公开(公告)号：US5626509A

公开(公告)日：1997-05-06

申请号：US395310

申请日：1995-02-28

申请人： Yoshihiro Hayashi

发明人： Yoshihiro Hayashi

IPC分类号： B24B53/00 ,  B24B53/013 ,  B24B53/017 ,  B24D11/00 ,  H01L21/304 ,  B24B29/00

CPC分类号： B24B53/017

摘要： An apparatus for surface treatment of polishing cloth includes a rotary cloth mounting section on which a polishing cloth is to be attached, and a rotary surface treatment tool made of an inorganic material other than metal and having at least a protrusion with an irregular surface portion on the surface thereof. The surface treatment tool and the cloth mounting section is rotated and a position of a rotation axis of a first rotating unit is different from that of a rotation axis of a second rotating unit. The rotating surface treatment tool is pressed against the cloth mounting section with a predetermined pressure while the surface treatment and cloth mounting sections are rotated.

摘要翻译： 抛光布的表面处理装置包括：旋转布安装部，其上安装有抛光布;以及旋转表面处理工具，由金属以外的无机材料制成，并且至少具有不规则表面部分的突起 其表面。 表面处理工具和布安装部旋转，第一旋转单元的旋转轴的位置与第二旋转单元的旋转轴的旋转轴的位置不同。 旋转表面处理工具在表面处理和布料安装部分旋转的同时以预定压力压靠在布安装部分上。

公开(公告)号：US4998665A

公开(公告)日：1991-03-12

申请号：US401980

申请日：1989-09-01

申请人： Yoshihiro Hayashi

发明人： Yoshihiro Hayashi

IPC分类号： H01L21/60 ,  H01L21/50 ,  H01L21/98 ,  H01L25/065 ,  H01L29/41

CPC分类号： H01L25/0657 ,  H01L21/50 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/16147 ,  H01L2224/16237 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81141 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2225/06593

摘要： First and second substrates are provided with a projection of a high melting point conductive material and an aperture filled at the bottom plane with a low melting point conductive material, respectively. The projection of the first substrate is plunged into the low melting point conductive material which is molten in the aperture by heating, so that the projection and the low melting point conductive material are bonded mechanically and electrically by cooling.

摘要翻译： 第一基板和第二基板分别设置有高熔点导电材料的突起和在底面填充有低熔点导电材料的孔。 第一基板的突起被插入通过加热在孔中熔融的低熔点导电材料，使得突起和低熔点导电材料通过冷却机械地和电气地接合。

公开(公告)号：US4738806A

公开(公告)日：1988-04-19

申请号：US892085

申请日：1986-07-30

申请人： Kouichi Noma ,  Kazuto Matsuda ,  Tadao Okada ,  Toru Sugawara ,  Yoshihiro Hayashi ,  Masahiro Nakamura ,  Etsuo Inamura

发明人： Kouichi Noma ,  Kazuto Matsuda ,  Tadao Okada ,  Toru Sugawara ,  Yoshihiro Hayashi ,  Masahiro Nakamura ,  Etsuo Inamura

IPC分类号： A47F3/04 ,  B05B17/06 ,  B01F3/04

CPC分类号： B05B17/0615 ,  A47F3/0495 ,  Y10S261/14 ,  Y10S261/48

摘要： The present invention provides a humidifier for a refrigeration showcase comprising a plurality of ultrasonic vibrators for atomizing water, ultrasonic oscillation circuits provided for the vibrators respectively in corresponding relation thereto,and control means for varying the oscillation output of the oscillation circuit corresponding to at least one of the vibrators to control the amount of atomized water to be produced.

摘要翻译： 本发明提供了一种用于制冷陈列柜的加湿器，包括：多个用于雾化水的超声波振动器，分别与振动器相对应地设置的超声波振荡电路;以及控制装置，用于改变与至少一个振荡器对应的振荡电路的振荡输出 的振动器以控制要生产的雾化水的量。

公开(公告)号：US4437683A

公开(公告)日：1984-03-20

申请号：US300069

申请日：1981-09-08

申请人： Shigeru Moriya ,  Akio Yoshida ,  Yoshihiro Hayashi ,  Tatsushi Kubota ,  Hiroshi Tsuge

发明人： Shigeru Moriya ,  Akio Yoshida ,  Yoshihiro Hayashi ,  Tatsushi Kubota ,  Hiroshi Tsuge

IPC分类号： B60R22/06 ,  B60R21/10

CPC分类号： B60R22/06

摘要： An automatic seatbelt system which has a flexible tape extending continuously along a vehicle body form a roof side portion through a center pillar to a door so as to move a shoulder webbing connected to the roof side portion and a lab webbing connected to the door at the same time by a single driving sprocket wheel in response to an occupant entering or leaving a vehicle. The tape has a plurality of openings along the longitudinal direction thereof and the sprocket wheel is meshed with the tape by the openings. A shoulder guide rail is provided along the roof side portion of the vehicle body, within which a shoulder guide member guiding the shoulder webbing and connected to the trape is slidably received. A lap guide rail is provided along the door, within which a lap guide member guiding the lap webbing and connected to the tape is slidably received. When the sprocket wheel rotates, both shoulder and lap seatbelt webbings are simultaneously moved through the tape toward either the front side of the vehicle to provide an enough space for the occupant to enter the vehicle, or the rear side of the vehicle to place the webbings over the occupant at a seat.

摘要翻译： 一种自动安全带系统，其具有沿着车体连续延伸的柔性带，通过中心柱形成一个车顶侧部分到门，以便移动连接到屋顶侧部分的肩带和连接到门的实验室织带 通过单个驱动链轮同时响应乘员进入或离开车辆。 该带沿其长度方向具有多个开口，并且该链轮与该带通过开口啮合。 沿着车身的车顶侧部分设置有一个肩导轨，其中可滑动地接收引导肩带并连接到该车架的肩导引件。 沿着门提供了一个搭接导轨，其中可滑动地接收引导配合织带并连接到带的搭接引导构件。 当链轮旋转时，肩部和膝部安全带网带同时通过带子朝向车辆的前侧移动，以便为乘客进入车辆或车辆的后侧提供足够的空间以将网带 乘坐在座位上。

公开(公告)号：US3968978A

公开(公告)日：1976-07-13

申请号：US210033

申请日：1971-12-20

申请人： Yoshihiro Hayashi

发明人： Yoshihiro Hayashi

IPC分类号： B60R22/06 ,  B60R21/02

CPC分类号： B60R22/06

摘要： An automatic safety belt apparatus for restraining the occupant sitting on the seat of a motor vehicle, which comprises a plurality of elements which operatively cooperate so that, when the door of a vehicle is closed from an open position, the safety belt automatically position itself around both the hip and the shoulders of the occupant in a restraining manner. Upon releasing the belt member or opening the vehicle door, the safety belt apparatus operates in an opposite manner permitting the occupant to leave the vehicle unobstructed.

摘要翻译： 一种用于限制坐在机动车辆座椅上的乘员的自动安全带装置，其包括多个可操作地配合的元件，使得当车辆的门从打开位置关闭时，安全带自动定位在其周围 无论是臀部还是肩膀上的乘客都受到限制。 在释放带构件或打开车门时，安全带装置以相反的方式操作，从而允许乘客不受阻碍地离开车辆。

公开(公告)号：US08916466B2

公开(公告)日：2014-12-23

申请号：US13067960

申请日：2011-07-11

申请人： Mari Amano ,  Munehiro Tada ,  Naoya Furutake ,  Yoshihiro Hayashi

发明人： Mari Amano ,  Munehiro Tada ,  Naoya Furutake ,  Yoshihiro Hayashi

IPC分类号： H01L23/485 ,  H01L21/768 ,  H01L23/532

CPC分类号： H01L23/5226 ,  H01L21/76877 ,  H01L23/528 ,  H01L23/53233 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device includes a semiconductor substrate, an insulating film formed above the semiconductor substrate, and a multilayered wiring formed in a prescribed area within the insulating film. The multilayered wiring includes a dual damascene wiring positioned on at least one layer of the multilayered wiring. The dual damascene wiring includes an alloy having copper as a principal component. A concentration of at least one metallic element contained as an added component of the alloy in a via connected to the dual damascene wiring is 10% or more higher in a via connected to a wiring whose width exceeds by five or more times a diameter of the via than that in another via connected to another wiring of a smallest width in a same upper wiring layer of the multilayered wiring.

摘要翻译： 半导体器件包括半导体衬底，形成在半导体衬底上的绝缘膜，以及形成在绝缘膜内的规定区域中的多层布线。 多层布线包括位于多层布线的至少一层上的双镶嵌布线。 双镶嵌线包括以铜为主要成分的合金。 在连接到双镶嵌布线的通孔中作为合金的添加成分含有的至少一种金属元素的浓度在连接到宽度超过五倍或更多倍的布线的通孔中为10％以上 通过连接到多层布线的同一上布线层中的最小宽度的另一布线的通孔。

公开(公告)号：US08558334B2

公开(公告)日：2013-10-15

申请号：US13399475

申请日：2012-02-17

申请人： Makoto Ueki ,  Naoya Inoue ,  Yoshihiro Hayashi

发明人： Makoto Ueki ,  Naoya Inoue ,  Yoshihiro Hayashi

IPC分类号： H01L29/82 ,  H01L23/552 ,  H01L27/08 ,  H01L21/00

CPC分类号： H01L43/12 ,  H01L27/228 ,  H01L43/08

摘要： A semiconductor device in which MRAM is formed in a wiring layer A contained in a multilayered wiring layer, the MRAM having at least two first magnetization pinning layers in contact with a first wiring formed in a wiring layer and insulated from each other, a free magnetization layer overlapping the two first magnetization pinning layers in a plan view, and connected with the first magnetization pinning layers, a non-magnetic layer situated over the free magnetization layer, and a second magnetization pinning layer situated over the non-magnetic layer.

摘要翻译： 一种半导体器件，其中MRAM形成在包含在多层布线层中的布线层A中，所述MRAM具有与形成在布线层中并彼此绝缘的第一布线接触的至少两个第一磁化闭塞层，自由磁化 层在平面图中与两个第一磁化钉扎层重叠，并与第一磁化钉扎层，位于自由磁化层上方的非磁性层和位于非磁性层上的第二磁化钉扎层连接。

公开(公告)号：US08492266B2

公开(公告)日：2013-07-23

申请号：US13302348

申请日：2011-11-22

申请人： Makoto Ueki ,  Takahiro Onodera ,  Yoshihiro Hayashi

发明人： Makoto Ueki ,  Takahiro Onodera ,  Yoshihiro Hayashi

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： H01L23/5329 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02274 ,  H01L21/0234 ,  H01L21/3105 ,  H01L21/31633 ,  H01L21/31695 ,  H01L21/7682 ,  H01L21/76826 ,  H01L21/76829 ,  H01L21/76832 ,  H01L23/5222 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2221/1047 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a semiconductor device, which includes an interlayer insulating film formed on a semiconductor substrate, a wiring layer filled in a recess formed in the interlayer insulating film, and a cap insulating film. The interlayer insulating film includes a first SiOCH film and a surface modification layer including an SiOCH film formed by modifying a surface layer of the first SiOCH film, the SiOCH film having a lower carbon concentration and a higher oxygen concentration than the first SiOCH film has. The cap insulating film contacts with surfaces of the metal wiring and the surface modification layer.

摘要翻译： 提供了一种半导体器件，其包括形成在半导体衬底上的层间绝缘膜，填充在形成于层间绝缘膜中的凹部中的布线层和帽绝缘膜。 层间绝缘膜包括第一SiOCH膜和包括通过改性第一SiOCH膜的表面层形成的SiOCH膜的表面改性层，具有比第一SiOCH膜具有更低的碳浓度和更高的氧浓度的SiOCH膜具有。 盖绝缘膜与金属布线和表面改性层的表面接触。

公开(公告)号：US08426322B2

公开(公告)日：2013-04-23

申请号：US13029866

申请日：2011-02-17

申请人： Hironori Yamamoto ,  Jun Kawahara ,  Tomonori Sakaguchi ,  Yoshihiro Hayashi

发明人： Hironori Yamamoto ,  Jun Kawahara ,  Tomonori Sakaguchi ,  Yoshihiro Hayashi

IPC分类号： H01L21/312

CPC分类号： H01L21/02274 ,  C23C16/401 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/76807 ,  H01L21/7682 ,  H01L2221/1047

摘要： In a method for producing a semiconductor device, two or more kinds of organic siloxane compound materials each having a cyclic SiO structure as a main skeleton and having different structures are mixed and thereafter vaporized. Alternatively, those two or more kinds of organic siloxane compound materials are mixed and vaporized simultaneously to produce a vaporized gas. Then, the vaporized gas is transported to a reaction furnace together with a carrier gas. Then, in the reaction furnace, a porous insulating layer is formed by the plasma CVD method or the plasma polymerization method using the vaporized gas.

摘要翻译： 在半导体装置的制造方法中，将具有环状SiO结构作为主骨架且具有不同结构的两种以上的有机硅氧烷化合物混合，然后蒸发。 或者，将这两种或更多种有机硅氧烷化合物材料同时混合并蒸发以产生汽化气体。 然后，蒸发的气体与载气一起输送到反应炉。 然后，在反应炉中，通过等离子体CVD法或使用汽化气体的等离子体聚合法形成多孔绝缘层。

公开(公告)号：US08378341B2

公开(公告)日：2013-02-19

申请号：US12654205

申请日：2009-12-14

申请人： Yoshihiro Hayashi ,  Naoya Inoue ,  Kishou Kaneko

发明人： Yoshihiro Hayashi ,  Naoya Inoue ,  Kishou Kaneko

IPC分类号： H01L29/18 ,  H01L21/00

CPC分类号： H01L21/76807 ,  H01L21/28282 ,  H01L21/76877 ,  H01L27/1225 ,  H01L27/124 ,  H01L29/24 ,  H01L29/242 ,  H01L29/41 ,  H01L29/42344 ,  H01L29/42352 ,  H01L29/4908 ,  H01L29/495 ,  H01L29/4966 ,  H01L29/518 ,  H01L29/66757 ,  H01L29/66969 ,  H01L29/78648 ,  H01L29/7869 ,  H01L29/792

摘要： A semiconductor device of the present invention has a first interconnect layer formed over the semiconductor substrate, and a semiconductor element; the first interconnect layer has an insulating layer, and a first interconnect filled in a surficial portion of the insulating layer; the semiconductor element has a semiconductor layer, a gate insulating film, and a gate electrode; the semiconductor layer is positioned over the first interconnect layer; the gate insulating film is positioned over or below semiconductor layer; and the gate electrode is positioned on the opposite side of the semiconductor layer while placing the gate insulating film in between.

摘要翻译： 本发明的半导体器件具有形成在半导体衬底上的第一互连层和半导体元件; 所述第一互连层具有绝缘层，以及填充在所述绝缘层的表面部分中的第一互连层; 半导体元件具有半导体层，栅极绝缘膜和栅电极; 半导体层位于第一互连层上方; 栅绝缘膜位于半导体层之上或之下; 并且栅极电极位于半导体层的相反侧，同时将栅极绝缘膜放置在其间。