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公开(公告)号:US20210220826A1
公开(公告)日:2021-07-22
申请号:US16763838
申请日:2019-12-06
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Zhao Cui , Qi Yao
IPC: B01L3/00
Abstract: The present disclosure provides an electrode plate, a microfluidic chip, and a method of manufacturing the electrode plate. In one embodiment, an electrode plate includes: a substrate, an electrode and a surface contact layer stacked in sequence, and a droplet inlet hole passing through the substrate, the electrode and the surface contact layer. The surface contact layer comprises a super-hydrophobic region and a hydrophilic region, and the droplet inlet hole is disposed in the hydrophilic region. The microfluidic chip includes: a first electrode plate formed by the abovementioned electrode plate, and a second electrode plate provided on a side of the first electrode plate close to the surface contact layer. The first electrode plate is provided opposite to the second electrode plate and a liquid channel is formed between the first electrode plate and the second electrode plate.
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公开(公告)号:US20200083481A1
公开(公告)日:2020-03-12
申请号:US16429531
申请日:2019-06-03
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu Liu , Feng Zhang , Qi Yao , Zhijun Lv , Liwen Dong , Shizheng Zhang , Ning Dang , Xiaoxin Song , Zhao Cui
Abstract: A display substrate, a manufacturing method thereof, and a display device are provided, in the field of display technology. The display substrate includes a base substrate, and a thin-film transistor, a light-emitting device, an encapsulation structure, and a conductive film layer sequentially disposed on the base substrate in a direction away from the base substrate. Since the display substrate includes a conductive film layer on a side of the encapsulation structure away from the base substrate, when the protective film layer on the side of the conductive film layer away from the base substrate is peeled off, static electricity generated by the separation of the film layer can be released to the conductive film layer, avoiding electron transition to the active layer of the thin-film transistor in the display substrate to cause offset of the threshold voltage of the thin-film transistor. The display brightness uniformity of the display substrate can be ensured.
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23.
公开(公告)号:US20250023217A1
公开(公告)日:2025-01-16
申请号:US18281111
申请日:2022-03-18
Applicant: BOE Technology Group Co., Ltd.
Inventor: Liuqing Li , Zhao Cui , Feng Qu , Qi Yao , Feng Zhang , Wenqu Liu , Liwen Dong , Zhijun Lv , Dongfei Hou , Detian Meng , Libo Wang
Abstract: A tunable phase shifter and a method for manufacturing the same, and a tunable phase shifting device. The phase shifter includes a first substrate, a second substrate, and a tunable dielectric layer between the first substrate and the second substrate; the first substrate includes a first base substrate and a first electrode on the first base substrate; the second substrate includes a second base substrate and a second electrode on the second base substrate; an orthographic projection of the first electrode on the first base substrate is at least partially overlapped with an orthographic projection of the second electrode on the first base substrate, and sheet resistances of materials of the first electrode and the second electrode are both less than or equal to 0.024Ω/□.
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公开(公告)号:US12199081B2
公开(公告)日:2025-01-14
申请号:US17299798
申请日:2020-08-31
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu Liu , Feng Zhang , Qi Yao , Zhao Cui , Liwen Dong , Zhijun Lv , Dongfei Hou , Detian Meng , Xiaoxin Song , Libo Wang
Abstract: Provided is a display substrate, which includes a base substrate, a circuit structure layer disposed on the base substrate, multiple ultrasonic sensing elements and multiple micro light-emitting elements. The multiple ultrasonic sensing elements are disposed on a side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer, and the multiple light-emitting elements are disposed on the side of the circuit structure layer away from the base substrate, and are electrically connected to the circuit structure layer. An orthographic projection of the multiple ultrasonic sensing elements on the base substrate does not overlap with an orthographic projection of the multiple micro light-emitting elements on the base substrate.
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公开(公告)号:US20240431211A1
公开(公告)日:2024-12-26
申请号:US18274052
申请日:2022-07-15
Applicant: BOE Technology Group Co., Ltd.
Inventor: Rui Huang , Zhao Cui , Jinchao Zhang , Wenqu Liu , Yue Tong , Liwei Liu , Yonggang Cao
Abstract: A thin film transistor and an ultrasonic imaging base board. The thin film transistor includes: a substrate (100), and a first gate (101), a first gate insulation layer (102), a first active layer (103), a second gate insulation layer (104) and a second gate (105) stacked on a side of the substrate (100), and the first gate (101) is connected to the second gate (105).
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公开(公告)号:US11875596B2
公开(公告)日:2024-01-16
申请号:US17771706
申请日:2021-03-12
Applicant: BOE Technology Group Co., Ltd.
Inventor: Lubin Shi , Hongrun Wang , Fuqiang Li , Wenqu Liu
IPC: G06F3/041 , G06V40/13 , G02F1/1362 , G02B27/30
CPC classification number: G06V40/1318 , G02B27/30 , G02F1/136209 , G02F1/136222
Abstract: Disclosed are a display panel and a display apparatus. The display panel includes an opposing substrate, an array substrate and a liquid crystal layer. The array substrate includes: a first base substrate; a color film layer, includes a black matrix and a plurality of color resistors, the black matrix includes a plurality of pixel openings and a plurality of first light transmitting holes, and color resistors is arranged one pixel opening correspondingly; and photosensitive sensors, arranged between the color film layer and the first base substrate, orthographic projections of the plurality of photosensitive sensors on the first base substrate are in an orthographic projection of the black matrix on the first base substrate, and the orthographic projection of each of the plurality of photosensitive sensors on the first base substrate covers an orthographic projection of at least one the plurality of first light transmitting holes on the first base substrate.
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公开(公告)号:US11864415B2
公开(公告)日:2024-01-02
申请号:US17358016
申请日:2021-06-25
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu Liu , Feng Zhang , Qi Yao , Zhao Cui , Xiaoxin Song , Zhijun Lv , Dongfei Hou , Detian Meng , Liwen Dong , Libo Wang , Yang Yue , Haitao Huang , Chuanxiang Xu
IPC: H10K50/858 , H10K59/38 , H10K59/124 , H10K71/00 , H10K59/12
CPC classification number: H10K50/858 , H10K59/124 , H10K59/38 , H10K71/00 , H10K59/1201
Abstract: Provided are a display panel and a preparation method thereof, and a display apparatus. The display panel includes a first display region, and the first display region includes multiple sub-display regions and a first light transmittance region located between adjacent sub-display regions. Each first sub-display region of the multiple sub-display regions includes a first light-emitting element and a first filter unit disposed in a first light-emergence direction of the first light-emitting element. Each second sub-display region in the multiple sub-display regions includes a first collimating light extraction element disposed in a second light-emergence direction of the first light-emitting element and a second filter unit disposed in a light-emergence direction of the first collimating light extraction element.
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公开(公告)号:US11737367B2
公开(公告)日:2023-08-22
申请号:US17039228
申请日:2020-09-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang
IPC: H01L41/113 , H10N30/30 , H10N30/082 , H10N30/87
CPC classification number: H10N30/302 , H10N30/082 , H10N30/877
Abstract: A piezoelectric device includes: a base having at least one hole, a heat conductive portion disposed in the at least one hole and in contact with a wall of the at least one hole, and at least one piezoelectric sensor disposed on the base. A thermal conductivity of the heat conductive portion is greater than a thermal conductivity of the base. Each piezoelectric sensor includes: a first electrode, a piezoelectric pattern made of a piezoelectric material and a second electrode that are sequentially stacked in a thickness direction of the base.
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公开(公告)号:US11650449B2
公开(公告)日:2023-05-16
申请号:US16964106
申请日:2019-09-03
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Wenqu Liu , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Jifeng Tan , Xiandong Meng
IPC: G02F1/1335 , G02F1/1333 , G02F1/137 , F21V8/00 , G02F1/1337 , G02F1/1343 , G02B6/00 , G02F1/13357
CPC classification number: G02F1/133512 , G02B6/00 , G02B6/005 , G02F1/1337 , G02F1/13439 , G02F1/13756 , G02F1/133357 , G02F1/133603 , G02F1/133607 , G02F1/134309
Abstract: The embodiments of the present disclosure provide a display panel. The display panel includes a first substrate, a second substrate disposed opposite to the first substrate, and a liquid crystal layer between the first substrate and the second substrate, a plurality of first electrodes disposed on a side, close to the second substrate, of the first substrate and spaced apart at intervals, a first dielectric layer for planarizing the plurality of first electrodes, a second dielectric layer disposed on a side, close to the liquid crystal layer, of the first dielectric layer, a light shielding portion disposed on the side, close to the liquid crystal layer, of the second substrate, and a control circuit configured to apply a voltage between the first electrode and the second electrode so that the liquid crystal layer is in a first state or a second state.
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30.
公开(公告)号:US11436856B2
公开(公告)日:2022-09-06
申请号:US16826196
申请日:2020-03-21
Applicant: BOE Technology Group Co., Ltd.
Inventor: Wenqu Liu , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Mingqi Chen , Changzheng Wang
IPC: H01L41/04 , G06V40/13 , H01L41/08 , H01L41/193 , B06B1/06 , H01L41/29 , H01L41/331 , H01L41/45 , H01L41/257
Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
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