MEMORY DEVICE INCLUDING PHASE-CHANGE MATERIAL

    公开(公告)号:US20230380195A1

    公开(公告)日:2023-11-23

    申请号:US18150123

    申请日:2023-01-04

    CPC classification number: H10B63/845 H10B63/10 H10B63/24

    Abstract: A memory device including a phase-change material includes: a substrate; a first memory cell including a first selection layer and a first phase-change material layer, and a second memory cell including a second selection layer and a second phase-change material layer, wherein the first memory cell and the second memory cell are arranged apart from each other with an insulating layer therebetween in a normal direction of the substrate, wherein the first phase-change material layer and the second phase-change material layer include: a first layer including a thermal confinement material; and a second layer including a phase-change material, respectively, wherein the first layer and the second layer extend in a direction vertical to the substrate, and wherein the first phase-change material layer is physically isolated from the second phase-change material layer by the insulating layer.

    Semiconductor apparatus
    26.
    发明授权

    公开(公告)号:US12268105B2

    公开(公告)日:2025-04-01

    申请号:US18349433

    申请日:2023-07-10

    Abstract: A semiconductor apparatus may include a plurality of semiconductor unit devices. Each of the semiconductor unit devices may be arranged between a first insulating layer and a second insulating layer that are apart from each other in a direction normal to a substrate. Each of the semiconductor unit devices may include a selection device layer and a phase change material layer that extend side by side in a direction parallel to the substrate. The phase change material layer may have a superlattice-like structure. The phase change material layer may be arranged along a recess portion that is formed by the first insulating layer, the second insulating layer, and the selection device layer.

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