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1.发明授权Apparatus and method for cleaning semiconductor substrate using pressurized fluid 有权使用加压流体清洁半导体衬底的装置和方法公开(公告)号：US08844546B2
公开(公告)日：2014-09-30
申请号：US12243685
申请日：2008-10-01
申请人： Hui (Fred) Chen , Allen L. D'Ambra
发明人： Hui (Fred) Chen , Allen L. D'Ambra
CPC分类号： H01L21/67051
摘要： Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
摘要翻译： 本发明的实施例一般涉及在抛光处理之后清洁半导体衬底的装置和方法。 特别地，本发明的实施例涉及使用加压流体清洁基板的装置和方法。 本发明的一个实施例包括两个辊，用于以基本垂直的方向支撑和旋转基底，压力轮施加力以使基底与两个辊接合;以及摆动喷嘴，构造成将加压流体分配到基底 。
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公开(公告)号：US20100078041A1
公开(公告)日：2010-04-01
申请号：US12243700
申请日：2008-10-01
CPC分类号： B08B1/04 , H01L21/67046 , H01L21/67219
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.
摘要翻译： 本发明的实施例涉及使用洗涤器刷清洁衬底的装置和方法。 本发明的一个实施例提供了一种基板清洁器，包括可移动地设置在处理体积中的两个洗涤刷组件。 两个洗涤器刷组件被配置为接触并清洁设置在处理体积中的基板的相对表面。 衬底清洁器还包括配置成同时调节两个洗涤器刷组件的位置的定位组件，其中定位组件以镜面对称的方式对第一和第二洗刷器刷组件进行基本相同的调节量。
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公开(公告)号：US07962990B2
公开(公告)日：2011-06-21
申请号：US12243700
申请日：2008-10-01
CPC分类号： B08B1/04 , H01L21/67046 , H01L21/67219
摘要： Embodiments of the present invention relates to an apparatus and method for cleaning a substrate using scrubber brushes. One embodiment of the present invention provides a substrate cleaner comprises two scrubber brush assemblies movably disposed in a processing volume. The two scrubber brush assemblies are configured to contact and clean opposite surfaces of a substrate disposed in the processing volume. The substrate cleaner also comprises a positioning assembly configured to simultaneously adjust positions of the two scrubber brush assemblies, wherein the positioning assembly makes substantially the same amount of adjustment to the first and second scrubber brush assemblies in mirror symmetry.
摘要翻译： 本发明的实施例涉及使用洗涤器刷清洁衬底的装置和方法。 本发明的一个实施例提供了一种基板清洁器，包括可移动地设置在处理体积中的两个洗涤刷组件。 两个洗涤器刷组件被配置为接触并清洁设置在处理体积中的基板的相对表面。 衬底清洁器还包括配置成同时调节两个洗涤器刷组件的位置的定位组件，其中定位组件以镜面对称的方式对第一和第二洗刷器刷组件进行基本相同的调节量。
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4.发明申请APPARATUS AND METHOD FOR CLEANING SEMICONDUCTOR SUBSTRATE USING PRESSURIZED FLUID 有权使用加压流体清洁半导体基板的装置和方法公开(公告)号：US20100078044A1
公开(公告)日：2010-04-01
申请号：US12243685
申请日：2008-10-01
申请人： Hui (Fred) Chen , Allen L. D'Ambra
发明人： Hui (Fred) Chen , Allen L. D'Ambra
CPC分类号： H01L21/67051
摘要： Embodiments of the present invention generally relate to an apparatus and a method for cleaning a semiconductor substrate after a polishing process. Particularly, embodiments of the present invention relates to an apparatus and method for cleaning a substrate using pressurized fluid. One embodiment of the present invention comprises two rollers to support and rotate a substrate in a substantially vertical orientation, a pressure wheel to apply a force to engage the substrate with the two rollers, and a swinging nozzle configured to dispense a pressurized fluid towards the substrate.
摘要翻译： 本发明的实施例一般涉及在抛光处理之后清洁半导体衬底的装置和方法。 特别地，本发明的实施例涉及使用加压流体清洁基板的装置和方法。 本发明的一个实施例包括两个辊，用于以基本垂直的方向支撑和旋转基底，压力轮施加力以使基底与两个辊接合;以及摆动喷嘴，构造成将加压流体分配到基底 。
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