Abstract:
A handle of a push cart includes two rods slidably engaged in two tubes and each having a number of teeth. Two sleeves are secured on top of the tubes and each has a pair of lugs. Two pins are secured between the lugs. A resilient arm has two ends slidably engaged with the pins, the ends each includes a tooth for engaging with the teeth of the rods so as to secure the rods to the tubes. The teeth of the resilient arm are disengaged from the teeth of the rods when the resilient arm is depressed. A fence is secured to the sleeves for preventing the resilient arm from being depressed inadvertently.
Abstract:
A handle device includes two tubes slidably engaged in two pipes which has a number of teeth. A handle is secured on top of the tubes and has a hand grip slidably engaged in the lower portion. Two blocks are secured to the lower ends of the tubes. Two catches are slidably engaged in the blocks. Two bars are slidably engaged in the catches and the blocks and coupled to the hand grip. The catches are forced to engage with the teeth when the hand grip is not pulled and are disengaged from the teeth so as to release tubes from the pipes when the hand grip is released.
Abstract:
Semiconductor devices and methods of manufacture thereof are disclosed. In an embodiment, a method of manufacturing a semiconductor device includes forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width. The second width is different than the first width. The method includes forming a second conductive structure in a second metallization layer proximate the first metallization layer, and coupling a portion of the second conductive structure to the first portion of the first conductive structure.
Abstract:
A device includes a substrate, a metal pad over the substrate, and a passivation layer having a portion over the metal pad. A Post-Passivation Interconnect (PPI) line is disposed over the passivation layer and electrically coupled to the metal pad. An Under-Bump Metallurgy (UBM) is disposed over and electrically coupled to the PPI line. A passive device includes a portion at a same level as the UBM. The portion of the passive device is formed of a same material as the UBM.
Abstract:
A quadrangle transistor unit includes four transistor units. Each of the four transistor units includes a gate electrode. The gate electrodes of the four transistor units are aligned to four sides of a square. At least two of the four transistor units are connected in parallel.
Abstract:
A sheet material includes a polycarbonate substrate and a protective coating containing the reaction products of an aminoplast resin, a polyol compound, and a UV-absorbing amount of a triazine compound. The sheet material exhibits an improved balance of abrasion resistance, solvent resistance, weatherability, and formability.
Abstract:
The invention relates to N-heterocyclic substituent-containing antibiotics, their preparation, and their use. Disclosed are sodium and potassium salts of 7-(α-((N,N′-diisopropylamidino)thio)acetylamino)-3-(((1,2,5,6-tetrahydro-2-methyl-5,6-dioxo-1,2,4-triazin-3-yl)thio)methyl) cephalosporanic acid as presented by the general structure (I), their preparation, and their use. The antibiotics of the invention can be used to treat diseases caused by Gram-positive or Gram-negative bacteria such as septicaemia, gastrointestinal tract infection, and urinary tract infection. They have increased half-life in blood and lowered toxicity. They can reduce the frequency of drug use and lower medical treatment costs. They have improved stability and can be stored at ambient temperatures. The method of the invention is simple, and it produces high purity products which can meet the requirements of clinical use.
Abstract:
A semiconductor diode that eliminates leakage current and reduces parasitic resistance is disclosed. The semiconductor diode comprises a semiconductor substrate; a semiconductor layer disposed on the semiconductor substrate, wherein the semiconductor layer includes a first dopant and a first well with a Schottky region; and a polysilicon device positioned above the semiconductor layer and adjacent to the first well with the Schottky region.
Abstract:
A semiconductor diode that eliminates leakage current and reduces parasitic resistance is disclosed. The semiconductor diode comprises a semiconductor substrate; a semiconductor layer disposed on the semiconductor substrate, wherein the semiconductor layer includes a first dopant and a first well with a Schottky region; and a polysilicon device positioned above the semiconductor layer and adjacent to the first well with the Schottky region.
Abstract:
Techniques are provided for ranking-based information processing. Method steps can include integrating information from at least one source (a plurality of heterogeneous sources can also be handled), to obtain integrated information; mapping the integrated information to at least one application; ranking the integrated information based on the mapping and on ranking criteria from a knowledge base; and processing the integrated information, based on the ranking, to obtain processed integrated information. Optionally, the processing step includes formatting the processed integrated information for a plurality of applications.