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    Selective PCB stiffening with preferentially oriented fibers
    24.
    发明申请
    Selective PCB stiffening with preferentially oriented fibers 失效
    具有优先取向纤维的选择性PCB加强

    公开(公告)号：US20040131824A1

    公开(公告)日：2004-07-08

    申请号：US10742024

    申请日：2003-12-17

    Applicant: Intel Corporation

    Inventor： George Hsieh ,  Terrance J. Dishongh ,  Scott Dixon

    IPC: B32B005/12

    CPC classification number: B29C70/083 ,  B32B5/12 ,  B32B27/04 ,  H05K1/0271 ,  H05K1/0366 ,  H05K2201/0287 ,  H05K2201/029 ,  Y10S428/901 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24091 ,  Y10T428/24099 ,  Y10T428/24116 ,  Y10T428/24124

    Abstract: Apparatus and methods are presented for reinforcing and stiffening a printed circuit board (PCB) in selected locations by utilizing preferentially oriented fibers. Selected fibers within the polymeric material matrix of the PCB fiber-matrix layer are removed and replaced with a similar quantity of fibers in a preferential orientation. Various combinations of layering of modified fiber-matrix layer material with conventional fiber-matrix layer material are presented to achieve the desired PCB stiffening. Printed circuit boards, under the weight of heavy attached electronic components, may deflect or flex along an axis, defined as the characteristic fold. This flexing is exasperated with manufacturing and handling loading, particularly when mounted in a chassis. Preferentially orientated fibers laid transverse to the characteristic fold reinforces the area to resist flexure within the area surrounding the characteristic fold. Reducing PCB flexure is particularly important in locations of the PCB containing surface mount technology (SMT) components, such as ball grid array electronic components. The lead attachment for BGA components is particularly susceptible to PCB flexure resulting in lead fatigue, fracture and failure. The presented methods and apparatus provide PCB stiffening without the addition of external PCB stiffeners and without effecting the PCB overall thickness, fiber to matrix ratio, uniform properties, or dielectric properties.

    Abstract translation: 提出了通过利用优先取向的纤维来增强和加强选定位置的印刷电路板（PCB）的装置和方法。 在PCB纤维基质层的聚合材料基质中选择的纤维被去除，并以优先取向的相似量的纤维代替。 提出了改进的纤维基质层材料与常规纤维基质层材料的层叠的各种组合以实现期望的PCB加强。 印刷电路板在重型附着电子元件的重量下可能会沿着一个轴线偏转或弯曲，定义为特征折叠。 这种弯曲在制造和处理负载方面令人厌烦，特别是当安装在底盘中时。 横向于特征折叠铺设的优先定向纤维加强了区域以抵抗围绕特征折叠的区域内的挠曲。 减少PCB弯曲在含有PCB的表面贴装技术（SMT）部件（例如球栅阵列电子部件）的位置中尤其重要。 BGA组件的导线附件特别易受PCB弯曲影响，导致铅疲劳，断裂和故障。 所提出的方法和装置提供PCB加强，而不需要增加外部PCB加强件，而不影响PCB的整体厚度，纤维与基体之比，均匀的性能或介电性能。

    Method of manufacturing a multilayer printed wire board
    29.
    发明授权
    Method of manufacturing a multilayer printed wire board 失效
    制造多层印刷线路板的方法

    公开(公告)号：US5633072A

    公开(公告)日：1997-05-27

    申请号：US483427

    申请日：1995-06-07

    Applicant: Erik Middelman ,  Pieter H. Zuuring

    Inventor： Erik Middelman ,  Pieter H. Zuuring

    IPC: H05K1/03 ,  H05K3/38 ,  H05K3/46 ,  B32B9/00

    CPC classification number: H05K3/4655 ,  B32B37/12 ,  H05K1/0366 ,  B32B2457/08 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  H05K3/386 ,  H05K3/4652 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249994

    Abstract: A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the back-up substrate comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

    Abstract translation: 一种也称为多层的多层印刷线路板的制造方法，其包括至少两个电绝缘基板，其中至少三个表面设置有导电迹线或层，其中通过压力层压 基于UD增强的合成材料的固化的基底基材在两侧设置有痕迹，与备用基板结合并结合到支撑基板上，其中在层压工艺期间将支撑基板添加到基底基板， 所述支撑衬底包括至少在面向所述基底衬底的导电迹线的一侧上设置的UD增强的固化芯层，其具有仍然可塑性（可流动的）粘合剂层，并且这种压力施加在所述层压板上以带来 所述后备基板的固化芯层与基板的导电迹线接触或实际接触，并且这些迹线之间的间隔为 填充有粘合剂材料，从而粘合基材和备用基材。

    Method of making multilayer printed circuit board
    30.
    发明授权
    Method of making multilayer printed circuit board 失效
    制作多层印刷电路板的方法

    公开(公告)号：US4875282A

    公开(公告)日：1989-10-24

    申请号：US268127

    申请日：1988-11-07

    Applicant: Joseph D. Leibowitz

    Inventor： Joseph D. Leibowitz

    IPC: H05K1/03 ,  H05K3/46

    CPC classification number: H05K3/4626 ,  H05K1/0366 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0278 ,  H05K2201/0287 ,  H05K2201/068 ,  Y10T29/49126

    Abstract: A multilayer printed circuit board in which multiple layers of a composite material, fabricated by the lay-up of an aramid fiber tape, are employed to provide a circuit board with a desired coefficient of thermal expansion. Tape lay-up of aramid fibers provides a composite layer having a lower thermal coefficient of expansion than a composite layer fabricated from woven aramid fibers. Degradation in the tensile modulus of elasticity caused by the over and under characteristics of woven fabrics is also eliminated by tape lay-up, thus providing a circuit board with better mechanical strength. In addition, tape lay-up reduces the amount of resin required to fabricate the circuit board and eliminates the need for twisting the aramid fibers into yarns and then weaving the yarns, thus reducing the cost of the circuit board.

    Abstract translation: 使用通过芳族聚酰胺纤维带的层叠制造多层复合材料的多层印刷电路板来为电路板提供所需的热膨胀系数。 芳族聚酰胺纤维的胶带层叠提供具有比由编织芳族聚酰胺纤维制成的复合层更低的热膨胀系数的复合层。 由织物的上下特性引起的拉伸弹性模量的降低也通过带状铺层消除，从而为电路板提供更好的机械强度。 另外，带状铺层减少了制造电路板所需的树脂量，并且不需要将芳族聚酰胺纤维扭曲成纱线，然后编织纱线，从而降低了电路板的成本。

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