Abstract:
A method of operating a nonvolatile memory device includes erasing data within a NAND string of memory cells within the memory device by applying a non-zero erase voltage to a source/drain terminal at a first end of the NAND string. This erase voltage is applied concurrently with establishing gate-induced drain leakage (GIDL) in a pair of selection transistors within the NAND string. This GIDL can occur by applying unequal and non-zero first and second voltages to respective first and second gate terminals of the pair of selection transistors. The selection transistors can be string selection transistors or ground selection transistors.
Abstract:
A three-dimensional (3D) nonvolatile memory device includes a cell string. The cell string includes a pillar structure comprising a ground selection transistor, a plurality of memory cells, and a string selection transistor stacked vertically over a substrate. The memory cells comprise a first cell group and a second cell group stacked on the first cell group, and a horizontal width of at least a portion of the pillar structure decreases in a depth direction towards the substrate. A method of programming the memory device includes initializing a channel of a memory cell of the first cell group of the cell string through the ground selection transistor of the pillar structure, and then applying a program voltage to the memory cell of the pillar structure of the cell string.
Abstract:
A nonvolatile memory device includes a memory cell array and a row decoder circuit. The row decoder circuit turns on memory cells of a plurality of cell strings of a selected memory block after applying a first prepulse to a first dummy word line connected to first dummy memory cells after applying a second prepulse to a second dummy word line connected to second dummy memory cells.
Abstract:
A nonvolatile memory device performs a read operation comprising first and second intervals. In the first interval the device applies a turn-on voltage to string selection lines and ground selection lines connected to the string selection transistors and the ground selection transistors, respectively. In the second interval, the device applies a turn-off voltage to unselected string selection lines and unselected ground selection lines while continuing to apply the turn-on voltage to a selected string selection line and a selected ground selection line. In both the first and second intervals, the device applies a first read voltage to a selected wordline connected to memory cells to be read by the read operation and applying a second read voltage to unselected wordlines among connected to memory cells not to be read by the read operation.
Abstract:
Non-volatile memory device channel boosting methods in which at least two strings are connected to one bit line, the channel boosting methods including applying an initial channel voltage to channels of strings in a selected memory block, floating inhibit strings each having an un-programmed cell among the strings, and boosting channels of the floated inhibit strings.
Abstract:
A memory device includes a memory cell array including a plurality of NAND strings, wherein each of the NAND strings includes a ground selection transistor connected to a ground selection line, memory cells connected to word lines, and a string selection transistor connected to a string selection line, wherein the ground selection line, the word lines, and the string selection line are vertically stacked on a substrate. A control logic adjusts a ground selection line voltage applied to the ground selection line or a string selection line voltage applied to the string selection line to a negative level in at least a portion of a program section during which a program operation related to a memory cell selected from among the memory cells is performed.
Abstract:
A three-dimensional flash memory device includes a plurality of cell strings arranged in a direction perpendicular to a substrate. The three-dimensional flash memory includes a first dummy word line disposed between a ground selection line and a main word line, and a second dummy word line disposed between the main word line and a string selection line and being asymmetric with respect to the first dummy word line. Voltages of different levels are respectively applied to the first and second dummy word lines during a read operation.
Abstract:
A memory device is provided as follows. A memory cell array includes strings including first and second strings. Each string includes a ground selection transistor and cell transistors. First and second ground selection lines are connected to a gate of a first ground selection transistor of the first string and a gate of a second ground selection transistor of the second string, respectively. First and second cell gate lines are connected to a gate of a first cell transistor of the first string and a gate of a second cell transistor of the second string, respectively. A first interconnection unit electrically connects a first portion of the first cell gate line to a first portion of the second cell gate line. A second interconnection unit electrically connects a second portion of the first cell gate line to a second portion of the second cell gate line.
Abstract:
A method of operating a non-volatile memory device includes performing an erasing operation to memory cells associated with a plurality of string selection lines (SSLs), the memory cells associated with the plurality of SSLs constituting a memory block, and verifying the erasing operation to second memory cells associated with a second SSL after verifying the erasing operation to first memory cells associated with a first SSL.
Abstract:
A non-volatile memory device comprises a memory cell array comprising memory cells arranged in rows connected to corresponding word lines and columns connected to corresponding bit lines, a page buffer that stores a program data, a read-write circuit that programs and re-programs the program data into selected memory cells of the memory cell array and reads stored data from the programmed memory cells, and a control circuit that controls the page buffer and the read-write circuit to program the selected memory cells by loaded the program data from in page buffer and to re-program the selected memory cells by re-loaded the program data in the page buffer.