公开(公告)号：US20180264783A1

公开(公告)日：2018-09-20

申请号：US15761274

申请日：2016-09-23

申请人： JX Nippon Mining & Metals Corporation

发明人： Terumasa Moriyama ,  Masafumi Ishii

IPC分类号： B32B15/08 ,  B32B15/20 ,  C25D1/04 ,  C25D1/22 ,  C25D7/06 ,  C25D5/16 ,  H05K3/38 ,  H05K3/46

CPC分类号： B32B15/08 ,  B32B15/04 ,  B32B15/20 ,  C23C18/1605 ,  C23C18/38 ,  C25D1/04 ,  C25D1/22 ,  C25D3/38 ,  C25D3/562 ,  C25D5/16 ,  C25D7/0614 ,  C25D9/08 ,  H05K3/108 ,  H05K3/381 ,  H05K3/384 ,  H05K3/426 ,  H05K3/46 ,  H05K3/4661 ,  H05K2201/0355 ,  H05K2203/1152

摘要： Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.

公开(公告)号：US10057977B2

公开(公告)日：2018-08-21

申请号：US15465150

申请日：2017-03-21

申请人： FUJITSU LIMITED

发明人： Kenichi Kawai

IPC分类号： H05K1/02 ,  H04B3/32 ,  H04B1/16 ,  H04B1/30

CPC分类号： H05K1/0245 ,  H04B1/16 ,  H04B3/32 ,  H04B2001/305 ,  H05K3/46 ,  H05K2201/09709

摘要： A wiring board includes a first wire, a second wire, a third wire and a fourth wire formed over a substrate and extending in a first direction respectively, the second wire being adjacent to the first wire in the first direction, and the third wire being adjacent to the first wire in a second direction orthogonal to the first direction, and the fourth wire being adjacent to the second wire in the second direction, a pair of fifth wires, a pair of sixth wires, a pair of seventh wires and a pair of eighth wires formed in the substrate and extending in the second direction respectively, a pair of ninth signal vias, a pair of tenth signal vias, a pair of eleventh signal vias and a pair of twelfth signal vias formed in the substrate and extending in a third direction orthogonal to a surface of the substrate respectively.

公开(公告)号：US20180177059A1

公开(公告)日：2018-06-21

申请号：US15127609

申请日：2015-03-11

申请人： Noda Screen Co., Ltd.

发明人： Atsunori HATTORI

IPC分类号： H05K3/30 ,  H01G4/33 ,  H05K3/00 ,  H01L49/02 ,  H05K3/32 ,  H05K1/16 ,  H05K1/02 ,  H01L23/498 ,  H01L23/64

CPC分类号： H05K3/303 ,  H01G4/33 ,  H01G4/38 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/642 ,  H01L28/60 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/002 ,  H05K3/32 ,  H05K3/46

摘要： A method for manufacturing a thin-film capacitor in a circuit substrate includes: forming, on a dielectric film formed on a surface of a support member, a first electrode layer of the thin-film capacitor; forming, on the dielectric film and the first electrode layer, an insulating base material of the circuit substrate so as to bury the first electrode layer; removing the support member and exposing a surface of the dielectric film on a side opposite to the first electrode layer; patterning the dielectric film so as to leave a dielectric layer overlapping the first electrode layer; forming a first through hole in the dielectric layer so as to expose a part of a surface, on a dielectric layer side, of the first electrode layer; and forming a second electrode layer of the capacitor so as to overlap the dielectric layer including the inside of the first through hole.

公开(公告)号：US09992873B2

公开(公告)日：2018-06-05

申请号：US14967907

申请日：2015-12-14

申请人： HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. ,  FuKui Precision Component (Shenzhen) Co., Ltd. ,  Zhen Ding Technology Co., Ltd.

发明人： Yu-Cheng Huang

IPC分类号： H05K3/02 ,  H05K1/18 ,  H05K1/02 ,  H05K3/00 ,  H05K3/30 ,  H05K3/46 ,  H05K3/04 ,  H05K3/20 ,  H05K3/06

CPC分类号： H05K1/181 ,  H05K1/0298 ,  H05K3/0038 ,  H05K3/0058 ,  H05K3/007 ,  H05K3/045 ,  H05K3/06 ,  H05K3/20 ,  H05K3/303 ,  H05K3/46 ,  H05K2203/025

摘要： A circuit board includes a dielectric layer, a first circuit layer, a second circuit layer and at least an electrically conductive pole. The dielectric layer includes a first side and a second side opposite to the first side. The first circuit layer is located at the first side of the dielectric layer, and includes a plurality of spaced first circuit patterns embedded into the dielectric layer. The second circuit layer is located at the second side of the dielectric layer, and includes a plurality of spaced second circuit patterns located outsides the dielectric layer. The electrically conductive pole electrically couples the first circuit layer to the second circuit layer. Each of the first circuit patterns has an extension direction from the first side toward the second side, and has widths thereof gradually decreasing along the extension direction. A method for manufacturing the circuit board is also provided.

公开(公告)号：US20180141321A1

公开(公告)日：2018-05-24

申请号：US15874021

申请日：2018-01-18

申请人： Murata Manufacturing Co., Ltd.

发明人： Keisuke IKENO ,  Shigeru TAGO ,  Hirohumi SHINAGAWA ,  Kuniaki YOSUI ,  Yuki ITO

IPC分类号： B32B37/06 ,  B32B37/10 ,  H05K3/46

CPC分类号： B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2307/202 ,  B32B2307/206 ,  C09K19/38 ,  H01L23/5383 ,  H05K3/46 ,  H05K2201/0129

摘要： A resin multilayer substrate includes insulating base materials integrated by thermocompression bonding and each including a thermoplastic resin as a main material. The insulating base materials include a first insulating base material with a first conductor pattern thereon, and a second insulating base material with a second conductor pattern thereon. The second insulating base material, an intermediate resin material layer, and the first insulating base material are stacked in this order. The intermediate resin material layer includes an intermediate region and an end region in contact with the surface on a first side of the second conductor pattern. The surface on the first side of the intermediate resin material layer is in contact with the first insulating base material, and, when seen in plan view, the first conductor pattern extends over the intermediate region and the end region.

公开(公告)号：US09978692B2

公开(公告)日：2018-05-22

申请号：US14997048

申请日：2016-01-15

申请人： MediaTek Inc.

发明人： PoHao Chang ,  Chun-Wei Chang ,  Ching-Chih Li

IPC分类号： H05K1/02 ,  H01L23/552 ,  H01L23/66 ,  H01L23/528 ,  H01L27/12 ,  H04B3/32 ,  H01L23/498 ,  H05K3/46 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/552 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/66 ,  H01L24/16 ,  H01L25/0655 ,  H01L27/12 ,  H01L2223/6688 ,  H01L2224/16227 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/3025 ,  H04B3/32 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0243 ,  H05K3/46

摘要： An integrated circuit is provided. The integrated circuit includes a control circuitry, a plurality of pins, and a plurality of driving units coupled to the pins. The control circuitry provides a plurality of control signals according to data to be transmitted. The pins are coupled to a device via a plurality of conductive traces of a printed circuit board (PCB). The control signals control each of the driving units to selectively provide the data or one specific shielding pattern via the corresponding pin and the corresponding conductive trace of PCB to the device.

公开(公告)号：US20180130841A1

公开(公告)日：2018-05-10

申请号：US15561872

申请日：2016-02-25

申请人： KYOCERA Corporation

发明人： Shinji WATANABE

IPC分类号： H01L27/146 ,  H05K1/03 ,  H01L23/482 ,  H01L23/498

CPC分类号： H01L27/14636 ,  H01L23/12 ,  H01L23/4824 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5383 ,  H01L23/5386 ,  H01L27/14 ,  H01L2224/16225 ,  H05K1/02 ,  H05K1/0393 ,  H05K3/46

摘要： An imaging component includes a laminated substrate formed of a resin material; a plurality of electrode pads disposed on an upper face of the laminated substrate, an imaging element being to be mounted on the plurality of electrode pads; and a plurality of conductor patterns which are belt-shaped and disposed between layers of the laminated substrate, the plurality of conductor patterns being connected to the plurality of electrode pads, respectively. A part of at least one of the plurality of conductor patterns has a widened portion, the widened portion being located immediately below any of electrode pads which are not connected to the at least one of the plurality of conductor patterns.

公开(公告)号：US09949368B2

公开(公告)日：2018-04-17

申请号：US15695038

申请日：2017-09-05

申请人： Murata Manufacturing Co., Ltd.

发明人： Takahiro Baba

IPC分类号： H05K1/09 ,  H05K1/00 ,  H05K1/03 ,  H05K3/46 ,  H05K1/02

CPC分类号： H05K1/0306 ,  H05K1/02 ,  H05K1/0207 ,  H05K1/0242 ,  H05K1/0243 ,  H05K1/036 ,  H05K3/46 ,  H05K3/4632

摘要： A resin substrate includes an insulating substrate, and first and second signal conductors that partially extend in parallel or substantially in parallel with each other along a signal transmission direction. The first signal conductor includes a parallel portion that extends in parallel or substantially in parallel with the second signal conductor along the signal transmission direction, and a first connection portion. In a portion where the first signal conductor and the second signal conductor extend in parallel or substantially in parallel with each other, the first signal conductor and the second signal conductor are disposed at a same position in the thickness direction of the insulating substrate, and the first connection portion is disposed at a different position from the second signal conductor in the thickness direction and a width direction of the insulating substrate.

公开(公告)号：US20180070446A1

公开(公告)日：2018-03-08

申请号：US15558445

申请日：2016-03-14

申请人： TATSUTA ELECTRIC WIRE & CABLE CO., LTD.

发明人： Akio TAKAHASHI ,  Tsunehiko TERADA

IPC分类号： H05K1/02 ,  H01B7/04 ,  H01B1/22 ,  H05K1/11 ,  H05K1/18 ,  H01B7/00 ,  H05K3/40 ,  H05K3/12 ,  H05K3/46 ,  H05K3/20 ,  H05K3/30 ,  H05K1/09

CPC分类号： H05K1/0283 ,  B32B27/18 ,  H01B1/22 ,  H01B7/0009 ,  H01B7/04 ,  H01B7/06 ,  H01B7/08 ,  H05K1/09 ,  H05K1/095 ,  H05K1/115 ,  H05K1/181 ,  H05K3/1283 ,  H05K3/207 ,  H05K3/303 ,  H05K3/4053 ,  H05K3/46 ,  H05K3/4664

摘要： A stretchable cable 1 includes a sheet-shaped stretchable base material 2 exhibiting elasticity and elongated in one direction, and a stretchable wiring 3 formed on one surface of the stretchable substrate 2 and exhibiting elasticity. The stretchable base material 2 is made of a material exhibiting elasticity. The stretchable wiring 3 is made of a conductive composition including elastomer and a conductive filler filling the elastomer.

公开(公告)号：US20180052391A1

公开(公告)日：2018-02-22

申请号：US15559714

申请日：2016-03-15

申请人： Toray Industries, Inc.

发明人： Yuki Katsurada ,  Koichi Aoki ,  Hideki Shinohara

IPC分类号： G03F7/037 ,  C08G73/10 ,  H05K3/46

CPC分类号： G03F7/037 ,  C08G73/1025 ,  G03F7/004 ,  H05K3/46

摘要： A photosensitive resin composition contains (a) a polyimide which has, at a terminal of the main chain, at least one group selected from the group consisting of a carboxyl group, a phenolic hydroxyl group, a sulfonic acid group and a thiol group, (b) a monomer, (c) a thermally crosslinkable compound, (d) a photopolymerization initiator and (e) a polymerization inhibitor, wherein the polymerization inhibitor (e) is a compound obtained by adding at least one hydroxyl group, alkoxy group, aryloxy group or aralkyloxy group to a naphthalene skeleton or an anthracene skeleton of a compound having a naphthalene skeleton or an anthracene skeleton.