Invention Grant
US08145342B2 Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
有权
使用来自翘曲数据的反馈来调整晶片研磨机的操作的方法和系统
- Patent Title: Methods and systems for adjusting operation of a wafer grinder using feedback from warp data
- Patent Title (中): 使用来自翘曲数据的反馈来调整晶片研磨机的操作的方法和系统
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Application No.: US12891357Application Date: 2010-09-27
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Publication No.: US08145342B2Publication Date: 2012-03-27
- Inventor: Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura , Tomhiko Kaneko , Takuto Kazama
- Applicant: Sumeet S. Bhagavat , Roland R. Vandamme , Tomomi Komura , Tomhiko Kaneko , Takuto Kazama
- Applicant Address: US MO St. Peters
- Assignee: MEMC Electronic Materials, Inc.
- Current Assignee: MEMC Electronic Materials, Inc.
- Current Assignee Address: US MO St. Peters
- Agency: Armstrong Teasdale LLP
- Main IPC: G06F19/00
- IPC: G06F19/00 ; G03C5/00 ; G03F7/00 ; H01L21/302 ; H01L21/461 ; B24B49/00 ; B24B51/00 ; B24B1/00 ; B24B7/00 ; B24B9/00 ; B24B29/00 ; B24B5/00
Abstract:
Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.
Public/Granted literature
- US20110045740A1 Methods and Systems For Adjusting Operation Of A Wafer Grinder Using Feedback from Warp Data Public/Granted day:2011-02-24
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