公开(公告)号：US11436856B2

公开(公告)日：2022-09-06

申请号：US16826196

申请日：2020-03-21

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu Liu ,  Qi Yao ,  Feng Zhang ,  Zhijun Lv ,  Liwen Dong ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Mingqi Chen ,  Changzheng Wang

IPC: H01L41/04 ,  G06V40/13 ,  H01L41/08 ,  H01L41/193 ,  B06B1/06 ,  H01L41/29 ,  H01L41/331 ,  H01L41/45 ,  H01L41/257

Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.

公开(公告)号：US20210089739A1

公开(公告)日：2021-03-25

申请号：US16826196

申请日：2020-03-21

Applicant: BOE Technology Group Co., Ltd.

Inventor： Wenqu LIU ,  Qi Yao ,  Feng Zhang ,  Zhijun Lv ,  Liwen Dong ,  Xiaoxin Song ,  Zhao Cui ,  Detian Meng ,  Libo Wang ,  Mingqi Chen ,  Changzheng Wang

IPC: G06K9/00 ,  H01L41/08 ,  H01L41/193 ,  H01L41/257 ,  H01L41/29 ,  H01L41/331 ,  H01L41/45 ,  B06B1/06

Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.