公开(公告)号：US08152950B2

公开(公告)日：2012-04-10

申请号：US12342377

申请日：2008-12-23

申请人： Toshinori Tsugaru ,  Tatsuya Sunamoto ,  Tadao Yoshikawa

发明人： Toshinori Tsugaru ,  Tatsuya Sunamoto ,  Tadao Yoshikawa

IPC分类号： B32B37/04

CPC分类号： H05K3/4655 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/1189 ,  Y10T428/24917

摘要： A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.

摘要翻译： 一种制造多层电路板的方法，所述多层电路板具有第一膜和至少两层膜，第二膜和第三膜各自由能够形成光学各向异性熔融相的热塑性聚合物制成，所述第一膜具有低熔点 点，第二和第三膜的熔点高于第一膜的熔点，第二和第三膜中的至少一个膜上具有电路图案，第一至第三膜与第一膜的第一和第三膜热压缩 介于第二和第三片之间的胶片。 该方法需要使第二和第三膜中的一个上的电路图案中的至少一个在第一至第三膜的热压接期间通过第一膜接触第二和第三膜中的另一个的相对表面。

公开(公告)号：US06288165B1

公开(公告)日：2001-09-11

申请号：US08985873

申请日：1997-12-05

申请人： Takeshi Moritani ,  Kaoru Ikeda ,  Akimasa Aoyama ,  Takaharu Kawahara ,  Yukihiro Ohara ,  Naoshi Nakagawa ,  Toshinori Tsugaru

发明人： Takeshi Moritani ,  Kaoru Ikeda ,  Akimasa Aoyama ,  Takaharu Kawahara ,  Yukihiro Ohara ,  Naoshi Nakagawa ,  Toshinori Tsugaru

IPC分类号： C08F800

CPC分类号： C08F6/003 ,  C08F8/12 ,  C08F2800/10 ,  C08F2800/20 ,  C08F2810/20 ,  C08J5/18 ,  C08L23/0853 ,  C08L31/04 ,  C08F218/08 ,  C08F210/02 ,  C08F236/22 ,  C08F236/08

摘要： A process for producing vinyl acetate polymers comprises, after polymerization of at least one monomer comprising vinyl acetate, adding a conjugated polyene having a boiling point of at least 20° C. Saponified products of the vinyl acetate polymers obtained by this process can give molded articles causing little coloring and generation of gel-like agglomerates.

摘要翻译： 制备乙酸乙烯酯聚合物的方法包括在包含乙酸乙烯酯的至少一种单体的聚合之后，加入沸点至少为20℃的共轭多烯。通过该方法获得的乙酸乙烯酯聚合物的皂化产物可以产生模制品 引起凝胶状附聚物的少量着色和产生。

公开(公告)号：US5744547A

公开(公告)日：1998-04-28

申请号：US668466

申请日：1996-06-25

申请人： Takeshi Moritani ,  Kaoru Ikeda ,  Akimasa Aoyama, deceased ,  Takaharu Kawahara ,  Yukihiro Ohara ,  Naoshi Nakagawa ,  Toshinori Tsugaru

发明人： Takeshi Moritani ,  Kaoru Ikeda ,  Akimasa Aoyama, deceased ,  Takaharu Kawahara ,  Yukihiro Ohara ,  Naoshi Nakagawa ,  Toshinori Tsugaru

IPC分类号： C08F6/00 ,  C08F8/12 ,  C08F8/00

CPC分类号： C08F6/003 ,  C08F8/12 ,  C08J5/18 ,  C08F2800/10 ,  C08F2800/20 ,  C08F2810/20

摘要： A process for producing vinyl acetate polymers comprises, after polymerization of at least one monomer comprising vinyl acetate, adding a conjugated polyene having a boiling point of at least 20.degree. C. Saponified products of the vinyl acetate polymers obtained by this process can give molded articles causing little coloring and generation of gel-like agglomerates.

摘要翻译： 制备乙酸乙烯酯聚合物的方法包括在包含乙酸乙烯酯的至少一种单体的聚合之后，加入沸点为至少20℃的共轭多烯。通过该方法获得的乙酸乙烯酯聚合物的皂化产物可以产生模制品 引起凝胶状附聚物的少量着色和产生。