Abstract:
According to example embodiments, a semiconductor device and a method for manufacturing the same are provided, the semiconductor device includes a substrate including a PMOSFET region and an NMOSFET region, a first gate electrode and a second gate electrode on the PMOSFET region, a third gate electrode and a fourth gate electrode on the NMOSFET region, and a first contact and a second contact connected to the first gate electrode and the fourth gate electrode, respectively. The first to fourth gate cut electrodes define a gate cut region that passes between the first and third gate electrodes and between the second and fourth gate electrodes. A portion of each of the first and second contacts overlaps with the gate cut region when viewed from a plan view.
Abstract:
A semiconductor device includes a fin region with long and short sides, a first field insulating layer including a top surface lower than that of the fin region and adjacent to a side surface of the short side of the fin region, a second field insulating layer including a top surface lower than that of the fin region and adjacent to a side surface of the long side of the fin region, an etch barrier pattern on the first field insulating layer, a first gate on the fin region and the second field insulating layer to face a top surface of the fin region and side surfaces of the long sides of the fin region. A second gate is on the etch barrier pattern overlapping the first field insulating layer. A source/drain region is between the first gate and the second gate, in contact with the etch barrier pattern.
Abstract:
A portable terminal is provided. The portable terminal includes a flexible display disposed on a front surface of the portable terminal and extending to a side surface of the portable terminal, the flexible display unit including a main display area on the front surface, and an auxiliary display area on the side surface; a sensor that detects a state of the portable terminal; and a controller that selectively outputs event information on the main display area or the auxiliary display area of the flexible display unit according to the detected state of the portable terminal.
Abstract:
A semiconductor device includes a fin region with long and short sides, a first field insulating layer including a top surface lower than that of the fin region and adjacent to a side surface of the short side of the fin region, a second field insulating layer including a top surface lower than that of the fin region and adjacent to a side surface of the long side of the fin region, an etch barrier pattern on the first field insulating layer, a first gate on the fin region and the second field insulating layer to face a top surface of the fin region and side surfaces of the long sides of the fin region. A second gate is on the etch barrier pattern overlapping the first field insulating layer. A source/drain region is between the first gate and the second gate, in contact with the etch barrier pattern.
Abstract:
Provided are a handover method between heterogeneous networks and an apparatus thereof. The handover method between heterogeneous networks includes receiving a handover request message indicating a handover request from an evolved Node B (eNB) to the heterogeneous network, transmitting a first indirect data forwarding tunnel request requesting generation of an indirect data forwarding tunnel between the heterogeneous networks to an enhanced Packet Data Gateway (ePDG) when the handover request message is received, receiving ePDG address information of a tunneling target ePDG from the ePDG, transmitting a second indirect data forwarding tunnel request including the ePDG address information to a serving gateway, receiving S-GW address information from the serving gateway, and transmitting a handover command including the S-GW address information to the eNB. The method can prevent data from being lost during handover procedure between heterogeneous networks.