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1.发明授权Apparatus and method for cleaning semiconductor substrate using pressurized fluid 有权使用加压流体清洁半导体衬底的装置和方法公开(公告)号：US08844546B2
公开(公告)日：2014-09-30
申请号：US12243685
申请日：2008-10-01
申请人： Hui (Fred) Chen , Allen L. D'Ambra
发明人： Hui (Fred) Chen , Allen L. D'Ambra
CPC分类号： H01L21/67051
摘要： Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
摘要翻译： 本发明的实施例一般涉及在抛光处理之后清洁半导体衬底的装置和方法。 特别地，本发明的实施例涉及使用加压流体清洁基板的装置和方法。 本发明的一个实施例包括两个辊，用于以基本垂直的方向支撑和旋转基底，压力轮施加力以使基底与两个辊接合;以及摆动喷嘴，构造成将加压流体分配到基底 。
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2.发明申请METHODS AND APPARATUS FOR MARANGONI SUBSTRATE DRYING USING A VAPOR KNIFE MANIFOLD 有权使用蒸汽刀生成歧管的MARANGONI基板干燥的方法和装置公开(公告)号：US20130283634A1
公开(公告)日：2013-10-31
申请号：US13458824
申请日：2012-04-27
CPC分类号： H01L21/67034
摘要： The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.
摘要翻译： 本发明提供了一种Marangoni蒸气刀组件的方法和装置。 所述组件包括基部，所述基部具有纵向延伸通过所述基部的通道和从所述通道横向延伸到所述基部的外表面的多个通道; 顶板，其适于可移除地联接到所述基座，外表面与所述基座的外表面齐平; 以及适于设置在基座和顶板之间并且还适于在组件中形成多个喷射孔的垫片。 公开了许多附加特征。
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公开(公告)号：US20120208438A1
公开(公告)日：2012-08-16
申请号：US13450978
申请日：2012-04-19
CPC分类号： B24B37/04 , B24B41/047 , B24B45/003
摘要： Embodiments described herein relate to a track system in a polishing system. One embodiment described herein provides a track system configured to transfer polishing heads in a polishing system. The track system comprises a supporting frame, a track coupled to the supporting frame and defining a path along which the polishing heads are configured to move, and one or more carriages configured to carry at least one polishing head along the path defined by the track, wherein the one or more carriages are coupled to the track and independently movable along the track.
摘要翻译： 本文所述的实施例涉及抛光系统中的轨道系统。 本文所述的一个实施例提供了一种配置成在抛光系统中传送抛光头的轨道系统。 轨道系统包括支撑框架，轨道，其联接到支撑框架并且限定抛光头被配置为移动的路径，以及一个或多个托架，其构造成沿着由轨道限定的路径承载至少一个抛光头， 其中所述一个或多个托架联接到所述轨道并且可以沿着所述轨道独立地移动。
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4.发明授权Method for removing electrolyte from electrical contacts and wafer touching areas 失效从电触点和晶片接触区域去除电解质的方法公开(公告)号：US06869516B2
公开(公告)日：2005-03-22
申请号：US10273539
申请日：2002-10-18
申请人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
发明人： Dmitry Lubomirsky , Michael X. Yang , Girish A. Dixit , Vincent E. Burkhart , Allen L. D'Ambra , Yeuk-Fai Edwin Mok , Harald Herchen
IPC分类号： C25D7/12 , C25D21/00 , H01L21/288 , C25D5/48
CPC分类号： C25D7/12 , C25D21/00 , H01L21/2885
摘要： A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.
摘要翻译： 提供了一种用于清洁电化学电镀接触环的电接触区域或衬底接触区域的方法。 该方法的实施例包括将基板定位在具有一个或多个电触点的基板支撑构件上，在基板表面的至少一部分上化学镀覆金属层，从处理基板移除经处理的基板，并清洁该基板 或更多的与包含醇的蒸汽混合物的电接触。 在另一方面，该方法包括在旋转衬底支撑构件的同时将蒸气混合物喷射到电触点上。
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公开(公告)号：US06440261B1
公开(公告)日：2002-08-27
申请号：US09318233
申请日：1999-05-25
IPC分类号： H01L2100
CPC分类号： H01L21/67161 , H01L21/67167 , H01L21/67184 , Y10S414/135 , Y10S414/137 , Y10S414/139
摘要： Apparatus for multi-chambered semiconductor wafer processing comprising a polygonal structure having at least two semiconductor process chambers disposed on one side. An area between the process chambers provides a maintenance access to the semiconductor processing equipment. Additionally, the apparatus may be clustered or daisy-chained together to enable a wafer to access additional processing chambers without leaving the controlled environment of the semiconductor wafer processing equipment.
摘要翻译： 用于多室半导体晶片处理的装置，包括具有设置在一侧上的至少两个半导体处理室的多边形结构。 处理室之间的区域提供对半导体处理设备的维护访问。 另外，该装置可以被集群或菊花链连接在一起，以使得晶片能够访问附加的处理室而不会离开半导体晶片处理设备的受控环境。
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6.发明授权Methods and apparatus for marangoni substrate drying using a vapor knife manifold 有权使用蒸气刀歧管的马龙尼底物干燥的方法和装置公开(公告)号：US08869422B2
公开(公告)日：2014-10-28
申请号：US13458824
申请日：2012-04-27
IPC分类号： F26B7/00
CPC分类号： H01L21/67034
摘要： The present invention provides methods and apparatus for a Marangoni vapor knife assembly. The assembly includes a base having a channel extending longitudinally through the base and a plurality of passages extending laterally from the channel toward an outer face of the base; a top plate adapted to be removeably coupled to the base with an outer face flush with the outer face of the base; and a shim adapted to be disposed between the base and the top plate and further adapted to form a plurality of spray orifices in the assembly. Numerous additional features are disclosed.
摘要翻译： 本发明提供了一种Marangoni蒸气刀组件的方法和装置。 所述组件包括基部，所述基部具有纵向延伸通过所述基部的通道和从所述通道横向延伸到所述基部的外表面的多个通道; 顶板，其适于可移除地联接到所述基座，外表面与所述基座的外表面齐平; 以及适于设置在基座和顶板之间并且还适于在组件中形成多个喷射孔的垫片。 公开了许多附加特征。
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公开(公告)号：US08308529B2
公开(公告)日：2012-11-13
申请号：US12427411
申请日：2009-04-21
申请人： Allen L. D'Ambra , Alpay Yilmaz
发明人： Allen L. D'Ambra , Alpay Yilmaz
CPC分类号： B24B37/345 , B24B27/0076 , B24B37/042 , B24B41/005
摘要： Embodiments of a system and method for polishing substrates are provided. In one embodiment, a polishing system is provided that includes a polishing module, a cleaner and a robot. The robot has a range of motion sufficient to transfer substrates between the polishing module and cleaner. The polishing module includes at least two polishing stations, at least one load cup and at least four polishing heads. The polishing heads are configured to move independently between the at least two polishing stations and the at least one load cup.
摘要翻译： 提供了用于抛光基板的系统和方法的实施例。 在一个实施例中，提供了包括抛光模块，清洁器和机器人的抛光系统。 机器人具有足以在抛光模块和清洁器之间传送基板的运动范围。 抛光模块包括至少两个抛光台，至少一个装载杯和至少四个抛光头。 抛光头构造成在至少两个抛光台和至少一个装载杯之间独立地移动。
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公开(公告)号：US20100078041A1
公开(公告)日：2010-04-01
申请号：US12243700
申请日：2008-10-01
CPC分类号： B08B1/04 , H01L21/67046 , H01L21/67219
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.
摘要翻译： 本发明的实施例涉及使用洗涤器刷清洁衬底的装置和方法。 本发明的一个实施例提供了一种基板清洁器，包括可移动地设置在处理体积中的两个洗涤刷组件。 两个洗涤器刷组件被配置为接触并清洁设置在处理体积中的基板的相对表面。 衬底清洁器还包括配置成同时调节两个洗涤器刷组件的位置的定位组件，其中定位组件以镜面对称的方式对第一和第二洗刷器刷组件进行基本相同的调节量。
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公开(公告)号：US20090280727A1
公开(公告)日：2009-11-12
申请号：US12118438
申请日：2008-05-09
申请人： LAKSHMANAN KARUPPIAH , Tetsuya Ishikawa , Donald J.K. Olgado , Allen L. D'Ambra , Hung Chih Chen
发明人： LAKSHMANAN KARUPPIAH , Tetsuya Ishikawa , Donald J.K. Olgado , Allen L. D'Ambra , Hung Chih Chen
CPC分类号： B24B41/005 , B24B27/0076 , B24B37/345
摘要： Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads.
摘要翻译： 本发明的实施例提供了一种配置成在抛光系统中使用的抛光模块。 抛光模块包括基座构件，设置在基座构件上的两个抛光台，一个负载杯和具有三个抛光头的圆盘传送带。
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公开(公告)号：US07155319B2
公开(公告)日：2006-12-26
申请号：US11064747
申请日：2005-02-23
申请人： Roy C. Nangoy , Allen L. D'Ambra , Yevgeniy Rabinovich , David Z. Chen , Tao Li
发明人： Roy C. Nangoy , Allen L. D'Ambra , Yevgeniy Rabinovich , David Z. Chen , Tao Li
CPC分类号： G05B13/021 , Y10T137/0324 , Y10T137/0352 , Y10T137/0357 , Y10T137/0363
摘要： A method for controlling liquid delivery in a processing chamber. The method includes generating an analog input (AI) signal proportional to a process variable and calculating an analog output (AO) signal based on a setpoint and a deadband. The setpoint is a target value of the process variable and the deadband is an allowable tolerance around the setpoint that determines when the control logic is activated to control the process variable. The method further includes transmitting the AO signal to a control device and adjusting the process variable proportional to the value of the AO signal.
摘要翻译： 一种用于控制处理室中的液体输送的方法。 该方法包括产生与过程变量成比例的模拟输入（AI）信号，并且基于设定点和死区计算模拟输出（AO）信号。 设定值是过程变量的目标值，死区是设定值周围的允许公差，用于确定控制逻辑何时被激活以控制过程变量。 该方法还包括将AO信号发送到控制装置并且调整与AO信号的值成比例的过程变量。
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