公开(公告)号：US20070025266A1

公开(公告)日：2007-02-01

申请号：US11492487

申请日：2006-07-24

申请人： Neal Riedel ,  Yiorgos Peponides ,  James Petranovich ,  Lawrence Yonge ,  Srinivas Katar ,  Deepak Ayyagari ,  Sherman Gavette ,  Wai Chan

发明人： Neal Riedel ,  Yiorgos Peponides ,  James Petranovich ,  Lawrence Yonge ,  Srinivas Katar ,  Deepak Ayyagari ,  Sherman Gavette ,  Wai Chan

IPC分类号： H04J1/16 ,  H04J3/06

CPC分类号： H04L12/403 ,  H04B3/54 ,  H04B2203/5408 ,  H04L12/413

摘要： There is provided a powerline network that includes a number of stations including a central coordinator for coordinating transmissions of each of the stations. The central coordinator includes a system clock and a network timer and is configurable to transmit a number of network timer values. Each of the network timer values can be transmitted by the central coordinator in one of a number of beacons. Each of the other stations is configurable to utilize the network timer values and a corresponding number of local timer values to estimate a frequency error between the system clock and a local clock and an offset between the network timer and a local timer. Each of the other stations is further configurable to utilize the frequency error and the offset to synchronize the local timer to the network timer.

摘要翻译： 提供了一个电力线网络，其包括多个站，包括用于协调每个站的传输的中央协调器。 中央协调器包括系统时钟和网络定时器，可配置为传输多个网络定时器值。 每个网络定时器值可以由中央协调器在多个信标中的一个发送。 每个其他站可配置为利用网络定时器值和相应数量的本地定时器值来估计系统时钟和本地时钟之间的频率误差以及网络定时器和本地定时器之间的偏移量。 每个其他站可进一步配置以利用频率误差和偏移量来将本地定时器同步到网络定时器。

公开(公告)号：US20060131720A1

公开(公告)日：2006-06-22

申请号：US11019421

申请日：2004-12-22

申请人： Jianxiong Li ,  Chi Chaw ,  Ngai Tsui ,  Deming Liu ,  Yiu Kwan ,  Wai Chan

发明人： Jianxiong Li ,  Chi Chaw ,  Ngai Tsui ,  Deming Liu ,  Yiu Kwan ,  Wai Chan

IPC分类号： H01L21/50 ,  H01L23/24

CPC分类号： H01L23/3142 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

摘要翻译： 提供了一种通过在模制半导体器件之前通过用聚合物底漆涂覆半导体器件来提高模制化合物和半导体器件之间的粘合性的方法，该半导体器件包括安装在诸如引线框架的载体上的半导体芯片。 可以通过在聚合物溶液中或与聚合物溶液中浸渍，滴加或喷涂半导体器件来进行这种涂覆。

公开(公告)号：US20050272207A1

公开(公告)日：2005-12-08

申请号：US11204215

申请日：2005-08-15

申请人： Richard Williams ,  Michael Cornell ,  Wai Chan

发明人： Richard Williams ,  Michael Cornell ,  Wai Chan

IPC分类号： H01L21/331 ,  H01L21/76 ,  H01L21/8222 ,  H01L21/8224 ,  H01L21/8228 ,  H01L21/8234 ,  H01L21/8248 ,  H01L21/8249 ,  H01L27/06 ,  H01L27/082 ,  H01L27/088 ,  H01L29/73 ,  H01L29/732 ,  H01L21/336

CPC分类号： H01L27/0826 ,  H01L21/8224 ,  H01L21/82285 ,  H01L27/0821 ,  H01L29/6625 ,  H01L29/66272 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor substrate includes a pair of trenches filled with a dielectric material. Dopant introduced into the mesa between the trenches is limited from diffusing laterally when the substrate is subjected to thermal processing. Therefore, semiconductor devices can be spaced more closely together on the substrate, and the packing density of the devices can be increased. Also trench constrained doped region diffuse faster and deeper than unconstrained diffusions, thereby reducing the time and temperature needed to complete a desired depth diffusion. The technique may be used for semiconductor devices such as bipolar transistors as well as isolation regions that electrically isolate the devices from each other. In one group of embodiments, a buried layer is formed at an interface between an epitaxial layer and a substrate, at a location generally below the dopant in the mesa. When the substrate is subjected to thermal processing, the buried layer diffuses upward, the dopant in the mesa diffuses downward until the two dopants merge to form an isolation region or a sinker extending downward from the surface of the epitaxial layer to the buried layer. In another embodiment, dopant is implanted between dielectrically filled trenches at a high energy up to several MeV, then diffused, combining the benefits of deep implantation and trenched constrained diffusion to achive deep diffusions with a minimal thermal budget.

公开(公告)号：US20050202577A1

公开(公告)日：2005-09-15

申请号：US11124439

申请日：2005-05-05

申请人： Richard Williams ,  Michael Cornell ,  Wai Chan

发明人： Richard Williams ,  Michael Cornell ,  Wai Chan

IPC分类号： H01L23/485 ,  H01L23/495 ,  H01L23/58 ,  H01L23/62 ,  H01L27/02 ,  H01L29/78 ,  H01L21/66

CPC分类号： H01L23/60 ,  H01L22/32 ,  H01L23/49562 ,  H01L23/62 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L27/0266 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2224/02166 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04073 ,  H01L2224/05138 ,  H01L2224/05552 ,  H01L2224/05553 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/05042 ,  H01L2924/12035 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  Y10S257/904 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection circuitry functional to protect the MOSFET. Before connecting the bonding pads together, the ESD protection circuitry and/or the MOSFET can be separately tested. A voltage higher than functioning ESD protection circuitry would permit can be used when testing the MOSFET. A packaging process such as wire bonding or attaching the die to a substrate in a flip-chip package can connect the bonding pads after testing.

摘要翻译： 半导体管芯具有用于诸如功率MOSFET的MOSFET的接合焊盘和用于ESD保护电路的单独的接合焊盘。 将焊盘连接在一起可使ESD保护电路起到保护MOSFET的作用。 在将焊盘连接在一起之前，ESD保护电路和/或MOSFET可以单独测试。 当测试MOSFET时，可以使用高于功能ESD保护电路的电压。 在倒装芯片封装中的引线接合或将管芯附接到衬底的封装工艺可以在测试之后连接焊盘。

公开(公告)号：US20050142792A1

公开(公告)日：2005-06-30

申请号：US11067248

申请日：2005-02-25

申请人： Richard Williams ,  Michael Cornell ,  Wai Chan

发明人： Richard Williams ,  Michael Cornell ,  Wai Chan

IPC分类号： H01L21/331 ,  H01L21/329 ,  H01L21/761 ,  H01L21/8222 ,  H01L21/8238 ,  H01L21/8248 ,  H01L21/8249 ,  H01L27/06 ,  H01L27/08 ,  H01L27/092 ,  H01L29/732 ,  H01L29/861 ,  H01L23/62

CPC分类号： H01L21/26513 ,  H01L21/743 ,  H01L21/761 ,  H01L21/823878 ,  H01L21/823892 ,  H01L27/0629 ,  H01L27/0928 ,  H01L29/0878 ,  H01L29/1083 ,  H01L29/42368 ,  H01L29/66136 ,  H01L29/6625 ,  H01L29/735 ,  H01L29/7816 ,  H01L29/8611 ,  H01L2924/0002 ,  H01L2924/00

摘要： An structure for electrically isolating a semiconductor device is formed by implanting dopant into a semiconductor substrate that does not include an epitaxial layer. Following the implant the structure is exposed to a very limited thermal budget so that dopant does not diffuse significantly. As a result, the dimensions of the isolation structure are limited and defined, thereby allowing a higher packing density than obtainable using conventional processes which include the growth of an epitaxial layer and diffusion of the dopants. In one group of embodiments, the isolation structure includes a deep layer and a sidewall which together form a cup-shaped structure surrounding an enclosed region in which the isolated semiconductor device may be formed. The sidewalls may be formed by a series of pulsed implants at different energies, thereby creating a stack of overlapping implanted regions.

公开(公告)号：US06886253B2

公开(公告)日：2005-05-03

申请号：US10637573

申请日：2003-08-11

申请人： Wai Chan

发明人： Wai Chan

IPC分类号： B67B7/46 ,  B67B7/00

CPC分类号： B67B7/30 ,  B67B2007/0458

摘要： A foil cutter including first and second foil cutting means, said first and second cutting means being relatively movable towards each other for foil cutting engagement with the neck of a bottle, wherein, at least one of said cutting means including a pair of pivotally movable cutting members.

摘要翻译： 一种铝箔切割机，包括第一和第二箔切割装置，所述第一和第二切割装置可相对于彼此相对移动，以与瓶颈的箔切割接合，其中至少一个所述切割装置包括一对可转动切割 会员

公开(公告)号：US20050020584A1

公开(公告)日：2005-01-27

申请号：US10494011

申请日：2002-10-30

申请人： Wai Chan ,  Amanda Johns ,  Roderick Porter ,  Rachel Stead ,  Mythily Vimal

发明人： Wai Chan ,  Amanda Johns ,  Roderick Porter ,  Rachel Stead ,  Mythily Vimal

IPC分类号： A61K31/166 ,  A61K31/277 ,  A61K31/343 ,  A61K31/36 ,  A61K31/415 ,  A61K31/4192 ,  A61K31/4245 ,  A61K31/426 ,  A61K31/428 ,  A61K31/433 ,  A61K31/47 ,  A61K31/472 ,  A61P3/00 ,  A61P3/04 ,  A61P3/10 ,  A61P5/02 ,  A61P5/06 ,  A61P5/10 ,  A61P7/00 ,  A61P7/04 ,  A61P9/00 ,  A61P9/10 ,  A61P11/00 ,  A61P15/10 ,  A61P25/00 ,  A61P25/18 ,  A61P25/20 ,  A61P25/22 ,  A61P25/28 ,  A61P43/00 ,  C07C233/73 ,  C07C233/76 ,  C07C233/77 ,  C07C233/78 ,  C07C233/87 ,  C07C235/46 ,  C07C235/48 ,  C07C235/84 ,  C07C255/50 ,  C07C255/57 ,  C07C317/14 ,  C07D215/48 ,  C07D215/50 ,  C07D217/26 ,  C07D231/14 ,  C07D249/06 ,  C07D271/06 ,  C07D271/12 ,  C07D277/20 ,  C07D277/56 ,  C07D277/62 ,  C07D285/14 ,  C07D307/79 ,  C07D317/50 ,  C07D317/68 ,  C07D279/12 ,  A61K31/165 ,  A61K31/401 ,  A61K31/421 ,  A61K31/495 ,  A61K31/537 ,  A61K31/54

CPC分类号： C07D271/06 ,  C07C233/73 ,  C07C233/77 ,  C07C233/87 ,  C07C235/46 ,  C07C235/84 ,  C07C255/57 ,  C07C2603/18 ,  C07D215/48 ,  C07D215/50 ,  C07D217/26 ,  C07D231/14 ,  C07D249/06 ,  C07D277/56 ,  C07D307/79 ,  C07D317/68

摘要： This invention relates to certain benzamide derivatives and their use as pharmaceuticals.

摘要翻译： 本发明涉及某些苯甲酰胺衍生物及其作为药物的用途。

公开(公告)号：US20050014329A1

公开(公告)日：2005-01-20

申请号：US10918316

申请日：2004-08-14

申请人： Richard Williams ,  Michael Cornell ,  Wai Chan

发明人： Richard Williams ,  Michael Cornell ,  Wai Chan

IPC分类号： H01L21/331 ,  H01L21/329 ,  H01L21/761 ,  H01L21/8222 ,  H01L21/8238 ,  H01L21/8248 ,  H01L21/8249 ,  H01L27/06 ,  H01L27/08 ,  H01L27/092 ,  H01L29/732 ,  H01L29/861 ,  H01L29/76 ,  H01L31/062

CPC分类号： H01L21/26513 ,  H01L21/743 ,  H01L21/761 ,  H01L21/823878 ,  H01L21/823892 ,  H01L27/0629 ,  H01L27/0928 ,  H01L29/0878 ,  H01L29/1083 ,  H01L29/42368 ,  H01L29/66136 ,  H01L29/6625 ,  H01L29/735 ,  H01L29/7816 ,  H01L29/8611 ,  H01L2924/0002 ,  H01L2924/00

摘要： An structure for electrically isolating a semiconductor device is formed by implanting dopant into a semiconductor substrate that does not include an epitaxial layer. Following the implant the structure is exposed to a very limited thermal budget so that dopant does not diffuse significantly. As a result, the dimensions of the isolation structure are limited and defined, thereby allowing a higher packing density than obtainable using conventional processes which include the growth of an epitaxial layer and diffusion of the dopants. In one group of embodiments, the isolation structure includes a deep layer and a sidewall which together form a cup-shaped structure surrounding an enclosed region in which the isolated semiconductor device may be formed. The sidewalls may be formed by a series of pulsed implants at different energies, thereby creating a stack of overlapping implanted regions.

摘要翻译： 通过将掺杂剂注入到不包括外延层的半导体衬底中来形成用于电绝缘半导体器件的结构。 在植入后，该结构暴露于非常有限的热预算，使得掺杂剂不显着扩散。 结果，隔离结构的尺寸受限制和限定，从而允许比使用包括外延层生长和掺杂剂扩散的常规工艺可获得更高的堆积密度。 在一组实施例中，隔离结构包括深层和侧壁，其一起形成围绕可以形成隔离半导体器件的封闭区域的杯形结构。 侧壁可以由不同能量的一系列脉冲植入物形成，由此产生一叠重叠的注入区域。

公开(公告)号：US08641521B2

公开(公告)日：2014-02-04

申请号：US11225406

申请日：2005-09-12

申请人： Robert Silva ,  Edward Hennessy ,  Stephen Shaffer ,  Wai Chan

发明人： Robert Silva ,  Edward Hennessy ,  Stephen Shaffer ,  Wai Chan

IPC分类号： A63F9/24

CPC分类号： G07F17/32 ,  G06F9/455

摘要： Some implementations of the invention are directed to the use of legacy gaming software (or other non-native gaming software) in gaming machines that have a different architecture from that of the gaming machine for which the gaming software was written. Other implementations of the invention allow games of chance to be emulated, at least in part, on a device other than a gaming machine. The device may be, for example, a host device such as a workstation, a personal computer, a personal digital assistant, etc. The device may be a wired or a wireless device and may be used in a gaming establishment or at a remote location. Some aspects of the invention provide novel methods for dispute resolution and troubleshooting via such devices.

摘要翻译： 本发明的一些实施方案涉及在具有不同于具有游戏软件的游戏机的架构的游戏机的游戏机中使用传统游戏软件（或其他非本机游戏软件）。 本发明的其他实施方式允许游戏的机会至少部分地被模拟在除了游戏机之外的设备上。 该设备可以是例如诸如工作站，个人计算机，个人数字助理等的主机设备。设备可以是有线或无线设备，并且可以用于游戏机构或远程位置 。 本发明的一些方面通过这样的设备提供了用于争议解决和故障排除的新颖方法。

公开(公告)号：US08498985B2

公开(公告)日：2013-07-30

申请号：US13015570

申请日：2011-01-27

申请人： Jeanine E. Spence ,  Kathleen Linscott ,  Scott Neilson ,  Wai Chan ,  David M. Bozich ,  Craig Combel ,  Rob Nichols

发明人： Jeanine E. Spence ,  Kathleen Linscott ,  Scott Neilson ,  Wai Chan ,  David M. Bozich ,  Craig Combel ,  Rob Nichols

IPC分类号： G06F7/00

CPC分类号： G06Q10/06 ,  G06F9/453

摘要： Data elevation architecture for automatically and dynamically surfacing to a user interface (UI) context-specific data based on specific workflow or content currently being worked on by a user. Data is broken down into data elements and stored at a data element level in a data catalog using metadata, attributes, and relationships. Data elements are automatically selected from a comprehensive collection of the data catalogs based on relevancy and correlation to the current user task. The data catalog stores and relates the data elements and metadata based on criteria specified by content matching based on business terms or specified in a business process in predefined relationships between forms or specified by the user as correlated. The UI displays the data automatically in forms dynamically selected, populated, and presented at the point of focus or user activity so that the user can interact or take action immediately.

摘要翻译： 数据高程架构，用于根据用户正在处理的特定工作流程或内容自动和动态地呈现到用户界面（UI）上下文特定的数据。 数据被分解为数据元素，并使用元数据，属性和关系存储在数据目录中的数据元素级别。 基于与当前用户任务的相关性和相关性，从数据目录的综合收集中自动选择数据元素。 数据目录基于业务术语指定的内容匹配或在业务流程中指定的规则，将数据元素和元数据存储在相关联的用户指定的预定关系中。 UI以动态选择，填充和呈现的焦点或用户活动点的形式自动显示数据，以便用户立即进行交互或采取行动。