-
公开(公告)号：US20160027675A1
公开(公告)日：2016-01-28
申请号：US14774377
申请日：2014-03-14
申请人： Abraham RAVID , Kevin GRIFFIN , Joseph YUDOVSKY , Kaushal GANGAKHEDKAR , Dmitry A. DZILNO , Alex MINKOVICH
发明人： Abraham Ravid , Kevin Griffin , Joseph Yudovsky , Kaushal Gangakhedkar , Dmitry A. Dzilno , Alex Minkovich
IPC分类号： H01L21/67 , C23C16/458 , C23C16/52 , H01L21/687 , C23C16/455
CPC分类号： H01L21/67259 , C23C16/45544 , C23C16/4584 , C23C16/52 , H01L21/67248 , H01L21/68764 , H01L21/68771
摘要： Apparatus and methods of measuring and controlling the gap between a susceptor assembly and a gas distribution assembly are described. Apparatus and methods for positional control and temperature control for wafer transfer purposes are also described.
摘要翻译： 描述了测量和控制基座组件和气体分配组件之间的间隙的装置和方法。 还描述了用于晶片转印目的的位置控制和温度控制的装置和方法。
-
公开(公告)号：US20150345022A1
公开(公告)日：2015-12-03
申请号：US14435070
申请日：2014-02-20
IPC分类号： C23C16/52 , H01L21/285 , H01L21/66 , H01L21/02 , C23C16/455 , C23C16/458
CPC分类号： C23C16/52 , C23C16/45544 , C23C16/45551 , C23C16/4583 , H01L21/0228 , H01L21/0262 , H01L21/28556 , H01L22/10
摘要： Described are apparatus and methods for processing a semiconductor wafer in which the gap between the wafer surface and the gas distribution assembly remains uniform and of known thickness. The wafer is positioned within a susceptor assembly and the assembly is lifted toward the gas distribution assembly using actuators. The wafer can be lifted toward the gas distribution assembly by creating a fluid bearing below and/or above the wafer.
摘要翻译： 描述了其中晶片表面和气体分配组件之间的间隙保持均匀并具有已知厚度的半导体晶片的处理装置和方法。 晶片定位在基座组件内，并且使用致动器将组件提升到气体分配组件。 可以通过在晶片下方和/或上方产生流体轴承来将晶片提升到气体分配组件。
-
公开(公告)号：US20130210238A1
公开(公告)日：2013-08-15
申请号：US13789050
申请日：2013-03-07
申请人： Joseph Yudovsky
发明人： Joseph Yudovsky
IPC分类号： H01L21/02
CPC分类号： H01L21/02104 , C23C16/45536 , C23C16/45551 , C23C16/4584
摘要： A substrate processing chamber and methods for processing multiple substrates is provided and generally includes a plurality of spaced gas distribution assemblies and a substrate support apparatus to rotate substrates along a path adjacent each of the plurality of gas distribution assemblies. Each of the gas distribution assemblies comprises a plurality of elongate gas ports extending in a direction substantially perpendicularly to the path traversed by the substrate.
摘要翻译： 提供了一种衬底处理室和用于处理多个衬底的方法，并且通常包括多个间隔开的气体分配组件和用于沿着与多个气体分配组件中的每一个相邻的路径旋转衬底的衬底支撑设备。 每个气体分配组件包括沿基本上垂直于由衬底穿过的路径延伸的多个细长气体端口。
-
公开(公告)号：US20120225204A1
公开(公告)日：2012-09-06
申请号：US13038061
申请日：2011-03-01
申请人： Joseph Yudovsky
发明人： Joseph Yudovsky
IPC分类号： C23C16/44 , C23C16/455
CPC分类号： C23C16/45551 , C23C16/54
摘要： Provided are atomic layer deposition apparatus and methods including multiple gas distribution plates including stages for moving substrates between the gas distribution plates.
摘要翻译： 提供了包括多个气体分配板的原子层沉积设备和方法，其包括在气体分布板之间移动基板的阶段。
-
公开(公告)号：US20120225194A1
公开(公告)日：2012-09-06
申请号：US13189708
申请日：2011-07-25
申请人： Joseph Yudovsky
发明人： Joseph Yudovsky
IPC分类号： B05D5/12 , C23C16/458
CPC分类号： C23C16/45551 , C23C16/54
摘要： Provided are atomic layer deposition apparatus and methods including multiple gas distribution plates including stages for moving substrates between the gas distribution plates.
摘要翻译： 提供了包括多个气体分配板的原子层沉积设备和方法，其包括在气体分布板之间移动基板的阶段。
-
公开(公告)号：US08099817B2
公开(公告)日：2012-01-24
申请号：US13042085
申请日：2011-03-07
IPC分类号： B08B11/02
CPC分类号： H01L21/67046 , B08B1/04 , B24B9/065 , Y10S414/136
摘要： In a first aspect, an apparatus for cleaning a thin disk is provided. The apparatus includes a support roller for supporting a rotating wafer within a wafer cleaner. The support roller comprises a guide portion, for receiving an edge of a wafer, having an inclined surface comprising a low-friction material and adapted to allow the wafer edge to slide thereagainst; and an edge-trap portion for retaining the edge of the wafer and having a transverse surface comprising a high-friction material and adapted, when in communication with the edge of the wafer, to resist sliding thereagainst. Numerous other aspects are provided.
摘要翻译： 在第一方面，提供一种用于清洁薄盘的装置。 该装置包括用于支撑晶片清洁器内的旋转晶片的支撑辊。 支撑辊包括用于接收晶片的边缘的引导部分，其具有包括低摩擦材料并适于允许晶片边缘在其上滑动的倾斜表面; 以及用于保持晶片的边缘并且具有包括高摩擦材料的横向表面的边缘捕获部分，并且当与晶片的边缘连通时能够抵抗其滑动。 提供了许多其他方面。
-
公开(公告)号：US20110223334A1
公开(公告)日：2011-09-15
申请号：US13043189
申请日：2011-03-08
申请人： Joseph Yudovsky , Anh N. Nguyen , Tai T. Ngo
发明人： Joseph Yudovsky , Anh N. Nguyen , Tai T. Ngo
IPC分类号： C23C16/455 , C23C16/458
CPC分类号： C23C16/45574 , C23C16/4408 , C23C16/45504 , C23C16/45525 , C23C16/45544 , C23C16/45561 , C23C16/45591 , H01J37/32449 , H01L21/0228 , H01L21/28194 , H01L21/3141
摘要： Embodiments of the invention relate to apparatus and methods for depositing materials on substrates during atomic layer deposition processes. In one embodiment, a chamber lid assembly comprises a channel having an upper portion and a lower portion, wherein the channel extends along a central axis, a housing having an inner region and at least partially defining two or more annular channels, an insert disposed in the inner region and defining the upper portion, the upper portion fluidly coupled with the two or more annular channels, and a tapered bottom surface extending from the bottom portion of the channel to a peripheral portion of the chamber lid assembly.
摘要翻译： 本发明的实施例涉及在原子层沉积工艺期间在衬底上沉积材料的装置和方法。 在一个实施例中，室盖组件包括具有上部和下部的通道，其中通道沿着中心轴线延伸，壳体具有内部区域并且至少部分地限定两个或更多个环形通道，插入件设置在 所述内部区域并且限定所述上部，所述上部与所述两个或多个环形通道流体联接，以及从所述通道的底部部分延伸到所述腔室盖组件的周边部分的锥形底面。
-
公开(公告)号：US20100078041A1
公开(公告)日：2010-04-01
申请号：US12243700
申请日：2008-10-01
CPC分类号： B08B1/04 , H01L21/67046 , H01L21/67219
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.
摘要翻译： 本发明的实施例涉及使用洗涤器刷清洁衬底的装置和方法。 本发明的一个实施例提供了一种基板清洁器，包括可移动地设置在处理体积中的两个洗涤刷组件。 两个洗涤器刷组件被配置为接触并清洁设置在处理体积中的基板的相对表面。 衬底清洁器还包括配置成同时调节两个洗涤器刷组件的位置的定位组件，其中定位组件以镜面对称的方式对第一和第二洗刷器刷组件进行基本相同的调节量。
-
公开(公告)号：US20090044831A1
公开(公告)日：2009-02-19
申请号：US12245745
申请日：2008-10-04
IPC分类号： B08B1/04
CPC分类号： H01L21/67046 , B08B1/04 , B24B9/065 , Y10S414/136
摘要： In a first aspect, a method of cleaning an edge of a wafer is provided. The method comprises providing an edge cleaning roller having a first inclined frictional surface for cleaning an edge corner of a wafer rotating within a first plane; and causing the edge cleaning roller to rotate within a second plane at an angle to the first plane while the inclined frictional surface contacts and cleans the edge corner. Numerous other aspects are provided.
摘要翻译： 在第一方面，提供一种清洁晶片边缘的方法。 该方法包括提供具有第一倾斜摩擦表面的边缘清洁辊，用于清洁在第一平面内旋转的晶片的边缘角; 并且使边缘清洁辊在与第一平面成一定角度的第二平面内旋转，同时倾斜的摩擦表面接触并清洁边缘角。 提供了许多其他方面。
-
10.发明申请公开(公告)号：US20090031516A1
公开(公告)日：2009-02-05
申请号：US12239724
申请日：2008-09-26
CPC分类号： H01L21/67046 , Y10T29/49826 , Y10T29/49895
摘要： In a first aspect, an apparatus is provided for forming a scrubber brush assembly. The apparatus includes a mandrel adapted to be inserted into a scrubber brush so as to form a scrubber brush assembly, the mandrel having: a first end; a second end; and one or more position guides adjacent at least one of the first and second ends and adapted to position a scrubber brush on the mandrel. Numerous other aspects are provided.
摘要翻译： 在第一方面，提供一种用于形成洗涤器刷组件的装置。 所述设备包括适于插入洗涤器刷中以形成洗涤器刷组件的心轴，心轴具有：第一端; 第二端 以及与所述第一和第二端中的至少一个相邻的一个或多个位置导向器，并且适于将洗涤刷固定在所述心轴上。 提供了许多其他方面。
-
-
-
-
-
-
-
-
-
搜索结果
129 条记录 (耗时 0.035 秒)
