公开(公告)号：US20100152612A1

公开(公告)日：2010-06-17

申请号：US12617083

申请日：2009-11-12

Applicant: F. Anthony HEADLEY, JR. ,  Robert B. DeVries ,  Kenneth Blair ,  James Weldon ,  Adam Cohen

Inventor： F. Anthony HEADLEY, JR. ,  Robert B. DeVries ,  Kenneth Blair ,  James Weldon ,  Adam Cohen

IPC: A61B10/04 ,  A61B10/06

CPC classification number: A61B10/04 ,  A61B1/018 ,  A61B1/273 ,  A61B10/0283 ,  A61B10/06 ,  A61B17/22 ,  A61B17/22031 ,  A61B17/221 ,  A61B17/320016 ,  A61B17/32056 ,  A61B2010/0225 ,  A61B2017/306

Abstract: Embodiments of the invention include an endoscope including multiple lumens for tissue acquisition and removal and related methods of use.

Abstract translation: 本发明的实施例包括一种内窥镜，其包括用于组织获取和去除的多个腔和相关的使用方法。

公开(公告)号：US20080106280A1

公开(公告)日：2008-05-08

申请号：US11928707

申请日：2007-10-30

Applicant: Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis Smalley

Inventor： Richard Chen ,  Ezekiel Kruglick ,  Christopher Bang ,  Vacit Arat ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Dennis Smalley

IPC: G01R1/067

CPC classification number: G01R3/00 ,  A61N1/00 ,  C25D1/00 ,  C25D1/003 ,  G01R1/06722 ,  G01R1/06744 ,  G01R1/06761

Abstract: Multilayer probe structures for testing or otherwise making electrical contact with semiconductor die or other electronic components are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include configurations intended to enhance functionality, buildability, or both.

Abstract translation: 用于测试或以其他方式与半导体管芯或其他电子部件进行电接触的多层探针结构通过在多个覆盖层和附着层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，结构可以包括旨在增强功能性，可构建性或两者的配置。

公开(公告)号：US20080100315A1

公开(公告)日：2008-05-01

申请号：US11928398

申请日：2007-10-30

Applicant: Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

Inventor： Vacit Arat ,  Adam Cohen ,  Dennis Smalley ,  Ezekiel Kruglick ,  Richard Chen ,  Kieun Kim

IPC: G01R1/067

CPC classification number: G01R1/06711 ,  G01R1/06716 ,  G01R1/06733 ,  G01R1/06744 ,  G01R3/00

Abstract: Multilayer test probe structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments each probe structure may include a plurality of contact arms or contact tips that are used for contacting a specific pad or plurality of pads wherein the arms and/or tips are configured in such away so as to provide a scrubbing motion (e.g. a motion perpendicular to a primary relative movement motion between a probe carrier and the IC) as the probe element or array is made to contact an IC, or the like, and particularly when the motion between the probe or probes and the IC occurs primarily in a direction that is perpendicular to a plane of a surface of the IC. In some embodiments arrays of multiple probes are provided and even formed in desired relative position simultaneously.

Abstract translation: 多层测试探针结构通过在多个覆盖层和粘附层中的一种或多种材料的沉积进行电化学制造。 在一些实施例中，每个探针结构可以包括用于接触特定垫或多个垫的多个接触臂或接触尖端，其中臂和/或尖端被配置成如此远离以提供擦洗运动（例如， 当探针元件或阵列与探针载体和IC之间的初级相对移动运动垂直的运动）与IC等接触时，特别是当探针或探针与IC之间的运动主要发生在 方向垂直于IC的表面的平面。 在一些实施例中，多个探针的阵列被提供并且甚至同时形成在期望的相对位置。

公开(公告)号：US20080093424A1

公开(公告)日：2008-04-24

申请号：US11929539

申请日：2007-10-30

Applicant: Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

Inventor： Ananda Kumar ,  Ezekiel Kruglick ,  Adam Cohen ,  Kieun Kim ,  Gang Zhang ,  Richard Chen ,  Christopher Bang ,  Vacit Arat ,  Michael Lockard ,  Uri Frodis ,  Pavel Lembrikov ,  Jeffrey Thompson

IPC: B29C65/00 ,  B23K35/12

CPC classification number: B23K35/0222 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  C25D1/12 ,  G01R1/06744 ,  G01R1/07307 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L24/95 ,  H01L2221/68313 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/10126 ,  H01L2224/1147 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/1191 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/13076 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/81001 ,  H01L2224/81054 ,  H01L2224/81136 ,  H01L2224/8121 ,  H01L2224/8181 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/3651 ,  H01L2924/3841 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2924/00012

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

公开(公告)号：US20080062638A1

公开(公告)日：2008-03-13

申请号：US11685118

申请日：2007-03-12

Applicant: Adam Cohen ,  Daniel Feinberg ,  Christopher Bang

Inventor： Adam Cohen ,  Daniel Feinberg ,  Christopher Bang

IPC: H05K7/02 ,  H05K7/20

CPC classification number: B81C3/002 ,  B81B2201/042 ,  B81C3/008 ,  B81C2203/051 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/125 ,  H01P1/202 ,  H01P3/06 ,  H01P5/183 ,  H01P11/00 ,  H01P11/005 ,  H01P11/007 ,  H05K3/4647

Abstract: Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

Abstract translation: 提供用于接收多个部件的永久或临时对准和/或保持结构。 优选地，这些结构通过多个沉积操作（例如电沉积操作）一体地形成。 结构通常包括两个或更多个控制或辅助部件相对于彼此的定位的定位夹具，这些特征可以包括（1）定位引导件或止动件，其固定或至少部分地限制部件在一个或多个取向中的定位 或方向，（2）将定位的部件保持在期望的取向或位置的保持元件，和/或（3）接收和保持调节模块的定位和/或保持元件，组件可以被固定到其中， 微调零件的位置和/或取向。

公开(公告)号：US20080050524A1

公开(公告)日：2008-02-28

申请号：US11733195

申请日：2007-04-09

Applicant: Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

Inventor： Ananda Kumar ,  Jorge Albarran ,  Adam Cohen ,  Kieun Kim ,  Michael Lockard ,  Uri Frodis ,  Dennis Smalley

IPC: B05D1/38 ,  B05D3/00

CPC classification number: B81C1/00666 ,  C25D5/022

Abstract: Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.

Abstract translation: 用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作 牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。 呈现了六个主要实施例的组，它们分为十一个主要实施例。 一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

公开(公告)号：US20070112338A1

公开(公告)日：2007-05-17

申请号：US11598968

申请日：2006-11-14

Applicant: Adam Cohen ,  Dennis Smalley

Inventor： Adam Cohen ,  Dennis Smalley

IPC: A61B17/00

CPC classification number: A61B17/0482 ,  A61B17/0401 ,  A61B17/0469 ,  A61B17/0487 ,  A61B2017/00345 ,  A61B2017/00526 ,  A61B2017/0462 ,  A61B2017/0488 ,  A61B2017/0496 ,  A61B2017/06052 ,  A61B2017/06176

Abstract: Embodiments of invention are directed to micro-scale of mesoscale tissue approximation instruments that may be delivered to the body of a patient during minimally invasive or other surgical procedures. In one group of embodiments, the instrument has an elongated (longitudinal) configuration while with two sets of expandable wings that each have a toggle configuration that can be made to expand when located on opposite sides of a distal tissue region and a proximal tissue region and can then be made to move toward one another to bring the two tissue regions into more a proximal position. In some embodiments, multiple tissue approximation instruments are located within a delivery system for sequential delivery to a patient's body.

Abstract translation: 本发明的实施例涉及可在微创或其它外科手术过程中递送至患者体内的中尺度组织近似仪器的微尺度。 在一组实施例中，仪器具有细长（纵向）构造，同时具有两组可扩张翼，每组具有肘节配置，当位于远端组织区域和近端组织区域的相对侧时，可以使其膨胀， 然后可以使得彼此移动以使两个组织区域进入更靠近的位置。 在一些实施例中，多个组织近似仪器位于递送系统内，用于顺序递送给患者的身体。

公开(公告)号：US20060134831A1

公开(公告)日：2006-06-22

申请号：US11207477

申请日：2005-08-19

Applicant: Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Folk ,  Marvin Kilgo

Inventor： Adam Cohen ,  Vacit Arat ,  Michael Lockard ,  Christopher Folk ,  Marvin Kilgo

IPC: H01L21/50 ,  H01L21/48

CPC classification number: H01L21/4857 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/07378 ,  G01R3/00 ,  H01L23/13 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.

Abstract translation: 本发明的实施例提供了用于封装集成电路和/或具有包括导电互连元件的电化学制造的结构的其它电子部件的方法。 在一些实施例中，电化学产生的结构被制造在包括导电通孔的衬底上，而在其他实施例中，衬底是导电材料的固体块，或者包含允许流体流动保持封装的电子部件的期望热性能的导电材料 。

公开(公告)号：US20050215046A1

公开(公告)日：2005-09-29

申请号：US11029215

申请日：2005-01-03

Applicant: Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

Inventor： Adam Cohen ,  Michael Lockard ,  Kieun Kim ,  Qui Le ,  Gang Zhang ,  Uri Frodis ,  Dale McPherson ,  Dennis Smalley

IPC: B44C1/22 ,  C03C15/00 ,  C03C25/68 ,  C23F1/00 ,  C25D5/02 ,  C25D5/10 ,  H01L21/44 ,  H01L21/4763

CPC classification number: C25D1/20 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

公开(公告)号：US20050215023A1

公开(公告)日：2005-09-29

申请号：US11029221

申请日：2005-01-03

Applicant: Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

Inventor： Adam Cohen ,  Ananda Kumar ,  Michael Lockard ,  Dennis Smalley

IPC: G01R31/02 ,  H01L21/20

CPC classification number: G01R1/06716 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/0483 ,  G01R1/07357 ,  G01R31/2886

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.