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    Circuit board and production of the same
    1.
    发明申请
    Circuit board and production of the same 失效
    电路板和生产相同

    公开(公告)号：US20020038725A1

    公开(公告)日：2002-04-04

    申请号：US09928869

    申请日：2001-08-13

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Takeshi Suzuki ,  Tatsuo Ogawa ,  Yoshihiro Bessho ,  Satoru Tomekawa ,  Yasuhiro Nakatani ,  Yoji Ueda ,  Susumu Matsuoka ,  Daizo Andoh ,  Fumio Echigo

    IPC: H05K001/11

    CPC classification number: H05K1/0373 ,  H05K1/036 ,  H05K3/20 ,  H05K3/202 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2203/1461 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

    Abstract: A circuit board is configured so as to include not less than two wiring layers, an insulator layer for electric insulation between the wiring layers, and an inner-via-hole conductive member provided in the insulator layer in a thickness direction of the insulator layer, for electric connection between the wiring layers. The insulator layer is made of a composite material containing an organic resin and a material having a smaller thermal expansion coefficient than that of the organic resin, and includes a surface part, a core part, and a surface part laminated in the stated order, the surface part having a high content of the organic resin, the core part having a low content of the organic resin. The wiring layers have a land portion that is connected with the inner-via-hole conductive member, the land portion being embedded so as to be substantially in contact with the core part, and the inner-via-hole conductive member has a thickness substantially equal to a thickness of the core part. According to this configuration, a part of the metal foil is embedded in the insulator layer so as to be in contact with the core layer. Therefore, this makes it possible to provide a circuit board in which portions of the conductive material can be selectively compressed, and which hence is capable of ensuring stable connection between layers.

    Abstract translation: 电路板被构造成在布线层之间包括不少于两个布线层，用于电绝缘的绝缘体层和在绝缘体层的厚度方向上设置在绝缘体层中的内通孔导电构件， 用于布线层之间的电连接。 绝缘体层由包含有机树脂和热膨胀系数小于有机树脂的材料的复合材料制成，并且包括以所述顺序层压的表面部分，芯部分和表面部分， 表面部分具有高含量的有机树脂，芯部分的有机树脂含量低。 所述布线层具有与所述内通孔导电部件连接的台面部，所述接合部嵌入以与所述芯部大体接触，所述内通孔导电部件的厚度基本上 等于芯部的厚度。 根据该结构，将金属箔的一部分嵌入到绝缘体层中以与芯层接触。 因此，能够提供能够选择性地压缩导电材料的部分的电路基板，由此能够确保层之间的稳定的连接。

    Printed wiring board and method of manufacturing the same
    3.
    发明申请
    Printed wiring board and method of manufacturing the same 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20030137815A1

    公开(公告)日：2003-07-24

    申请号：US10340041

    申请日：2003-01-09

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Shozo Ochi ,  Fumio Echigo ,  Yoji Ueda ,  Yasushi Nakagiri ,  Takeshi Suzuki

    IPC: H05K001/11 ,  H05K001/14

    CPC classification number: H05K3/4069 ,  H05K3/386 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/0191 ,  H05K2203/1461

    Abstract: An electrically insulating base material includes a core layer 102, a resin layer 101 on each surface of the core layer 102 and a conductive material 105 filled into through holes 104 formed in a thickness direction. On each surface of the electrically insulating base material, a metal foil 106 is laminated, and a laminate thus obtained is heated and pressed. A conductive filler in the conductive material 105 has a mean particle diameter equal to or larger than a thickness of the resin layer 101, and thus the conductive filler can be prevented from being diffused into the resin layer 101 in a heating and pressing process. As a result, the conductive filler can be densified, thereby allowing a printed wiring board with via hole connection having high connection reliability to be obtained.

    Abstract translation: 电绝缘基材包括芯层102，芯层102的每个表面上的树脂层101和填充在厚度方向形成的通孔104中的导电材料105。 在电绝缘基材的每个表面上层压金属箔106，并将如此获得的层压体加热并加压。 导电材料105中的导电填料具有等于或大于树脂层101的厚度的平均粒径，因此可以防止导电填料在加热和加压过程中扩散到树脂层101中。 结果，导电填料可以被致密化，从而可以获得具有高连接可靠性的通孔连接的印刷电路板。

    Prepreg and circuit board and method for manufacturing the same
    7.
    发明申请
    Prepreg and circuit board and method for manufacturing the same 失效
    预浸料和电路板及其制造方法

    公开(公告)号：US20030082363A1

    公开(公告)日：2003-05-01

    申请号：US10280762

    申请日：2002-10-24

    Applicant: Matsushita Electric Industrial Co., Ltd.

    Inventor： Yasushi Nakagiri ,  Takeshi Suzuki ,  Fumio Echigo

    IPC: B32B003/00

    CPC classification number: B32B5/26 ,  B32B3/266 ,  B32B5/022 ,  B32B15/14 ,  B32B2250/05 ,  B32B2250/40 ,  H05K1/036 ,  H05K3/4069 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/10378 ,  H05K2203/0759 ,  H05K2203/1461 ,  Y10T428/24917 ,  Y10T428/249971

    Abstract: The present invention provides a prepreg and a circuit board that can achieve, e.g., low interstitial via connection resistance, excellent connection stability, and high durability, regardless of materials, physical properties, and a combination of the materials of an insulating layer. The present invention also provides a method for manufacturing the prepreg and the circuit board. The prepreg of the present invention includes a laminate including at least one first layer and at least one second layer. The first layer is an insulating layer that includes a resin. The second layer has pores that connect an upper and a lower surface of the second layer, and the upper and the lower surface of the second layer differ from each other in at least one selected from open are ratio and average pore diameter. Using this prepreg makes it possible to provide a circuit board that is characterized, e.g., by low interstitial via connection resistance, excellent connection stability, and high durability.

    Abstract translation: 本发明提供一种预浸料和电路板，其可以通过连接电阻实现例如低间隙，优异的连接稳定性和高耐久性，而不管材料，物理性质以及绝缘层的材料的组合。 本发明还提供了一种制造预浸料和电路板的方法。 本发明的预浸料包括包含至少一个第一层和至少一个第二层的层压体。 第一层是包括树脂的绝缘层。 第二层具有连接第二层的上表面和下表面的孔，并且第二层的上表面和下表面在选自开口比和平均孔径中的至少一个中彼此不同。 使用这种预浸料可以提供一种电路板，其特征在于例如通过连接电阻的低间隙，良好的连接稳定性和高的耐久性。

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