Invention Grant
US08277286B2 Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method
有权
用于化学机械抛光(CMP)设备和方法的浆料分配器
- Patent Title: Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method
- Patent Title (中): 用于化学机械抛光(CMP)设备和方法的浆料分配器
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Application No.: US12370662Application Date: 2009-02-13
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Publication No.: US08277286B2Publication Date: 2012-10-02
- Inventor: Kun-Ku Hung , Zin-Chang Wei , Huang Soon Kang , Chyi-Shyuan Chern
- Applicant: Kun-Ku Hung , Zin-Chang Wei , Huang Soon Kang , Chyi-Shyuan Chern
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Duane Morris LLP
- Main IPC: B24B1/00
- IPC: B24B1/00 ; B24B57/02 ; B24B29/00

Abstract:
A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case.
Public/Granted literature
- US20100210189A1 SLURRY DISPENSER FOR CHEMICAL MECHANICAL POLISHING (CMP) APPARATUS AND METHOD Public/Granted day:2010-08-19
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