Methods for a multilayer retaining ring
    3.
    发明授权
    Methods for a multilayer retaining ring 有权
    多层保持环的方法

    公开(公告)号:US07534364B2

    公开(公告)日:2009-05-19

    申请号:US10826185

    申请日:2004-04-15

    CPC classification number: B24B41/06 B24B37/30 B24B37/32

    Abstract: A substrate is maintained beneath a substrate mounting surface with a retaining ring that includes a generally annular lower portion having a bottom surface for contacting the polishing surface during polishing, and a generally annular upper portion having a bottom surface joined to the lower portion and a top surface fixed to and abutting the base. The lower portion is made of a plastic and the upper lower portion is made of a metal which is more rigid than the plastic.

    Abstract translation: 衬底被保持在衬底安装表面下方,其具有保持环,保持环包括大体上环形的下部,其具有用于在抛光期间接触抛光表面的底表面,以及大致环形的上部,其具有连接到下部的底面, 表面固定到基座上并邻接基座。 下部由塑料制成,上部的上部由比塑料更硬的金属制成。

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