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公开(公告)号:US11724353B2
公开(公告)日:2023-08-15
申请号:US17834207
申请日:2022-06-07
CPC分类号: B24B31/006 , B23B35/00 , B24B5/40 , B24B31/003 , B24B31/116 , B24B33/02 , B24B57/04 , B23B2220/445 , B23B2226/18
摘要: Disclosed herein is a plasma-resistant chamber component and a method for manufacturing the same. A plasma-resistant chamber component of a semiconductor processing chamber that generates a plasma environment includes a ceramic article having multiple polished apertures. A roughness of the multiple polished apertures is less than 32 μin.
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公开(公告)号:US20230160055A1
公开(公告)日:2023-05-25
申请号:US18089807
申请日:2022-12-28
发明人: Vahid Firouzdor , Christopher Laurent Beaudry , Hyun-Ho Doh , Joseph Frederick Behnke , Joseph Frederick Sommers
IPC分类号: C23C14/08 , H01J37/32 , C23C4/134 , C23C14/00 , H01L21/67 , C23C14/22 , C04B35/486 , C04B35/505 , C04B35/622 , C04B35/111
CPC分类号: C23C14/083 , H01J37/32495 , C23C4/134 , C23C14/0052 , H01L21/67213 , C23C14/221 , C04B35/486 , C04B35/505 , C04B35/62222 , C23C14/081 , C04B35/111
摘要: Described herein is a protective coating composition that provides erosion and corrosion resistance to a coated article (such as a chamber component) upon the article's exposure to harsh chemical environment (such as hydrogen based and/or halogen based environment) and/or upon the article's exposure to high energy plasma. Also described herein is a method of coating an article with the protective coating using electronic beam ion assisted deposition, physical vapor deposition, or plasma spray. Also described herein is a method of processing wafer, which method exhibits, on average, less than about 5 yttrium based particle defects per wafer.
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公开(公告)号:US11566317B2
公开(公告)日:2023-01-31
申请号:US15711885
申请日:2017-09-21
发明人: Jennifer Y. Sun , Vahid Firouzdor , Biraja Prasad Kanungo , Tom K. Cho , Vedapuram S. Achutharaman , Ying Zhang
IPC分类号: C04B41/89 , C04B41/00 , C04B41/52 , C04B35/505 , C04B35/622 , C04B41/45 , C04B35/00 , C23C14/08 , C04B41/50 , C23C14/46 , C23C14/58 , H01J37/32 , C04B41/87
摘要: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide is selected from a group consisting of YF3, Er4Al2O9, ErAlO3, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
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公开(公告)号:US11424136B2
公开(公告)日:2022-08-23
申请号:US17137076
申请日:2020-12-29
IPC分类号: H01J37/32 , H01L21/67 , B65D43/02 , C23C4/11 , C23C4/12 , C23C4/04 , C23C4/10 , C23C4/01 , C23C14/00 , C23C4/134 , C23C4/14 , C23C4/16 , C23C14/08
摘要: A component for a processing chamber includes a ceramic body having at least one surface with a first average surface roughness. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness that is less than the first average surface roughness.
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公开(公告)号:US11053581B2
公开(公告)日:2021-07-06
申请号:US16685341
申请日:2019-11-15
发明人: Jennifer Y. Sun , Biraja P. Kanungo , Vahid Firouzdor , Tom Cho
摘要: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Er2O3, Er3Al5O12, and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
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公开(公告)号:US20180105922A1
公开(公告)日:2018-04-19
申请号:US15844251
申请日:2017-12-15
发明人: Jennifer Y. Sun , Vahid Firouzdor , Biraja Prasad Kanungo , Tom K. Cho , Vedapuram S. Achutharaman , Ying Zhang
IPC分类号: C23C14/08 , C04B35/505 , C04B35/622 , C04B41/00 , C04B41/45 , C04B41/50 , C23C14/46 , C04B41/87 , C04B41/89 , H01J37/32 , C23C14/58 , C04B41/52
CPC分类号: C23C14/088 , C04B35/00 , C04B35/505 , C04B35/62222 , C04B41/009 , C04B41/4529 , C04B41/5045 , C04B41/52 , C04B41/87 , C04B41/89 , C04B2235/3217 , C04B2235/3222 , C04B2235/3225 , C04B2235/3246 , C04B2235/3418 , C04B2235/3826 , C04B2235/3873 , C04B2235/428 , C04B2235/445 , C23C14/08 , C23C14/083 , C23C14/46 , C23C14/5806 , H01J37/32477 , Y10T428/26 , Y10T428/265 , C04B35/10 , C04B35/50 , C04B35/14 , C04B35/584 , C04B35/565 , C04B41/5032 , C04B41/5042 , C04B41/5035 , C04B2103/54
摘要: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide film consists essentially of 40 mol % to less than 100 mol % of Y2O3, over 0 mol % to 60 mol % of ZrO2, and 0 mol % to 9 mol % of Al2O3.
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公开(公告)号:US20180100228A1
公开(公告)日:2018-04-12
申请号:US15837787
申请日:2017-12-11
IPC分类号: C23C14/00 , H01L21/67 , B65D43/02 , H01J37/32 , C23C14/08 , C23C4/16 , C23C4/14 , C23C4/12 , C23C4/10 , C23C4/04
CPC分类号: H01L21/67023 , B65D43/02 , C23C4/01 , C23C4/04 , C23C4/10 , C23C4/11 , C23C4/12 , C23C4/134 , C23C4/14 , C23C4/16 , C23C14/0015 , C23C14/0021 , C23C14/0031 , C23C14/0036 , C23C14/0052 , C23C14/0084 , C23C14/0094 , C23C14/08 , C23C14/081 , C23C14/083 , C23C14/088 , H01J37/32477 , H01J37/32495 , H01J37/32513 , H01J2237/334 , H01L21/67063 , H01L21/67069 , H01L21/6708 , H01L21/67086 , Y10T428/131 , Y10T428/1317 , Y10T428/139 , Y10T428/1393
摘要: A component for a semiconductor processing chamber includes a ceramic body having at least one surface with a first average surface roughness of approximately 8-16 micro-inches. The component further includes a conformal protective layer on at least one surface of the ceramic body, wherein the conformal protective layer is a plasma resistant rare earth oxide film having a substantially uniform thickness of less than 300 μm over the at least one surface and having a second average surface roughness of below 10 micro-inches, wherein the second average surface roughness is less than the first average surface roughness.
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公开(公告)号:US20180073125A1
公开(公告)日:2018-03-15
申请号:US15814597
申请日:2017-11-16
发明人: Jennifer Y. Sun , Biraja P. Kanungo , Vahid Firouzdor , Tom Cho
CPC分类号: C23C14/08 , B32B18/00 , C23C14/083 , C23C14/22 , C23C14/228 , C23C14/34 , H01J37/32477 , H01J37/32495 , Y10T428/24355 , Y10T428/24967 , Y10T428/24975 , Y10T428/265
摘要: An article comprises a body and at least one protective layer on at least one surface of the body. The at least one protective layer is a thin film having a thickness of less than approximately 20 microns that comprises a ceramic selected from a group consisting of Y3Al5O12, Y4Al2O9, Er2O3, Gd2O3, Er3Al5O12, Gd3Al5O12 and a ceramic compound comprising Y4Al2O9 and a solid-solution of Y2O3—ZrO2.
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公开(公告)号:US09797037B2
公开(公告)日:2017-10-24
申请号:US15211993
申请日:2016-07-15
发明人: Jennifer Y. Sun , Vahid Firouzdor , Biraja Prasad Kanungo , Tom K. Cho , Vedapuram S. Achutharaman , Ying Zhang
IPC分类号: C23C14/08 , C23C14/46 , C04B41/50 , C04B41/52 , C23C14/58 , C04B41/89 , C04B35/505 , C04B35/622 , H01J37/32 , C04B41/87 , C04B41/00
CPC分类号: C23C14/088 , C04B35/00 , C04B35/505 , C04B35/62222 , C04B41/009 , C04B41/4529 , C04B41/5045 , C04B41/52 , C04B41/87 , C04B41/89 , C04B2235/3217 , C04B2235/3222 , C04B2235/3225 , C04B2235/3246 , C04B2235/3418 , C04B2235/3826 , C04B2235/3873 , C04B2235/428 , C04B2235/445 , C23C14/08 , C23C14/083 , C23C14/46 , C23C14/5806 , H01J37/32477 , Y10T428/26 , Y10T428/265 , C04B35/10 , C04B35/50 , C04B35/14 , C04B35/584 , C04B35/565 , C04B41/5032 , C04B41/5042 , C04B41/5035 , C04B2103/54
摘要: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide has a composition of 40-45 mol % of Y2O3, 5-10 mol % of ZrO2, 35-40 mol % of Er2O3, 5-10 mol % of Gd2O3, and 5-15 mol % of SiO2.
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公开(公告)号:US20170247795A1
公开(公告)日:2017-08-31
申请号:US15595888
申请日:2017-05-15
发明人: Jennifer Y. Sun , Vahid Firouzdor
CPC分类号: C25D11/34 , C23C24/04 , C23C28/321 , C23C28/322 , C23C28/345 , C23C28/3455 , C25D11/04 , C25D11/16 , C25D11/18 , C25D11/26 , Y10T428/12736 , Y10T428/12743 , Y10T428/12757 , Y10T428/12764
摘要: A component for a manufacturing chamber comprises a cold spray coating and an anodization layer on the cold spray coating. The anodization layer has a thickness of about 2-10 mil. The anodization layer comprises a low porosity bottom layer portion having a porosity that is less than about 40-50% and a porous columnar top layer portion having a porosity of about 40-40% and comprising a plurality of columnar nanopores having a diameter of about 10-50 nm.
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