公开(公告)号：US20120208438A1

公开(公告)日：2012-08-16

申请号：US13450978

申请日：2012-04-19

Applicant: ALPAY YILMAZ ,  Allen L. D'Ambra ,  Jagan Rangarajan ,  Lakshmanan Karuppiah

Inventor： ALPAY YILMAZ ,  Allen L. D'Ambra ,  Jagan Rangarajan ,  Lakshmanan Karuppiah

IPC: B24B47/12 ,  B24B49/10 ,  B24B47/20

CPC classification number: B24B37/04 ,  B24B41/047 ,  B24B45/003

Abstract: Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.

Abstract translation: 本文所述的实施例涉及抛光系统中的轨道系统。 本文所述的一个实施例提供了一种配置成在抛光系统中传送抛光头的轨道系统。 轨道系统包括支撑框架，轨道，其联接到支撑框架并且限定抛光头被配置为移动的路径，以及一个或多个托架，其构造成沿着由轨道限定的路径承载至少一个抛光头， 其中所述一个或多个托架联接到所述轨道并且可以沿着所述轨道独立地移动。

公开(公告)号：US20100048106A1

公开(公告)日：2010-02-25

申请号：US12196860

申请日：2008-08-22

Applicant: YULIN WANG ,  Alpay Yilmaz

Inventor： YULIN WANG ,  Alpay Yilmaz

IPC: B24B57/02 ,  B24B7/00 ,  B24B29/00

CPC classification number: B24B57/02 ,  B24B37/04 ,  B24B37/042

Abstract: A chemical mechanical polisher comprises a polishing platen capable of supporting a polishing pad, and first and second substrate carriers that are each capable of holding a substrate against the polishing pad. First and second slurry dispensers, each comprise (i) an arm comprising a pivoting end and a distal end, (ii) at least one slurry dispensing nozzle on the distal end, and (iii) a dispenser drive capable of rotating the arm about the pivoting end to swing the slurry dispensing nozzle at the distal end to dispense slurry across the polishing platen.

Abstract translation: 化学机械抛光机包括能够支撑抛光垫的研磨台板，以及能够将基板保持在抛光垫上的第一和第二基板载体。 第一和第二浆液分配器，每个包括（i）包括枢转端和远端的臂，（ii）在远端上的至少一个浆料分配喷嘴，以及（iii）能够围绕 枢转端以使浆料分配喷嘴在远端摆动，以将浆料分配到抛光台板上。

公开(公告)号：US07611400B2

公开(公告)日：2009-11-03

申请号：US11741609

申请日：2007-04-27

Applicant: Alpay Yilmaz ,  Lakshmanan Karuppiah

Inventor： Alpay Yilmaz ,  Lakshmanan Karuppiah

IPC: B24B53/00

CPC classification number: B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

Abstract translation: 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。

公开(公告)号：US20070235344A1

公开(公告)日：2007-10-11

申请号：US11399560

申请日：2006-04-06

Applicant: Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

Inventor： Renhe Jia ,  You Wang ,  Gerald Alonzo ,  Yongqi Hu ,  Zhihong Wang ,  Jie Diao ,  Stan D Tsai ,  Alpay Yilmaz ,  Lakshmanan Karuppiah ,  Liang-Yuh Chen

IPC: B23H5/08

CPC classification number: B23H5/08 ,  C25F3/02 ,  H01L21/32125

Abstract: A method for electrochemical mechanical polishing (ECMP) is disclosed. The polishing rate and surface finish of the layer on the wafer are improved by controlling the surface speed of both the platen and head, controlling the current applied to the pad, and preselecting the density of the perforations on the fully conductive polishing pad. ECMP produces much higher removal rates, good surface finishes, and good planarization efficiency at a lower down force. Generally, increasing the surface speed of both the platen and the head will increase the surface smoothness. Also, increasing the current density on the wafer will increase the surface smoothness. There is virtually no difference in the smoothness of the wafer surface between the center, middle, and edge of the wafer. For copper, removal rates of 10,000 Å/min and greater can be achieved.

Abstract translation: 公开了一种用于电化学机械抛光（ECMP）的方法。 通过控制压板和头部的表面速度，控制施加到垫的电流以及预选在全导电抛光垫上的穿孔密度来提高晶片上层的抛光速率和表面光洁度。 ECMP在较低的下压力下产生高得多的去除率，良好的表面光洁度和良好的平面化效率。 通常，增加压板和头部的表面速度将增加表面平滑度。 此外，增加晶片上的电流密度将增加表面平滑度。 在晶片的中心，中间和边缘之间的晶片表面的平滑度几乎没有差别。 对于铜，可以实现10,000 / min以上的去除率。

公开(公告)号：US08308529B2

公开(公告)日：2012-11-13

申请号：US12427411

申请日：2009-04-21

Applicant: Allen L. D'Ambra ,  Alpay Yilmaz

Inventor： Allen L. D'Ambra ,  Alpay Yilmaz

IPC: B24B5/00 ,  B24B41/02

CPC classification number: B24B37/345 ,  B24B27/0076 ,  B24B37/042 ,  B24B41/005

Abstract: Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.

Abstract translation: 提供了用于抛光基板的系统和方法的实施例。 在一个实施例中，提供了包括抛光模块，清洁器和机器人的抛光系统。 机器人具有足以在抛光模块和清洁器之间传送基板的运动范围。 抛光模块包括至少两个抛光台，至少一个装载杯和至少四个抛光头。 抛光头构造成在至少两个抛光台和至少一个装载杯之间独立地移动。

公开(公告)号：US20070095677A1

公开(公告)日：2007-05-03

申请号：US11554928

申请日：2006-10-31

Applicant: You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Jie Diao ,  Renhe Jia ,  Alpay Yilmaz

Inventor： You Wang ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Jie Diao ,  Renhe Jia ,  Alpay Yilmaz

IPC: B23H3/00

CPC classification number: B23H5/08 ,  B24B37/042 ,  B24B37/046 ,  B24B53/017 ,  C25F1/00 ,  H01L21/32125

Abstract: A method for conditioning an Ecmp pad is provided. In one embodiment, a method for electrochemically processing a substrate includes the steps of providing an electrical bias voltage between the top surface of the pad assembly and an electrode, and electrochemically removing contaminants from the top surface of the pad.

Abstract translation: 提供了一种调节Ecmp垫的方法。 在一个实施例中，用于电化学处理衬底的方法包括以下步骤：在衬垫组件的顶表面和电极之间提供电偏置电压，以及电化学去除衬垫顶表面的污染物。

公开(公告)号：US07210981B2

公开(公告)日：2007-05-01

申请号：US11273766

申请日：2005-11-14

Applicant: Alpay Yilmaz ,  Lakshmanan Karuppiah

Inventor： Alpay Yilmaz ,  Lakshmanan Karuppiah

IPC: B24B53/00

CPC classification number: B24B53/017 ,  H01L21/67051 ,  H01L21/67092 ,  H01L21/67253

Abstract: A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse station. At least one sensor is provided and is configured to detect a first position and a second position of the conditioning element when disposed over the rinse station.

Abstract translation: 提供了一种用于监测抛光垫调节机构的方法和装置。 在一个实施例中，半导体衬底抛光系统包括冲洗台，抛光表面，调节元件和调节机构。 调理机构选择性地将调理元件定位在抛光表面上和漂洗台上。 提供至少一个传感器，并且被配置为当设置在漂洗站上时检测调理元件的第一位置和第二位置。

公开(公告)号：US07044832B2

公开(公告)日：2006-05-16

申请号：US10988647

申请日：2004-11-15

Applicant: Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

Inventor： Alpay Yilmaz ,  Simon Yavelberg ,  Toshikazu Tomita ,  Hui Chen ,  Noel Manto ,  David J. Lischka ,  Hung Chih Chen

IPC: B24B49/00

CPC classification number: B24B37/345

Abstract: Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the substrate from the polishing head to the substrate support.

Abstract translation: 提供了用于转移衬底的负载杯的实施例。 负载杯包括具有基板支撑件和去夹紧喷嘴的基座组件。 在将基板从抛光头转移到基板支撑件的过程中，去夹紧喷嘴定位成使流体在基板的抛光头和背面之间流动。

公开(公告)号：US20140020830A1

公开(公告)日：2014-01-23

申请号：US13553009

申请日：2012-07-19

Applicant: Jagan Rangarajan ,  Alpay Yilmaz

Inventor： Jagan Rangarajan ,  Alpay Yilmaz

IPC: B24B29/00

CPC classification number: B24B37/013 ,  B24B37/105 ,  B24B49/10

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad, two carrier heads configured to hold two substrates against the polishing pad at the same time, two actuators to sweep the two carrier heads laterally across the polishing pad, an in-situ polishing monitoring system including a two current sensors to sense two currents supplied to the two actuators and generate two signals, and a controller to receive the two signals and independently detect a two endpoints for the two substrates based on the two signals.

Abstract translation: 化学机械抛光系统包括用于支撑抛光垫的压板，配置成将两个基板同时固定在抛光垫上的两个载体头，两个致动器横向扫掠抛光垫横向扫描两个载体头，原位抛光 监测系统包括两个电流传感器以感测提供给两个致动器的两个电流并产生两个信号，以及控制器，用于接收两个信号，并且基于两个信号独立地检测两个基板的两个端点。

公开(公告)号：US08398458B2

公开(公告)日：2013-03-19

申请号：US12490928

申请日：2009-06-24

Applicant: Alpay Yilmaz

Inventor： Alpay Yilmaz

IPC: B24B49/00

CPC classification number: B24B37/345

Abstract: The present invention generally relates to a polishing system. Particularly, the present invention relates a polishing apparatus having one or more modular polishing stations, and a plurality of polishing heads movably connected to a transferring system.

Abstract translation: 本发明一般涉及一种抛光系统。 特别地，本发明涉及具有一个或多个模块化抛光站的抛光装置和可移动地连接到传送系统的多个抛光头。