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公开(公告)号：US11436856B2
公开(公告)日：2022-09-06
申请号：US16826196
申请日：2020-03-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu Liu , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Mingqi Chen , Changzheng Wang
IPC: H01L41/04 , G06V40/13 , H01L41/08 , H01L41/193 , B06B1/06 , H01L41/29 , H01L41/331 , H01L41/45 , H01L41/257
Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
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公开(公告)号：US11094740B2
公开(公告)日：2021-08-17
申请号：US16534362
申请日：2019-08-07
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhijun Lv , Liwen Dong , Wenqu Liu , Xiaoxin Song , Zhao Cui , Feng Zhang , Qi Yao , Changzheng Wang
Abstract: The disclosure discloses a backboard, a display device, and a method for fabricating the same, and the backboard includes: a backboard body; and a plurality of LED installation mounts arranged in an array on the backboard body, wherein each of the plurality of LED installation mounts includes at least two lead-out electrodes to be connected with LED pins, and a coil structure around each of the at least two lead-out electrodes, wherein the coil structure is configured to produce a magnetic field upon being powered on. The coils can be formed on the backboard body in the backboard to absorb electrodes of LEDs to thereby position them precisely so as to transfer the LEDs in a mass manner with a high good yield ratio, and the lead-out electrodes can be powered on to thereby detect abnormally operating LEDs.
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公开(公告)号：US20210089739A1
公开(公告)日：2021-03-25
申请号：US16826196
申请日：2020-03-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Wenqu LIU , Qi Yao , Feng Zhang , Zhijun Lv , Liwen Dong , Xiaoxin Song , Zhao Cui , Detian Meng , Libo Wang , Mingqi Chen , Changzheng Wang
IPC: G06K9/00 , H01L41/08 , H01L41/193 , H01L41/257 , H01L41/29 , H01L41/331 , H01L41/45 , B06B1/06
Abstract: Embodiments of the present disclosure provide a method for manufacturing a fingerprint recognition method, a fingerprint recognition module, and a display device. The method for manufacturing the fingerprint recognition module includes: providing a backplane; forming a bonding terminal in a bonding area of the backplane; forming a sensing electrode in a fingerprint recognition area of the backplane; forming an insulation layer cladding the bonding terminal in the bonding area, and forming a piezoelectric material layer in the fingerprint recognition area, where an orthographic projection of the piezoelectric material layer on the backplane coincides with an orthographic projection of the sensing electrode on the backplane; performing polarization processing on the piezoelectric material layer; and peeling off the insulation layer.
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