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    Assembly of Wafer Stacks
    62.
    发明申请
    Assembly of Wafer Stacks 有权
    晶圆堆组装

    公开(公告)号：US20150115413A1

    公开(公告)日：2015-04-30

    申请号：US14401606

    申请日：2013-05-15

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann

    IPC: H01L25/16 ,  H01L33/58 ,  H01L27/146

    CPC classification number: H01L25/167 ,  H01L23/544 ,  H01L25/0753 ,  H01L25/162 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L27/1469 ,  H01L33/58 ,  H01L2223/54426 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2933/0058 ,  H01L2924/00

    Abstract: A method of forming a wafer stack includes providing a sub-stack comprising a first wafer and a second wafer. The sub-stack includes a first thermally-curable adhesive at an interface between the upper surface of the first wafer and the lower surface of the second wafer. A third wafer is placed on the upper surface of the second wafer. A second thermally-curable adhesive is present at an interface between the upper surface of the second wafer and the lower surface of the third wafer. Ultra-violet (UV) radiation is provided in a direction of the upper surface of the third wafer to cure a UV-curable adhesive in openings in the second wafer and in contact with portions of the third wafer so as to bond the third wafer to the sub-stack at discrete locations. Subsequently, the third wafer and the sub-stack are heated so to cure the first and second thermally-curable adhesives.

    Abstract translation: 形成晶片堆叠的方法包括提供包括第一晶片和第二晶片的子堆叠。 子堆叠包括在第一晶片的上表面和第二晶片的下表面之间的界面处的第一可热固化粘合剂。 第三晶片被放置在第二晶片的上表面上。 第二可热固化粘合剂存在于第二晶片的上表面和第三晶片的下表面之间的界面处。 在第三晶片的上表面的方向上设置紫外线（UV）辐射，以在第二晶片的开口中固化可UV固化的粘合剂并与第三晶片的部分接触，以将第三晶片接合到 子堆栈在离散位置。 随后，加热第三晶片和副堆叠，以固化第一和第二热固化粘合剂。

    TESTING OF OPTICAL DEVICES
    63.
    发明申请
    TESTING OF OPTICAL DEVICES 有权

    公开(公告)号：US20140204370A1

    公开(公告)日：2014-07-24

    申请号：US14220690

    申请日：2014-03-20

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Matthias Gloor

    IPC: G01M11/00

    CPC classification number: G01M11/00 ,  G01D18/00 ,  G01N21/55 ,  G01R31/282 ,  G01S7/497 ,  G01S17/026

    Abstract: The present disclosure describes techniques for testing optical devices in a manner that, in some implementations, simulates the environment in which the devices will be used when they are integrated into the end-product or system. For example, one aspect includes providing a transparent sheet that is positioned near the optical device in a manner that simulates at least some aspects of the environment when the device is incorporated into the end-product or system. The testing can be performed, for example, while the optical devices are in production or at some other time prior to their being integrated into an end-product or system.

    Testing of optical devices
    64.
    发明授权
    Testing of optical devices 有权
    光学器件测试

    公开(公告)号：US08730480B2

    公开(公告)日：2014-05-20

    申请号：US14076820

    申请日：2013-11-11

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Matthias Gloor

    IPC: G01N21/55 ,  G01D18/00

    CPC classification number: G01M11/00 ,  G01D18/00 ,  G01N21/55 ,  G01R31/282 ,  G01S7/497 ,  G01S17/026

    Abstract: The present disclosure describes techniques for testing optical devices in a manner that, in some implementations, simulates the environment in which the devices will be used when they are integrated into the end-product or system. For example, one aspect includes providing a transparent sheet that is positioned near the optical device in a manner that simulates at least some aspects of the environment when the device is incorporated into the end-product or system. The testing can be performed, for example, while the optical devices are in production or at some other time prior to their being integrated into an end-product or system.

    Abstract translation: 本公开描述了以下方式测试光学设备的技术：在一些实现中，模拟当设备将被集成到终端产品或系统中时将被使用的环境。 例如，一个方面包括提供一种位于光学装置附近的透明片材，以便在该装置被结合到最终产品或系统中时模拟环境的至少一些方面。 例如，可以在光学装置正在生产中或在将其集成到最终产品或系统之前的某个其他时间进行测试。

    Miniaturized Optical Devices, Such as Spectrometers and Spectrometer Modules, and Their Manufacture
    65.
    发明申请
    Miniaturized Optical Devices, Such as Spectrometers and Spectrometer Modules, and Their Manufacture 审中-公开

    公开(公告)号：US20190383979A1

    公开(公告)日：2019-12-19

    申请号：US16334239

    申请日：2017-09-15

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Markus Rossi ,  Hartmut Rudmann ,  Bassam Hallal

    IPC: G02B5/18 ,  G01J3/02 ,  G01J3/18 ,  G02B5/10 ,  G02B27/42

    Abstract: A method for manufacturing an optical device comprising providing a plurality of initials bars each having a first side face presented with a first optical component arrangement; positioning the initial bars in a row with their first side faces facing a neighboring one of the initial bars; fixing the initial bars to obtain a bar arrangement; obtaining prism bars by segmenting the bar arrangement by at least one of the steps: conducting a plurality of cuts so that each prism bar comprises a portion of at least two different ones of the initial bars, separating the bar arrangement into sections along cut lines or by creating cut faces at an angle with initial-bar directions; dividing the first optical component arrangement for obtaining a plurality of passive optical components, wherein each prism bar comprises one or more passive optical components comprising a first reflective face each which is of non-planar shape; segmenting prism bars into parts.

    Optical devices and methods of making same
    69.
    发明授权
    Optical devices and methods of making same 有权

    公开(公告)号：US10190908B2

    公开(公告)日：2019-01-29

    申请号：US15984278

    申请日：2018-05-18

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Qichuan Yu ,  Hartmut Rudmann ,  Ji Wang ,  Kian Siang Ng ,  Simon Gubser ,  Sonja Hanselmann

    IPC: H01L31/02 ,  G01J1/02 ,  H01L31/173

    Abstract: Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

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