知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

46 records (took 0.022 seconds)

    COMPACT OPTO-ELECTRONIC MODULES AND FABRICATION METHODS FOR SUCH MODULES
    21.
    发明申请
    COMPACT OPTO-ELECTRONIC MODULES AND FABRICATION METHODS FOR SUCH MODULES 审中-公开

    公开(公告)号：US20170207374A1

    公开(公告)日：2017-07-20

    申请号：US15473935

    申请日：2017-03-30

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Simon Gubser ,  Mario Cesana ,  Markus Rossi ,  Hartmut Rudmann

    IPC: H01L33/56 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/0203 ,  H01L31/0216 ,  H01L33/44 ,  H01L33/48 ,  H01L33/54

    Abstract: Various optoelectronic modules are described and include one or more optoelectronic devices. Each optoelectronic module includes one or more optoelectronic devices. Sidewalls laterally surround each optoelectronic device and can be in direct contact with sides of the optoelectronic device or, in some cases, with an overmold surrounding the optoelectronic device. The sidewalls can be composed, for example, of a vacuum injected material that is non-transparent to light emitted by or detectable by the optoelectronic device. The module also includes a passive optical element. Depending on the implementation, the passive optical element can be on a cover for the module, directly on a top surface of the optoelectronic device, or on an overmold surrounding the optoelectronic device. Methods of fabricating such modules are described as well, and can facilitate manufacturing the modules using wafer-level processes.

    OPTO-ELECTRONIC MODULE INCLUDING A NON-TRANSPARENT SEPARATION MEMBER BETWEEN A LIGHT EMITTING ELEMENT AND A LIGHT DETECTING ELEMENT
    24.
    发明申请
    OPTO-ELECTRONIC MODULE INCLUDING A NON-TRANSPARENT SEPARATION MEMBER BETWEEN A LIGHT EMITTING ELEMENT AND A LIGHT DETECTING ELEMENT 有权
    光电模块，包括发光元件和光检测元件之间的非透明分离元件

    公开(公告)号：US20160216138A1

    公开(公告)日：2016-07-28

    申请号：US14915567

    申请日：2013-09-02

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： Hartmut Rudmann ,  Alexander Bietsch ,  Susanne Westenhöfer ,  Simon Gubser ,  Samuele Laffranchini

    IPC: G01D5/40 ,  G02B5/22 ,  G02B5/20

    CPC classification number: G01D5/40 ,  G02B5/208 ,  G02B5/223 ,  G02B6/4204 ,  G02B6/4246 ,  G02B6/4249 ,  G03B7/099 ,  H01L27/14625 ,  H01L27/14678 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An opto-electronic sensor module (e.g., an optical proximity sensor module) includes a substrate, a light emitter mounted on a first surface of the substrate, the light emitter being operable to emit light at a first wavelength, and a light detector mounted on the first surface of the substrate, the light detector being operable to detect light at the first wavelength. The module includes an optics member disposed substantially parallel to the substrate, and a separation member disposed between the substrate and the optics member. The separation member may surround the light emitter and the light detector, and may include a wall portion that extends from the substrate to the optics member and that separates the light emitter and the light detector from one another. The separation member may be composed, for example, a thermosetting polymer material, a UV-curing polymer material or a visible light-curing polymer material, wherein the separation member further includes one or more inorganic fillers and/or dyes that make the separation member substantially non-transparent to light detectable by the light detector and/or emitted by the light emitter.

    Abstract translation: 光电传感器模块（例如，光学接近传感器模块）包括基板，安装在基板的第一表面上的光发射器，该光发射器可操作以发射第一波长的光;以及光检测器，其安装在 基板的第一表面，光检测器可操作以检测第一波长的光。 该模块包括基本上平行于基板设置的光学部件，以及设置在基板和光学部件之间的分离部件。 分离构件可以围绕光发射器和光检测器，并且可以包括从基板延伸到光学构件并将光发射器和光检测器彼此分离的壁部分。 分离构件可以由例如热固性聚合物材料，UV固化聚合物材料或可见光固化聚合物材料构成，其中分离构件还包括一种或多种无机填料和/或染料，其使分离构件 对光检测器可检测的光和/或由光发射器发射的光基本上不透明。

Patent Agency Ranking