MEMORY DEVICE, MEMORY CELL READ CIRCUIT, AND CONTROL METHOD FOR MISMATCH COMPENSATION

    公开(公告)号:US20240087617A1

    公开(公告)日:2024-03-14

    申请号:US18518578

    申请日:2023-11-23

    Inventor: Ku-Feng Lin

    CPC classification number: G11C7/06

    Abstract: A memory device that includes a first memory cell, a second memory cell and a sense amplifier. The sense amplifier includes a first branch and a second branch and are configured to output a first voltage and a second voltage to the first memory and the second memory, respectively in a trimming operation. A first clamp device of the sense amplifier includes a first clamp transistor and a plurality of first trimming transistors that are coupled to the first clamp transistor in parallel. The gate terminals of the first clamp transistor and the plurality of first trimming transistors are biased by a fixed clamp voltage. Each of the plurality of first trimming transistors is selectively conducted to compensate a mismatch between the first voltage and the second voltage.

    Memory device with electrically parallel source lines

    公开(公告)号:US11910723B2

    公开(公告)日:2024-02-20

    申请号:US17032638

    申请日:2020-09-25

    Inventor: Ku-Feng Lin

    Abstract: A memory device includes a memory cell array having a plurality of memory cells arranged in rows and columns, each row of memory cells being associated with a word line, each column of memory cells being associated with a bit line and a source line. Each memory cell includes: a storage device coupled to the bit line, the storage device being selectable between a first resistance state and a second resistance state in response to a bit line signal at the bit line; and a selection device connected in series with the storage device and coupled to the source line, the selection device being configured to provide access to the storage device in response to a word line signal at the word line. The memory device further includes a word-line driver and a bit-line driver. A first number of the source lines are connected in parallel.

    MEMORY DEVICE, SENSE AMPLIFIER AND METHOD FOR MISMATCH COMPENSATION

    公开(公告)号:US20230123830A1

    公开(公告)日:2023-04-20

    申请号:US18084570

    申请日:2022-12-20

    Inventor: Ku-Feng Lin

    Abstract: A memory device that includes a first memory cell, a second memory cell and a sense amplifier. The sense amplifier includes a first branch and a second branch and are configured to output a first voltage and a second voltage to the first memory and the second memory, respectively in a trimming operation. A first clamp device of the sense amplifier includes a first clamp transistor and a plurality of first trimming transistors that are coupled to the first clamp transistor in parallel. The gate terminals of the first clamp transistor and the plurality of first trimming transistors are biased by a fixed clamp voltage. Each of the plurality of first trimming transistors is selectively conducted to compensate a mismatch between the first voltage and the second voltage.

    Symmetry unary code encoder
    68.
    发明授权

    公开(公告)号:US11575387B2

    公开(公告)日:2023-02-07

    申请号:US16709622

    申请日:2019-12-10

    Abstract: An encode apparatus and an encode method may be provided. The encoding apparatus may comprise a first stage and a second stage. The first stage may be configured to receive a first input, decode the first input, and produce a first output comprising the decoded first input. The second stage may be configured to receive a second input, receive the first output from the first stage, and convert the first input and the second input from a first coding system to a second coding system based on the second input and the first output. The second stage may produce a second output comprising the converted first input and the converted second input.

    SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20220285434A1

    公开(公告)日:2022-09-08

    申请号:US17362936

    申请日:2021-06-29

    Abstract: A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first bonding structure and a memory cell. The second semiconductor device is stacked over the first semiconductor device. The second semiconductor device includes a second semiconductor substrate, a second bonding structure in a second dielectric layer and a peripheral circuit between the second semiconductor substrate and the second bonding structure. The first bonding structure and the second bonding structure are bonded and disposed between the memory cell and the peripheral circuit, and the memory cell and the peripheral circuit are electrically connected through the first bonding structure and the second bonding structure.

    Segmented reference trimming for memory arrays

    公开(公告)号:US11250908B2

    公开(公告)日:2022-02-15

    申请号:US16544309

    申请日:2019-08-19

    Abstract: A method for sensing logical states of memory cells in multiple segments in a memory device, each cell having a high- and low-resistance state, resulting in different cell current levels for the different resistance states. The method includes determining target reference current levels for the respective segments, at least two of the target reference current levels being different from each other; generating a reference current for each segment with the target reference current level for that segment; comparing the cell current level for each cell to the reference current level for the segment the cell is in; and determining the logical states of the memory cells based on the comparison.

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