Abstract:
Some embodiments relate to a device and method for a band pass filter with a reduced cost, area penalty, and manufacturing complexity relative to current solutions. An integrated passive device chip includes a plurality of capacitors embedded in a common molding compound along with a transceiver chip. The integrated passive device chip and the transceiver chip are also arranged within a polymer package. An ultra-thick metallization layer is disposed within the polymer package and configured to couple the integrated passive device chip to the transceiver chip. The ultra-thick metallization layer also forms a plurality of transmission lines, wherein the combined integrated passive device chip and transmission lines form a band pass filter with improved frequency response, noise immunity, and cost and area as compared to conventional solutions.
Abstract:
One or more techniques or systems for controlling a profile for photo resist (PR) are provided herein. In some embodiments, a first shield layer is formed on a first PR layer and a second PR layer is formed on the first shield layer. A first window is formed within the second PR layer during a first exposure with a mask. A second window is formed within the first shield layer based on the first window. A third window is formed within the first PR layer during a second exposure without a mask. Because, the third window is formed while the first shield layer and the second PR layer are on the first PR layer, a profile associated with the first PR layer is controlled. Contamination during ion bombardment is mitigated due to the controlled profile.
Abstract:
Semiconductor devices and methods of manufacture thereof are disclosed. In an embodiment, a method of manufacturing a semiconductor device includes forming a first conductive structure over a workpiece in a first metallization layer, the first conductive structure including a first portion having a first width and a second portion having a second width. The second width is different than the first width. The method includes forming a second conductive structure in a second metallization layer proximate the first metallization layer, and coupling a portion of the second conductive structure to the first portion of the first conductive structure.
Abstract:
A radioactivity measuring apparatus with a rotating stage for waste drums is provided, which includes a case, a plurality of radioactive counters, a rotation unit, and a control unit. The case has an opening and an accommodating space in communication with the opening. A shielding gate is connected to one side of the opening. The plurality of radioactive counters is disposed in the accommodating space, and used for detecting a radioactive counting associated with a sample. The rotation unit is disposed at a wall on a side of the shielding gate corresponding to the opening, and used for supporting the sample. The control unit is electrically connected to the rotation unit and the plurality of radioactive counters, and used for controlling the rotation unit to rotate by a control signal, so as to enable the sample to rotate within the accommodating space.
Abstract:
An integrated circuit structure includes a well region of a first conductivity type, an emitter of a second conductivity type opposite the first conductivity type over the well region, a collector of the second conductivity type over the well region and substantially encircling the emitter, and a base contact of the first conductivity type over the well region. The base contact is horizontally spaced apart from the emitter by the collector. At least one conductive strip horizontally spaces the emitter, the collector, and the base contact apart from each other. A dielectric layer is directly under, and contacting, the at least one conductive strip.
Abstract:
A semiconductor diode that is disclosed. An exemplary semiconductor diode includes a portion of a semiconductor substrate including a first dopant, a first well with a Schottky region, and a second well with a second dopant; and an isolation region replacement element positioned over the semiconductor substrate and adjacent to the first and second wells.
Abstract:
Embodiments of the present invention address deficiencies of the art in respect to modeling value networks and provide a method, system and computer program product for a comparative analysis different value nets. In an embodiment of the invention, a value net analysis method can include loading data for CBM components of a first value net for a first collection of business enterprises, and loading data for CBM components of a second value net for a second collection of business enterprises. The method also can include mapping relationships between different business enterprises in the first value net to relationships between different business enterprises in the second value net. Relative underperformance can be identified in a mapped relationship in one of the value nets based upon a comparison of the loaded data for the CBM components of the value nets. Consequently, the under-performing mapped relationship can be visually distinguished in an enterprise view to a corresponding one of the value nets.
Abstract:
An overclocking module, a computer system and a method for overclocking are provided. The method is used to overclock the computer system. The overclocking module of the invention includes a timer, a monitoring unit and a control unit. The timer starts to count when the computer system is booted. The monitoring unit monitors whether the computer system performs a boot-up procedure within a period of time. The control unit adjusts an operating frequency of the computer system to overclock the computer system automatically according to the monitoring result of the monitoring unit.
Abstract:
This invention is a buckling fastening device of luggage including a strap clasp, a main casing, a prop block, a spring and a base casing. The main casing is a hollow trough with an expanded plate at its top. The expanded plate has an insert trough, and the prop block is located within the hollow trough. The spring is set between the prop block and the base casing. The base casing is set at the outer rim of the main casing, and its top plate has a ring corresponding with that of the main casing. The insert ends at the both sides of the strap clasp can block and fasten the clasp when inserted into the hollow trough of the main casing. By pressing the block ends, the clasp can be readily detached. Hence, the purpose of quick and convenient function is achieved.
Abstract:
The spring structure of a multi-joint luggage pull rod is placed in the positioning base between the first and second joint tube of the pull rod. The spring structure includes top base, spring and bottom base. The top base includes a concave part, protruding joint, and spring limiting part. The protruding joint inserts in the through hole of the positioning base made by the second joint tube. The base includes a spring support and a prop, and the spring support is to be connected to the bottom of the spring. The prop can be pushed against the top of the positioning base made by the second joint tube. The spring structure for a multi-joint pull rod adds the top base, spring and bottom base for easy assembly, which does not have to change the internal structure of the pull rod to make the grip spring upward.