公开(公告)号：US20210378106A1

公开(公告)日：2021-12-02

申请号：US17333570

申请日：2021-05-28

Applicant: Google LLC

Inventor： Madhusudan K. Iyengar ,  Christopher Malone ,  Woon-Seong Kwon ,  Emad Samadiani ,  Melanie Beauchemin ,  Padam Jain ,  Teckgyu Kang ,  Yuan Li ,  Connor Burgess ,  Norman Paul Jouppi ,  Nicholas Stevens-Yu ,  Yingying Wang

IPC: H05K3/34 ,  H05K7/20 ,  H01L23/00

Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.

公开(公告)号：US10468359B2

公开(公告)日：2019-11-05

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon-Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/02 ,  H01L23/50 ,  H05K5/00

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US20190237411A1

公开(公告)日：2019-08-01

申请号：US16110133

申请日：2018-08-23

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woonseong Kwon ,  TeckGyu Kang

IPC: H01L23/00 ,  H05K5/02 ,  H05K5/00 ,  H01L23/50

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.

公开(公告)号：US10083920B1

公开(公告)日：2018-09-25

申请号：US15886246

申请日：2018-02-01

Applicant: Google LLC

Inventor： William Edwards ,  Erick Tuttle ,  Madhusudan Krishnan Iyengar ,  Yuan Li ,  Jorge Padilla ,  Woon Seong Kwon ,  TeckGyu Kang

IPC: H05K7/10 ,  H05K7/12 ,  H01L23/00 ,  H05K5/00 ,  H01L23/50 ,  H05K5/02

CPC classification number: H01L23/562 ,  H01L23/04 ,  H01L23/16 ,  H01L23/36 ,  H01L23/49811 ,  H01L23/50 ,  H05K5/0026 ,  H05K5/0217

Abstract: The subject matter of this specification generally relates to electronic packages. In some implementations, a lidless electronic package includes a substrate having a surface and a die disposed on the surface of the substrate. The die has an outside perimeter, a bottom surface adjacent to the surface of the substrate, and a top surface. The electronic package includes a stiffener disposed on the surface of the substrate. The stiffener includes a first surface that is a first distance from the surface of the substrate and a second surface disposed between the die and the first surface. The first distance is greater than a distance between the surface of the substrate and the top surface of the die. The second surface is a second distance from the surface of the substrate that is less than the distance between the surface of the substrate and the top surface of the die.