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    Semiconductor device and manufacturing method thereof
    52.
    发明申请
    Semiconductor device and manufacturing method thereof 审中-公开
    半导体器件及其制造方法

    公开(公告)号：US20070126095A1

    公开(公告)日：2007-06-07

    申请号：US11607312

    申请日：2006-11-30

    Applicant: Hisashi Tanie

    Inventor： Hisashi Tanie

    IPC: H01L23/495

    CPC classification number: H05K1/0366 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/036 ,  H05K1/181 ,  H05K2201/0287 ,  H05K2201/068 ,  H05K2201/10734

    Abstract: A semiconductor device has a semiconductor package with a semiconductor element is mounted on a mounting substrate. The mounting substrate has at least two anisotropic areas which are located at both sides of a semiconductor package mounting area in a way to sandwich it and have an anisotropic linear expansion coefficient. In the anisotropic areas, a linear expansion coefficient in a direction toward a center of the semiconductor package mounting area is larger than a linear expansion coefficient in an in-plane direction of the mounting substrate perpendicular to the direction and larger than a linear expansion coefficient of the semiconductor package mounting area in a direction toward the anisotropic areas. The semiconductor device makes it possible to reduce thermal deformation of a semiconductor package mounting area of a mounting substrate easily and at low cost.

    Abstract translation: 具有半导体元件的半导体封装的半导体器件安装在安装基板上。 安装基板具有至少两个各向异性区域，其位于半导体封装安装区域的两侧，以夹持它并具有各向异性线性膨胀系数。 在各向异性区域中，朝向半导体封装安装区域的中心的方向的线膨胀系数大于垂直于方向的安装基板的面内方向的线膨胀系数，大于线膨胀系数 半导体封装安装区域朝向各向异性区域的方向。 半导体器件能够容易地且以低成本降低安装基板的半导体封装安装区域的热变形。

    Selective PCB stiffening with preferentially oriented fibers
    53.
    发明授权
    Selective PCB stiffening with preferentially oriented fibers 失效

    公开(公告)号：US07041357B2

    公开(公告)日：2006-05-09

    申请号：US10742024

    申请日：2003-12-17

    Applicant: George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

    Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

    IPC: B32B9/00

    CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

    Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

    Method of making a composite laminate and a PWB substrate so made
    58.
    发明授权
    Method of making a composite laminate and a PWB substrate so made 失效
    制造复合层叠体和PWB基板的方法

    公开(公告)号：US5874152A

    公开(公告)日：1999-02-23

    申请号：US682518

    申请日：1996-07-25

    Applicant: Erik Middelman

    Inventor： Erik Middelman

    IPC: B32B5/28 ,  B29B15/12 ,  B29C70/10 ,  B29C70/44 ,  B29C70/50 ,  H05K1/03 ,  H05K3/00 ,  H05K3/02 ,  B32B9/00

    CPC classification number: B29C70/506 ,  B29B15/122 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/2905 ,  Y10T428/30 ,  Y10T428/31721 ,  Y10T442/656

    Abstract: The invention relates to a method of making a composite laminate comprising the steps of providing unidirectionally oriented parallel fibres (UD filaments) (3) with a resin matrix to form a composite UD layer and laminating a plurality of UD layers to form a UD crossply laminate (18). In the method of the invention, the UD filaments are impregnated with a melt of a resin which in the uncured form solidifies below a certain temperature (Tm). Thereupon the UD filaments-containing resin is cooled to a temperature below Tm to produce the composite UD layer. The produced composite UD layer is irreversibly cured before or after lamination. Notably latent curing resins are suitable. The impregnation is preferably conducted by coating a process belt (8) with solid resin (6), laying the UD filaments onto the resin, and heating the resin so as to form the resin melt. The heating of the resin is preferably conducted by means of IR irradiation (11).

    Abstract translation: PCT No.PCT / EP95 / 00273 Sec。 371日期：1996年7月25日 102（e）日期1996年7月25日PCT提交1995年1月25日PCT公布。 出版物WO95 / 20475 日期：1995年8月3日本发明涉及一种复合层压制品的制造方法，该方法包括以下步骤：用树脂基质提供单向取向的平行纤维（UD长丝）（3），以形成复合UD层，并将多个UD层层压到 形成UD交叉层压板（18）。 在本发明的方法中，UD长丝用未固化形式的树脂熔体浸渍在一定温度（Tm）以下。 然后将含有UD长丝的树脂冷却至低于Tm的温度以产生复合UD层。 所制备的复合UD层在层压之前或之后不可逆地固化。 潜在的固化树脂是合适的。 浸渍优选通过用固体树脂（6）涂布处理带（8），将UD长丝铺设在树脂上并加热树脂以形成树脂熔体来进行。 树脂的加热优选通过IR照射进行（11）。

    Method of manufacturing a multilayer printed wire board
    60.
    发明授权
    Method of manufacturing a multilayer printed wire board 失效
    制造多层印刷线路板的方法

    公开(公告)号：US5592737A

    公开(公告)日：1997-01-14

    申请号：US157077

    申请日：1993-12-03

    Applicant: Erik Middelman ,  Pieter H. Zuuring

    Inventor： Erik Middelman ,  Pieter H. Zuuring

    IPC: H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  H05K3/24 ,  H05K3/32 ,  H05K3/36

    CPC classification number: H05K3/4655 ,  B32B37/12 ,  H05K1/0366 ,  B32B2457/08 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249994

    Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

    Abstract translation: PCT No.PCT / EP92 / 01133 Sec。 371日期1993年12月3日第 102（e）日期1993年12月3日PCT提交1992年5月19日PCT公布。 第WO92 / 22192号公报 日期1992年12月10日一种制造多层印刷线路板的方法，也被称为多层，其包括至少两个电绝缘基板，其中至少三个表面设置有导电迹线或层，其中通过 在压力下层叠的方法，在任一侧设置有痕迹的基于UD-增强合成材料的固化的基底基板与支撑基板结合并结合到支撑基板上，其中在层压过程期间添加备用基板 至基本衬底，备用衬底包括至少在面向碱性衬底的导电迹线的一侧上提供的UD增强的固化芯层，其具有仍然可塑性（可流动的）粘合剂层，并且这种压力施加在 所述层压板使所述支撑基板的所述固化芯层与所述基底基板的导电迹线接触或实际上与所述基底基板的导电迹线接触， 这些迹线填充有粘合剂材料，因此粘合基础基板和支撑基板。

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