Apparatus and method for electro chemical plating using backside electrical contacts
    5.
    发明授权
    Apparatus and method for electro chemical plating using backside electrical contacts 失效
    使用背面电触点进行电化学镀的装置和方法

    公开(公告)号:US06802947B2

    公开(公告)日:2004-10-12

    申请号:US09981191

    申请日:2001-10-16

    IPC分类号: C25D1700

    摘要: An apparatus and method for securing and electrically contacting a substrate on a non-production surface of the substrate. The apparatus includes a substrate holder assembly having a substrate engaging surface formed thereon, the substrate engaging surface being configured to engage a substrate on the non-production surface. The apparatus further includes an electrical contact device positioned on the substrate engaging surface, the electrical contact device including a plurality of radially spaced electrically conductive members configured to electrically communicate with the non-production surface of the substrate positioned on the substrate engaging surface. The method includes depositing a conductive seed layer on a production surface of the substrate, and depositing a backside conductive layer on a portion of the non-production side of the substrate, the backside conductive layer extending around a bevel of the substrate to electrically communicate with the seed layer. The method further includes securing the substrate in a chuck configured to engage the non-production surface of the substrate, contacting the backside conductive layer with an electrical cathode contact on the non-production side of the substrate, and plating over the conductive seed layer via application of an electrolyte to the production surface of the substrate and applying an electrical bias to the electrical cathode contact and an anode in communication with the electrolyte.

    摘要翻译: 一种用于固定和电接触衬底的非生产表面上的衬底的装置和方法。 该设备包括具有形成在其上的衬底接合表面的衬底保持器组件,衬底接合表面被配置为接合非生产表面上的衬底。 所述装置还包括位于所述基板接合表面上的电接触装置,所述电接触装置包括多个径向隔开的导电构件,所述导电构件构造成与位于所述基板接合表面上的所述基板的非生产表面电连通。 该方法包括在衬底的生产表面上沉积导电种子层,以及在衬底的非生产侧的一部分上沉积背面导电层,所述背面导电层围绕衬底的斜面延伸以与 种子层。 该方法还包括将衬底固定在配置成接合衬底的非生产表面的卡盘中,使背面导电层与衬底的非生产侧上的电阴极接触接触,并且在导电种子层上电镀 将电解质施加到基材的生产表面上,并将电偏压施加到电阴极接触件和与电解质连通的阳极。

    Apparatus for wafer rinse and clean and edge etching
    6.
    发明授权
    Apparatus for wafer rinse and clean and edge etching 失效
    晶圆清洗和边缘蚀刻装置

    公开(公告)号:US06689418B2

    公开(公告)日:2004-02-10

    申请号:US09922130

    申请日:2001-08-03

    IPC分类号: B05D312

    摘要: An apparatus for and method of rinsing one side of a two-sided substrate and removing unwanted material from the substrate's edge and/or backside. One embodiment of the method is directed toward rinsing and cleaning a substrate having a front side upon which integrated circuits are to be formed and a backside. This embodiment includes dropping the substrate front side down onto a pool of rinsing liquid in a manner such that the front side of the substrate is in contact with the solution while the substrate is held in suspension by the surface tension of the solution liquid thereby preventing the backside of the substrate from sinking under an upper surface of the pool. Next, while the substrate is in suspension in said rinsing liquid, the substrate is secured by its edge with a first set of fingers and in some embodiments the substrate is subsequently spun. In another embodiment, a method of forming a copper layer on a front side of a substrate is disclosed. The method includes plating the copper layer over the front side of the substrate in a plating device and then transferring the substrate from the plating device to rinsing and cleaning station. At the rinsing and cleaning station, the substrate is dropped front side down onto a pool of rinsing liquid so that the surface tension of the liquid holds the substrate in suspension thereby preventing the backside of said substrate from sinking under an upper surface of the pool and then, while the substrate is suspended in the pool, it is secured with a first set of fingers.

    摘要翻译: 一种用于冲洗双面基板的一侧并从基板的边缘和/或背面去除不想要的材料的装置和方法。 该方法的一个实施例涉及冲洗和清洁具有正面的衬底,集成电路将在其上形成背面。 该实施例包括将衬底正面朝下放置到冲洗液池上,使得衬底的前侧与溶液接触,同时衬底被溶液的表面张力保持悬浮,从而防止了 衬底的背面从池的上表面下沉。 接下来,当衬底在所述漂洗液体中悬浮时,衬底通过其边缘用第一组手指固定,并且在一些实施例中,衬底随后被旋转。 在另一实施例中,公开了一种在衬底前侧形成铜层的方法。 该方法包括在电镀装置中在基板的正面上电镀铜层,然后将基板从电镀装置转移到冲洗和清洗台。 在冲洗和清洁站处,基板被正面向下落到冲洗液池上,使得液体的表面张力将基板保持在悬浮状态,从而防止所述基板的背面沉入池的上表面,并且 然后,当衬底悬挂在池中时,其用第一组手指固定。

    Substrate holder system with substrate extension apparatus and associated method

    公开(公告)号:US06478937B2

    公开(公告)日:2002-11-12

    申请号:US09765855

    申请日:2001-01-19

    IPC分类号: B23H726

    摘要: An apparatus and associated method that removes electrolyte solution from a substrate, the apparatus comprises a thrust plate and a substrate extension unit. The thrust plate at least partially defines a spin recess. The substrate extension unit can be displaced between a retracted position and an extended position relative to the spin recess. The substrate extension unit is disposed within the spin recess when positioned in the retracted position. The substrate extension unit at least partially extends from within the spin recess when positioned in the extended position. The substrate is processed by immersing at least a portion of the substrate in a wet solution. The substrate is removed from the wet solution. The substrate extension unit extends into its extended position, and the substrate is spun. Extending the substrate extension unit limits the formation of fluid traps within the substrate holder assembly or between the substrate and the substrate holder assembly.

    Stable cell platform
    9.
    发明授权
    Stable cell platform 失效
    稳定的细胞平台

    公开(公告)号:US07114693B1

    公开(公告)日:2006-10-03

    申请号:US09676362

    申请日:2000-09-29

    IPC分类号: F16M13/00

    摘要: A stable platform supports a cell, the stable platform comprises a lower mainframe, an upper mainframe, and a dampener system. The upper mainframe includes a plurality of recesses. Each recess is configured to receive a cell. The dampener system connects the lower mainframe to the upper mainframe. In one embodiment, the dampener system comprises a dampener element, such as sand, to dampen vibrations between the lower mainframe and the lower mainframe.

    摘要翻译: 稳定的平台支持电池,稳定的平台包括下主机,上主机和减振器系统。 上主机包括多个凹槽。 每个凹槽被配置成接收单元。 阻尼器系统将下主机连接到上主机。 在一个实施例中,阻尼器系统包括阻尼器元件,例如沙子,以阻尼下主机和下主机之间的振动。

    System for planarizing metal conductive layers
    10.
    发明授权
    System for planarizing metal conductive layers 失效
    用于平坦化金属导电层的系统

    公开(公告)号:US06770565B2

    公开(公告)日:2004-08-03

    申请号:US10043561

    申请日:2002-01-08

    IPC分类号: H01L2302

    摘要: A method of planarizing a metal conductive layer on a substrate is provided. In one embodiment, a substrate having a metal conductive layer disposed on a top surface of the substrate is provided on a substrate support. The substrate support is rotated and the top surface of the substrate is contacted with a liquid etching composition. The metal conductive layer is then exposed to an etchant gas in order to planarize the top surface of the metal conductive layer. Also provided is an apparatus for etching a metal conductive layer on a substrate. The apparatus comprises a container, a substrate support disposed in the container, a rotation actuator attached to the substrate support, and a fluid delivery assembly disposed in the container.

    摘要翻译: 提供了在基板上平面化金属导电层的方法。 在一个实施例中,在衬底支架上设置具有设置在衬底顶表面上的金属导电层的衬底。 衬底支撑件旋转并且衬底的顶表面与液体蚀刻组合物接触。 然后将金属导电层暴露于蚀刻剂气体,以平坦化金属导电层的顶表面。 还提供了一种用于在基板上蚀刻金属导电层的装置。 该装置包括容器,设置在容器中的基板支撑件,附接到基板支撑件的旋转致动器以及设置在容器中的流体输送组件。