公开(公告)号：US20120295522A1

公开(公告)日：2012-11-22

申请号：US13476654

申请日：2012-05-21

Applicant: ROBERT BRYAN BOGGS ,  Joseph Shannon Miller ,  Michael Scott Standridge ,  Jason Richard Shaw

Inventor： ROBERT BRYAN BOGGS ,  Joseph Shannon Miller ,  Michael Scott Standridge ,  Jason Richard Shaw

IPC: B24B29/00

CPC classification number: B24B21/006 ,  B24B19/02 ,  B24B21/08 ,  B24B21/18 ,  B24B51/00 ,  B24D11/04

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract translation: 本发明涉及一种用于将预定印模打磨成工件的装置。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中，垫接触图案带，促使图案带的凸起图案接触砂带。 由图案带接触的砂带的部分被推向工件，使得预定的印模被砂磨入工件。

公开(公告)号：US08277286B2

公开(公告)日：2012-10-02

申请号：US12370662

申请日：2009-02-13

Applicant: Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

Inventor： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

IPC: B24B1/00 ,  B24B57/02 ,  B24B29/00

CPC classification number: B24B57/02 ,  B24B37/04

Abstract: A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case.

Abstract translation: 化学机械抛光方法和装置提供了可变形的，可伸缩的浆料分配器臂，其联接到分配器头部，其可以是弓形的形状，并且还可以是可弯曲的伸缩构件，其可以被调节以改变浆料分配器端口的数量和 分配头的曲率。 分配器臂可以另外包括其中的浆料分配器端口。 分配器臂可以有利地由可相对于彼此滑动的多个嵌套管形成。 可调节的分配器臂可围绕枢转点枢转并且可以被不同地定位以适应用于抛光不同尺寸的基板的不同尺寸的抛光垫，并且可弯曲的可伸缩浆料分配器臂和分配器头部向各种晶片抛光位置 ，有效的浆料使用和均匀的抛光轮廓在每种情况下。

公开(公告)号：US20120149279A1

公开(公告)日：2012-06-14

申请号：US13284631

申请日：2011-10-28

Applicant: Karl G. Schwappach ,  Zine-Eddine Boutaghou

Inventor： Karl G. Schwappach ,  Zine-Eddine Boutaghou

IPC: B24B29/00 ,  B24B49/00 ,  B24B1/00

CPC classification number: B24D11/00 ,  Y10T29/5397

Abstract: An abrasive article for polishing a substrate surface. The abrasive article includes a holder pad assembly and an abrasive member held in place with respect to a holder pad. The abrasive member further includes a first surface engaged with the holder pad assembly, and a second surface including an abrasive. A preload mechanism is positioned to bias the second surfaces of the abrasive member toward the substrate surface. One or more fluid bearing features on the second surface of the abrasive member is configured to generate lift forces during relative motion between the abrasive article and the substrate surface.

Abstract translation: 用于抛光衬底表面的磨料制品。 研磨制品包括保持器垫组件和相对于保持器垫保持就位的研磨构件。 研磨构件还包括与保持器垫组件接合的第一表面和包括磨料的第二表面。 定位预载机构以将研磨构件的第二表面朝向衬底表面偏置。 研磨构件的第二表面上的一个或多个流体支承构件构造成在磨料制品和基底表面之间的相对运动期间产生升力。

公开(公告)号：US08145342B2

公开(公告)日：2012-03-27

申请号：US12891357

申请日：2010-09-27

Applicant: Sumeet S. Bhagavat ,  Roland R. Vandamme ,  Tomomi Komura ,  Tomhiko Kaneko ,  Takuto Kazama

Inventor： Sumeet S. Bhagavat ,  Roland R. Vandamme ,  Tomomi Komura ,  Tomhiko Kaneko ,  Takuto Kazama

IPC: G06F19/00 ,  G03C5/00 ,  G03F7/00 ,  H01L21/302 ,  H01L21/461 ,  B24B49/00 ,  B24B51/00 ,  B24B1/00 ,  B24B7/00 ,  B24B9/00 ,  B24B29/00 ,  B24B5/00

CPC classification number: B24B37/28 ,  B24B7/228 ,  B24B37/005 ,  B24B51/00

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract translation: 使用具有一对砂轮的双面研磨机处理晶片。 翘曲数据通过用于通过双面研磨机测量晶片的翘曲的翘曲测量装置获得。 接收翘曲数据，并且基于接收的翘曲数据预测晶片的纳米形貌。 基于晶片的预测的纳米形貌确定研磨参数。 基于确定的研磨参数调整双面研磨机的操作。

公开(公告)号：US20120003904A1

公开(公告)日：2012-01-05

申请号：US13154471

申请日：2011-06-07

Applicant: Roland SCHMITZ

Inventor： Roland SCHMITZ

IPC: B24B1/00 ,  B24B29/00

CPC classification number: B24B5/01 ,  B24B1/00 ,  B24B5/047

Abstract: A workpiece having a planar face the workpiece is rotated about a workpiece axis substantially perpendicular to the planar workpiece face, and a grinding disk centered on a disk axis is rotated about the disk axis. The disk has an annular planar disk face perpendicular to and centered on the disk axis and an annular frustoconical disk face extending from an edge of the planar disk face, centered on the disk axis, and angled inward from the planar disk face. A portion of the annular face is oriented perpendicular to the workpiece axis and pressed against the planar workpiece face to premachine most of the planar workpiece face. Thereafter the disk is pivoted and oriented parallel the planar workpiece face to finish machine the planar workpiece face with the planar disk face.

Abstract translation: 具有平面的工件，工件围绕基本上垂直于平面工件面的工件轴线旋转，并且以盘轴为中心的研磨盘围绕盘轴线旋转。 盘具有垂直于圆盘轴线并居中的环形平面盘面，以及圆盘形圆盘面，该平面圆盘面从平面盘面的边缘以圆盘轴为中心延伸并从平面盘面向内倾斜。 环形面的一部分定向为垂直于工件轴线并压靠在平面工件面上，以预加工大部分平面工件面。 此后，盘平行于平面工件面枢转定向，使平面工件面与平面盘面完成加工。

公开(公告)号：US08029640B2

公开(公告)日：2011-10-04

申请号：US12427642

申请日：2009-04-21

Applicant: Steven M. Zuniga ,  Thomas H. Osterheld

Inventor： Steven M. Zuniga ,  Thomas H. Osterheld

IPC: B24B5/00 ,  B24B29/00

CPC classification number: B24B41/06 ,  B24B37/30 ,  B24B37/32

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.

Abstract translation: 用于化学机械抛光装置的承载头包括具有柔性下部和刚性上部的保持环。

公开(公告)号：US20110130003A1

公开(公告)日：2011-06-02

申请号：US12627632

申请日：2009-11-30

Applicant: Gregory Eisenstock ,  Anurag Jain

Inventor： Gregory Eisenstock ,  Anurag Jain

IPC: H01L21/306 ,  C23F1/08 ,  B24B1/00 ,  B24B29/00 ,  B24B7/06

CPC classification number: B24B37/042 ,  B24B37/20 ,  B24B37/30 ,  B24B41/047 ,  H01L21/02024

Abstract: Methods and apparatus provide for a conformable polishing head for uniformly polishing a workpiece. The polishing head includes an elastic polishing pad mounted on an elastic membrane that seals a cavity in the polishing head. The cavity is pressurized to expand the membrane and press the polishing pad down on the top surface of the workpiece, such that the polishing pad conforms to the surface and applies a substantially uniform pressure distribution across the workpiece and thereby uniformly removes material across high and low spots on the workpiece.

Abstract translation: 方法和装置提供了用于均匀抛光工件的一致的抛光头。 抛光头包括安装在弹性膜上的弹性抛光垫，其密封抛光头中的空腔。 空腔被加压以膨胀膜并将抛光垫向下压在工件的顶部表面上，使得抛光垫符合表面并且在整个工件上施加基本上均匀的压力分布，从而均匀地去除高和低的材料 工件上的斑点。

公开(公告)号：US20110045745A1

公开(公告)日：2011-02-24

申请号：US12866485

申请日：2009-02-03

Applicant: Joke De Messemaeker ,  Stijn Put ,  Dirk Van-Genechten ,  Yves Van Rompaey ,  Daniël Nelis ,  Yvan Strauven ,  Gustaaf Van Tendeloo

Inventor： Joke De Messemaeker ,  Stijn Put ,  Dirk Van-Genechten ,  Yves Van Rompaey ,  Daniël Nelis ,  Yvan Strauven ,  Gustaaf Van Tendeloo

IPC: B24B29/00 ,  C09K3/14 ,  C09K13/00

CPC classification number: C01F17/0043 ,  B82Y30/00 ,  C01P2002/54 ,  C01P2002/77 ,  C01P2004/64 ,  C01P2006/12 ,  Y10T428/2982

Abstract: The present invention relates to doped ceria (CeO2) abrasive particles, having an essentially octahedral morphology. Such abrasives are used in water-based slurries for Chemical Mechanical Polishing (CMP) of subrates such as silicon wafers. The invention more particularly concerns yttrium-doped ceria particles having a specific surface area of 10 to 120 m2/g, characterized in that at least 95 wt %, preferably at least 99 wt %, of the particles are mono-crystalline and in that the particles' surfaces consist of more than 70%, preferably of more than 80%, of planes parallel to {111} planes. A novel gas phase process for synthesizing this product is also disclosed, comprising the steps of providing a hot gas stream, —and, introducing into said gas stream a cerium-bearing reactant, a dopant-bearing reactant, and an oxygen-bearing reactant, —the temperature of said gas stream being chosen so as to atomize said reactant, the reactant being selected so as to form, upon cooling, doped ceria particles. Abrasive slurries based on the above ceria offer a low level of induced detectivity in the polished substrate, while ensuring a good removal rate.

Abstract translation: 本发明涉及具有基本八面体形态的掺杂二氧化铈（CeO 2）磨料颗粒。 这种研磨剂用于水性浆料中用于诸如硅晶片的亚速率化学机械抛光（CMP）。 本发明更具体地涉及比表面积为10至120m 2 / g的掺钇二氧化铈颗粒，其特征在于至少95wt％，优选至少99wt％的颗粒是单晶的，并且其中 颗粒表面由大于70％，优选大于80％的平面{111}平面的平面组成。 还公开了一种用于合成该产品的新型气相方法，其包括提供热气流的步骤，并且向所述气流中引入含铈反应物，含掺杂剂的反应物和含氧反应物， - 选择所述气流的温度以雾化所述反应物，所述反应物被选择为在冷却时形成掺杂的二氧化铈颗粒。 基于上述二氧化铈的磨料浆料在抛光的基材中提供低水平的诱导检测，同时确保良好的去除速率。

公开(公告)号：US20100255760A1

公开(公告)日：2010-10-07

申请号：US12384585

申请日：2009-04-06

Applicant: Oscar Brooks Marshall, JR.

Inventor： Oscar Brooks Marshall, JR.

IPC: B24B1/04 ,  B24B29/00

CPC classification number: B24B1/04 ,  B24B29/00

Abstract: The vibratory polisher system of this embodiment comprises six sub-systems: casting, polish pan assembly, base assembly, vibrating table assy (not a part of this invention), pan bracket assembly, casting circulator system, and horizontal slide assembly. The casting is comprised of an assembly of flat-bottomed rocks cemented into a flat-bottomed disc having a propulsion attachment. The casting circulates in a polish pan having a flexible bottom containing raised areas which put pressure on isolated areas of the casting bottom. There is an area at the pan center that can be raised by means of a gearing system to put pressure on the center area of the casting. The base assembly supports the polish pan and provides the bolt-heads that cause the raised areas in the polish pan. The base assembly also provides attachment points for the pan bracket assemblies which pull the polish pan down onto the bolt-heads thus causing the raised areas in the pan bottom. The pan bracket assemblies do not put any holes in the polish pan, thus preventing water leakage. There is a center-bump bolt whose height is controlled by a gearing system. This center-bump bolt causes the center of the polish pan to be either higher or lower. This controls the polishing or non polishing of the center portion of the casting.The vibrating table (not a part of this invention) supports the base and polish pan and provides vibration to assist in circulating the casting around the pan, as well as providing a rubbing motion to polish the casting. The circulator system circulates the casting around the polish pan and rotates the casting on its own axis. As the casting circulates and rotates, its bottom area passes over the raised areas of the pan in a random pattern, thus eventually polishing the entire casting surface. The casting is supported by a support box which allows the casting to be moved linearly in the pan. This allows polishing to occur over any areas that may be missed during casting circulation. A procedure for preparing a casting is presented.

公开(公告)号：US20100048106A1

公开(公告)日：2010-02-25

申请号：US12196860

申请日：2008-08-22

Applicant: YULIN WANG ,  Alpay Yilmaz

Inventor： YULIN WANG ,  Alpay Yilmaz

IPC: B24B57/02 ,  B24B7/00 ,  B24B29/00

CPC classification number: B24B57/02 ,  B24B37/04 ,  B24B37/042

Abstract: A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen.

Abstract translation: 化学机械抛光机包括能够支撑抛光垫的研磨台板，以及能够将基板保持在抛光垫上的第一和第二基板载体。 第一和第二浆液分配器，每个包括（i）包括枢转端和远端的臂，（ii）在远端上的至少一个浆料分配喷嘴，以及（iii）能够围绕 枢转端以使浆料分配喷嘴在远端摆动，以将浆料分配到抛光台板上。