peeled off from the conductive seed layer, which is supported by the insulating layer. A patterned circuit is formed on the insulating layer by performing photoresist coating, developing and etching.

摘要翻译： 柔性电路板的制造方法包括以下步骤。 首先提供其表面上具有金属氧化物层的金属载体箔。 金属氧化物层由环境空气中的金属载体箔的自发氧化形成，并在硫酸溶液或酸性硫酸铜溶液中提供被动保护。 导电种子层电镀在金属氧化物层上。 通过进行聚酰亚胺浇铸工艺在导电种子层上形成柔性绝缘层。 然后将金属载体箔从由绝缘层支撑的导电种子层剥离。 通过进行光致抗蚀剂涂布，显影和蚀刻，在绝缘层上形成图案化电路。

公开(公告)号：US20120196043A1

公开(公告)日：2012-08-02

申请号：US13315501

申请日：2011-12-09

申请人： Shohei AZAMI

发明人： Shohei AZAMI

IPC分类号： B05D3/02 ,  C03C17/32

CPC分类号： B29B13/023 ,  B29C31/08 ,  B29K2105/0079 ,  H05K1/0366 ,  H05K2201/0141

摘要： An object of the present invention is to provide a method for producing a heat-treated liquid crystal polyester-impregnated base material, which can prevent welding to a supporting material upon a heat treatment. A second liquid crystal polyester-impregnated base material is obtained by heat-treating a first liquid crystal polyester-impregnated base material 11 arranged on a supporting material 13 through a resin layer 12 which exhibits a melting point of 320° C. or higher by the measurement using a differential scanning calorimeter, or does not undergo decomposition at lower than 320° C. and also does not exhibit a melting point.

摘要翻译： 本发明的目的是提供一种热处理液晶聚酯浸渍基材的制造方法，其能够防止在热处理时对支撑材料的焊接。 通过将熔点为320℃以上的树脂层12热处理而配置在支撑材料13上的第一液晶聚酯浸渍基材11热处理，得到第二液晶聚酯浸渍基材。 使用差示扫描量热计进行测定，或者在低于320℃下不发生分解，也不显示熔点。

公开(公告)号：US20120183697A1

公开(公告)日：2012-07-19

申请号：US13337725

申请日：2011-12-27

申请人： Toyonari ITO ,  Changbo SHIM

发明人： Toyonari ITO ,  Changbo SHIM

IPC分类号： C09K19/38 ,  B05D3/02 ,  C09K19/54

CPC分类号： C08L67/00 ,  C08G63/60 ,  C08G77/445 ,  C08G77/46 ,  C08J5/04 ,  C08J5/18 ,  C08J5/24 ,  C08J2300/12 ,  C08J2367/00 ,  C08L67/03 ,  C08L69/00 ,  C08L83/04 ,  C08L83/10 ,  C08L83/12 ,  H05K1/0326 ,  H05K2201/0141

摘要： An object of the present invention is to provide a liquid crystal polyester-containing liquid composition which is capable of producing a prepreg and a resin film in which surface defects are remarkably reduced even in case of drying at high temperature to remove the solvent in the production process. Disclosed are a liquid crystal polyester-containing liquid composition comprising a liquid crystal polyester, an organic solvent, and one or more kinds of selected leveling agents, wherein the content of the leveling agent is from 0.001 to 2.0 parts by mass based on 100 parts by mass of the total amount of the liquid crystal polyester and the organic solvent; and a method for producing a resin film, which comprises applying the above-described liquid crystal polyester-containing liquid composition on a support, and then removing the solvent from the liquid crystal polyester-containing liquid composition on the support at 50° C. or higher.

摘要翻译： 本发明的目的在于提供一种能够制造预浸料和树脂膜的液晶聚酯的液体组合物，其中即使在高温下干燥以除去生产中的溶剂，表面缺陷也显着降低 处理。 本发明公开了一种液晶聚酯的液体组合物，其包含液晶聚酯，有机溶剂和一种或多种选择的流平剂，其中流平剂的含量相对于100份的比例为0.001〜2.0质量份 液晶聚酯和有机溶剂的总量的质量; 以及制造树脂膜的方法，其包括将上述含液晶聚酯的液体组合物涂布在载体上，然后从载体上的液晶聚酯的液体组合物中在50℃下除去溶剂，或 更高。

公开(公告)号：US20120182703A1

公开(公告)日：2012-07-19

申请号：US13007035

申请日：2011-01-14

申请人： Louis Joseph Rendek, JR. ,  Michael Weatherspoon ,  Casey Philip Rodriguez ,  David Nicol

发明人： Louis Joseph Rendek, JR. ,  Michael Weatherspoon ,  Casey Philip Rodriguez ,  David Nicol

IPC分类号： H05K1/18 ,  H01L21/58

CPC分类号： H01L24/83 ,  H01L23/3157 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/33 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/11422 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06568 ,  H01L2924/00013 ,  H01L2924/01029 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K1/0306 ,  H05K3/281 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0141 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/31721 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/014 ,  H01L2924/00

摘要： A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.

摘要翻译： 制造电子器件的方法包括在刚性晶片衬底上形成互连层堆叠，所述刚性晶片衬底具有多个图案化电导体层，相邻图案化电导体层之间的介电层，以及位于最上图案化电导体层上的至少一个焊盘 。 形成具有与至少一个焊盘对准的至少一个孔的LCP焊接掩模。 将LCP焊接掩模和互连层堆叠对齐并层压在一起。 焊料定位在至少一个孔中。 使用焊料将至少一个电路部件连接到至少一个焊盘。

公开(公告)号：US20120138340A1

公开(公告)日：2012-06-07

申请号：US13369363

申请日：2012-02-09

申请人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

发明人： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

IPC分类号： H05K1/09

CPC分类号： H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

摘要： A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

摘要翻译： 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

公开(公告)号：US20120125673A1

公开(公告)日：2012-05-24

申请号：US13387236

申请日：2010-07-23

申请人： Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

发明人： Takeshi Kondo ,  Sadanobu Iwase ,  Hironobu Iyama

IPC分类号： H05K1/02 ,  C09K5/10

CPC分类号： H05K1/056 ,  C08L67/03 ,  C09D167/03 ,  C09K19/3809 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0266 ,  Y10T428/10 ,  Y10T428/1036

摘要： To provide a liquid crystal polyester composition which is suited for use as a material for forming a liquid crystal polyester film having excellent thermal conductivity. Also, an excellent electronic circuit board is provided by using an insulating film obtained from the liquid crystal polyester composition. The liquid crystal polyester composition of the present invention is composed of a liquid crystal polyester, a solvent and a thermally conductive filler. The thermally conductive filler is contained in the amount of 50 to 90 volume % based on the total amount of the liquid crystal polyester and the thermally conductive filler, and the thermally conductive filler contains 0 to 20 volume % of a first thermally conductive filler having a volume average particle diameter of 0.1 μm or more and less than 1.0 μm, 5 to 40 volume % of a second thermally conductive filler having a volume average particle diameter of 1.0 μm or more and less than 5.0 μm and 40 to 90 volume % of a third thermally conductive filler having a volume average particle diameter of 5.0 μm or more and 30.0 μm or less.

摘要翻译： 提供一种液晶聚酯组合物，其适用于形成具有优异导热性的液晶聚酯膜的材料。 此外，通过使用由液晶聚酯组合物获得的绝缘膜提供了优异的电子电路板。 本发明的液晶聚酯组合物由液晶聚酯，溶剂和导热填料组成。 导热性填料的含量相对于液晶聚酯和导热性填料的总量为50〜90体积％，导热性填料含有0〜20体积％的第一导热填料，其具有 体积平均粒径为0.1μm以上且小于1.0μm的体积平均粒径为5〜40体积％，体积平均粒径为1.0μm以上且小于5.0μm的第二导热性填料为40〜90体积％ 第三导热性填料，其体积平均粒径为5.0μm以上且30.0μm以下。

公开(公告)号：US20120085750A1

公开(公告)日：2012-04-12

申请号：US13218691

申请日：2011-08-26

申请人： Marc Hauer

发明人： Marc Hauer

IPC分类号： B23K13/01 ,  B23K1/00 ,  B32B37/12

CPC分类号： H05K5/066 ,  B81C1/00269 ,  B81C2203/0181 ,  B81C2203/035 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H05K1/0212 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/10371 ,  H05K2203/101 ,  H05K2203/1115 ,  H01L2924/00

摘要： A covering device for covering an area of an organic substrate, with a connecting zone between a closure cap and the substrate. It is proposed that the connecting zone includes, at least in certain areas, a heating element for heating the connecting zone during the creation of a connection between the closure cap and the substrate. Also provided is an organic substrate with a covering device and a production method for producing a covering device.

摘要翻译： 一种用于覆盖有机基底的区域的覆盖装置，其中封闭盖和基底之间具有连接区。 建议连接区域至少在某些区域包括用于在形成封闭盖和基板之间的连接的过程中加热连接区域的加热元件。 还提供了具有覆盖装置的有机基板和用于制造覆盖装置的制造方法。

公开(公告)号：US08152950B2

公开(公告)日：2012-04-10

申请号：US12342377

申请日：2008-12-23

申请人： Toshinori Tsugaru ,  Tatsuya Sunamoto ,  Tadao Yoshikawa

发明人： Toshinori Tsugaru ,  Tatsuya Sunamoto ,  Tadao Yoshikawa

IPC分类号： B32B37/04

CPC分类号： H05K3/4655 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1189 ,  Y10T428/24917

摘要： A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.

摘要翻译： 一种制造多层电路板的方法，所述多层电路板具有第一膜和至少两层膜，第二膜和第三膜各自由能够形成光学各向异性熔融相的热塑性聚合物制成，所述第一膜具有低熔点 点，第二和第三膜的熔点高于第一膜的熔点，第二和第三膜中的至少一个膜上具有电路图案，第一至第三膜与第一膜的第一和第三膜热压缩 介于第二和第三片之间的胶片。 该方法需要使第二和第三膜中的一个上的电路图案中的至少一个在第一至第三膜的热压接期间通过第一膜接触第二和第三膜中的另一个的相对表面。

公开(公告)号：US20120043129A1

公开(公告)日：2012-02-23

申请号：US13286318

申请日：2011-11-01

申请人： Noboru KATO

发明人： Noboru KATO

IPC分类号： H05K1/11 ,  H05K3/38 ,  H05K1/00

CPC分类号： H05K1/0271 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/15311 ,  H05K3/382 ,  H05K3/4614 ,  H05K3/4632 ,  H05K2201/0141 ,  Y10T29/49124

摘要： In a circuit board, a laminate includes a plurality of laminated insulating material layers made of a flexible material. First external electrodes are provided on an upper surface of the laminate, and an electronic component is mounted thereon. Second external electrodes are provided on a lower surface of the laminate and mounted on a wiring board. An internal conductor is provided between first and second adjacent insulating material layers, fixed to the first insulating material layer, and not fixed to the second insulating material layer. The internal conductor is arranged so as to extend across regions obtained by connecting certain ones of the second external electrodes to certain ones of the first external electrodes located closest to the certain ones of the second external electrodes.

摘要翻译： 在电路板中，层压体包括由柔性材料制成的多个叠层绝缘材料层。 第一外部电极设置在层叠体的上表面上，并且电子部件安装在其上。 第二外部电极设置在层叠体的下表面上并安装在布线板上。 内部导体设置在第一和第二相邻的绝缘材料层之间，固定到第一绝缘材料层，而不固定到第二绝缘材料层。 内部导体被布置成延伸穿过将某些第二外部电极连接到位于最靠近某些第二外部电极的某些第一外部电极所获得的区域。