Abstract:
An electron flood apparatus for neutralizing positive charge build up on a substrate during ion implantation comprises a tube through which the ion beam passes to the substrate. Inert gas is supplied to the plasma chamber and a cathode in the plasma chamber is heated to emit electrons. An accelerating electrical supply is connected between a cathode and an accelerating electrode in the plasma chamber to accelerate electrons emitted by the cathode to produce a plasma in the chamber. A separate cathode bias electrical supply is connected directly between the cathode and the substrate common terminal to set a desired bias potential on the cathode relative to the substrate independently of the acceleration potential.
Abstract:
In ion implantation processes, secondary electrons are emitted from a substrate in an ion implanter during ion implantation and have the effect of producing excessive negative charge build up on the substrate damaging the substrate. An apparatus and a method is provided in which the negative charge build up on the substrate is restricted by extending a magnetic filter across the ion beam between a substrate holder and a plasma flood source of the ion implanter to deflect the secondary electrons with higher energies above about 15 eV out of the ion beam to be absorbed by a conductive element, preventing re-attachment of the high energy secondary electrons to the substrate and allowing lower energy electrons below about 15 eV, which are necessary for neutralising positive charge build up on the substrate caused by the ion beam, to diffuse across the magnetic filter without being deflected out of the ion beam.
Abstract:
In order to uniformly neutralize a large current and a large diameter ion beam so as to irradiate an ion beam having a reduced beam divergence on a process target, an ion beam processing apparatus comprises an ion source for producing a processing plasma, a processing chamber as a vacuum chamber for accommodating a process target, an extract electrode for extracting an ion beam so as to irradiate on said process target, an annular electrode disposed in said processing chamber for forming an annular magnetic field therein, through which said ion beam is irradiated on said process, and a wave guide for introducing microwave through an opening provided on a wall forming said processing chamber, into said annular magnetic field.
Abstract:
An apparatus for ion beam neutralization is disclosed in this invention. The apparatus is a plasma flood source with an arc discharge chamber enclosed in a source housing with sufficient cooling so that the housing temperature is near room temperature. Arc discharge between a filament and the arc chamber ionizes the bleeding gas atoms or molecules in the arc chamber and produces plasma. The low energy electrons together with ions in the plasma drift out of the arc chamber and neutralize the passing ion beam. The sufficiently cooled source housing prevents radiation to the processed wafers, reduces metal particle concentration in the plasma and therefore metal contamination on the wafers, and keeps beamline pressure low while more electrons are extracted from the flood source through the apertures with larger area.
Abstract:
The present invention provides a neutral particle beam treatment apparatus which includes the following elements. A plasma generator is provided for generating a plasma from a treatment gas by alternation of application and discontinuation of a high frequency field. A negative ion accelerator is also provided for fetching negative ions from the plasma generated by the plasma generator and acceleration thereof to cause a negative ion beam. A neutralizer is further provided for neutralizing the negative ion beam to cause a neutral particle beam. A holder is still further provided for holding a sample at a position at which the neutral particle beam is irradiated.
Abstract:
A scan type electron microscope has an electron beam generating source for generating an electron beam with which a sample is irradiated; a sample chamber, supplied with a gas for effecting a gas amplification, for housing the sample; a secondary electron detecting means, installed in the sample chamber, for detecting secondary electrons gas-amplified by the gas after being generated from the sample with the irradiation of the electron beam; and an electrode, disposed between the sample and the secondary electron detecting means, for absorbing positive ions produced when the secondary electrons are gasamplified by the gas. The electrode may be constituted by a further fine tube extended from a pressure limiting aperture to a position just above the sample and formed with a path of the electron beam. The absorption of the positive ions prevents a positive charge-up of the sample, whereby a voltage between the sample and the secondary electron detecting means can be kept at a fixed level. A scatter of the primary electron beam can also be remarkably reduced so as to eliminate scattered electrons which cause noise.
Abstract:
An ion beam deposition system in which ions of different masses and from different sources are independently steered into different parts of an analyzer magnet to be converged into a single wide beam which maintains a perpendicular relationship between the beam and the target. The beam is decelerated by a slit type deceleration lens to an energy suitable for deposition. The target is then scanned across the decelerated beam. The beam is maintained at high current and low pressure by confining electrons away from the magnet and/or adding energy to the low pressure atmosphere inside the analyzer magnet to produce a plasma of electrons and charged particles in order to provide adequate neutralizing of the space charge of the beam.
Abstract:
A system may include a substrate stage, configured to support a substrate, where a main surface of the substrate defines a substrate plane. The system may include an ion source, including an extraction assembly that is oriented to direct an ion beam to the substrate along a trajectory defining a non-zero angle of incidence with respect to a perpendicular to the substrate plane. The system may include a radical source oriented to direct a radical beam to the substrate along a trajectory defining the non-zero angle of incidence with respect to a perpendicular to the substrate plane. The substrate stage may be further configured to scan the substrate along a first direction, lying with the substrate plane, while the main surface of the substrate is oriented within the substrate plane.
Abstract:
A system may include a substrate stage, configured to support a substrate, where a main surface of the substrate defines a substrate plane. The system may include an ion source, including an extraction assembly that is oriented to direct an ion beam to the substrate along a trajectory defining a non-zero angle of incidence with respect to a perpendicular to the substrate plane. The system may include a radical source oriented to direct a radical beam to the substrate along a trajectory defining the non-zero angle of incidence with respect to a perpendicular to the substrate plane. The substrate stage may be further configured to scan the substrate along a first direction, lying with the substrate plane, while the main surface of the substrate is oriented within the substrate plane.