Abstract:
A heat exchanger has an intake header, a discharge header, a bundle of tubes extending in parallel between the intake header and the discharge header, an intake pipe connected to the intake header and extending transversely to the axes of the tubes of the bundle, the intake pipe having a first end opening into the header and a second end connectable to a process fluid supply pipe, and a baffle assembly for modifying the direction and rate of flow of the process fluid through the intake header, the baffle assembly being located within the intake pipe and secured to the intake pipe at a position adjacent the second end of the intake pipe. The baffle assembly comprises a plurality of slats lying in planes generally parallel to one another and inclined to the direction of fluid flow, and runners connected to the ends thereof to form a rigid structure.
Abstract:
Methods, apparatuses, and systems for fluid connections in modular cooling systems for cooling electronic components installed in equipment racks. A cold plate is positioned adjacent to a support manifold in a mated position, where the cold plate comprises a plate connector. The plate connector comprises a plate outer sleeve and defines a central passageway. The support manifold comprises a manifold connector, which comprises a manifold outer sleeve and defines a central passageway. An outer surface of the manifold outer sleeve is positioned adjacent to an outer surface of the plate outer sleeve. A cam is rotated about a pivot pin and engages with a plate retainer to secure the cold plate against the support manifold, and the central passageway of the plate connector is connected in fluid communication with the central passageway of the manifold connector.
Abstract:
A fluid level control system includes: a first immersion cooling tank having a first volume of immersion cooling liquid and an inlet/outlet pipe extending from a base wall of the tank by which immersion cooling liquid can flow into and out of the first immersion cooling tank; at least one second volume of cooling liquid held within a liquid containing unit having a corresponding inlet/outlet pipe; and a pipe distribution system that physically connects the second volume of immersion cooling liquid to the first volume of immersion cooling liquid via respective inlet/outlet pipes and which enables fluid equilibrium to be maintained between the first volume of liquid and the second volume of liquid via gravitational equilibrium and/or passive level control such that a first volume level of the first volume of immersion cooling liquid remains substantially equal to a second volume level of the second volume of immersion cooling liquid.
Abstract:
A cooling package for a machine is disclosed. The cooling package includes a heat exchanger pivotably coupled to a frame of the machine. A fan assembly is pivotably coupled to the heat exchanger. In one embodiment, the cooling package includes at least one isolation mount configured to couple a fan shroud of the fan assembly with the frame. The cooling package also includes at least one latch to couple the fan shroud with the heat exchanger.
Abstract:
A mounting arrangement for mounting a cooler unit to a work machine has a traveling device, a machine body frame, an engine and the cooler unit disposed adjacent the engine. The arrangement includes a support deck provided in the machine body frame for supporting the cooler unit, an attachment unit for releasably fixing the cooler unit to the machine body frame and a movement mechanism provided between the cooler unit and the support deck, the movement mechanism allowing the cooler unit to effect a translational movement to change a distance relative to the engine.
Abstract:
A heat exchange system for use in fluid operated equipment to provide air and working fluid heat exchanges to cool the working fluid in airstreams on a stream side of a wall. An actuator is mounted to be substantially located on a side of the wall opposite the stream side thereof having a positionable motion effector. A heat exchanger core having a plurality of passageway structures therein to enable providing the working fluid to, and removal therefrom. The heat exchanger core is mounted on the motion effector so as to be extendable and retractable thereby through the opening for selected distances into that region to be occupied by the airstreams.
Abstract:
A reaction vessel having a reaction chamber for holding a sample is fabricated by producing a housing having a rigid frame defining the minor walls of the chamber. The housing also defines a port for introducing fluid into the chamber. At least one sheet or film is attached to the rigid frame to form at least one major wall of the chamber. In preferred embodiments, two sheets or films are attached to opposite sides of the rigid frame to form two opposing major walls of the chamber, the major walls being connected to each other by the minor walls.
Abstract:
Apparatus for supporting a heat exchanger such as a condenser of an air conditioning system on a vehicle, for pivotal movement between an operational position and a position angularly related to the operational position, for such purposes as inspection, cleaning, service and maintenance, the apparatus being configured for holding the heat exchanger in the operational position, and for guiding and controlling movement thereof to the tilted position, and holding the heat exchanger in the tilted position.
Abstract:
A reaction vessel having a reaction chamber for holding a sample is fabricated by producing a housing having a rigid frame defining the minor walls of the chamber. The housing also defines a port for introducing fluid into the chamber. At least one sheet or film is attached to the rigid frame to form at least one major wall of the chamber. In preferred embodiments, two sheets or films are attached to opposite sides of the rigid frame to form two opposing major walls of the chamber, the major walls being connected to each other by the minor walls.
Abstract:
A cooling system for devices having power semiconductors and a method for cooling the device is disclosed. In one embodiment, the cooling system has printed circuit boards arranged on a circuit carrier in plug-in contact strips. The cooling system itself has a cooling plate, which is mounted in a pivotable manner on one of the plug-in contact strips in the region of the power semiconductor component. The cooling plate can be pivoted about an axis in such a way that it assumes a first position, which is pivoted away from the printed circuit board, and a second position, in which the cooling plate bears on the power semiconductor component.