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公开(公告)号：US20220415253A1
公开(公告)日：2022-12-29
申请号：US17896270
申请日：2022-08-26
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaoyan Zhu , Hua Huang , Guangcai Yuan , Xue Dong
IPC: G09G3/3225 , G09G3/36 , H01L27/12 , H01L51/00 , H01L25/075 , H01L33/60 , H01L33/62
Abstract: An array substrate includes a base substrate, a pixel circuit, a flexible layer, a lead structure, a control circuit and a planarization layer. The flexible layer includes a first substrate portion and a second substrate portion, and the lead structure includes a first lead portion and a second lead portion. The pixel circuit, the first lead portion and the first substrate portion are all arranged on a first side of the base substrate, the control circuit, the second lead portion and the second substrate portion are all arranged on a second side of the base substrate, and the second side is opposite to the first side.
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公开(公告)号：US20220373840A1
公开(公告)日：2022-11-24
申请号：US17770205
申请日：2021-06-08
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xiaoxin Song , Feng Zhang , Wenqu Liu , Zhijun Lv , Liwen Dong , Zhao Cui , Detian Meng , Libo Wang , Dongfei Hou , Qi Yao , Xue Dong
IPC: G02F1/13357 , G02F1/1335
Abstract: The present disclosure relates to a backlight module, a method for designing the same, and a display device. The backlight module includes: a first substrate; a plurality of LED chips on the first substrate; and a light control structure on the first substrate. The backlight module includes a plurality of light control region groups in one-to-one correspondence with the plurality of light-emitting diode chips, each light control region group includes at least a first light control region and a second light control region. The light control structure includes a plurality of light control substructure groups respectively located in the plurality of light control region groups. Each light control substructure group includes at least a first light control substructure in the first light control region and a second light control substructure in the second light control region.
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公开(公告)号：US20220293635A1
公开(公告)日：2022-09-15
申请号：US17529969
申请日：2021-11-18
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Chenyang Zhang , Fuqiang Li , Xue Dong , Meili Wang , Xuan Liang , Fei Wang , Mingxing Wang , Zhanfeng Cao , Yanling Han , Xinxin Zhao
IPC: H01L27/12
Abstract: A semiconductor apparatus and a method for manufacturing the semiconductor apparatus are provided. The semiconductor apparatus includes: a base substrate; a plurality of chips arranged on the base substrate each including a chip main body and a plurality of terminals arranged thereon; a plurality of fixed connection portions arranged on the base substrate, and adjacent to the plurality of chips; a terminal expansion layer arranged on the base substrate; and a plurality of expansion wires in the terminal expansion layer and configured to electrically connect the chips, wherein an expansion wire configured to electrically connect two chips includes at least a first wire segment and a second wire segment, and the first wire segment is configured to electrically connect a terminal of a chip and a fixed connection portion adjacent to the chip, and the second wire segment is configured to connect two fixed connection portions between the two chips.
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公开(公告)号：US11437265B2
公开(公告)日：2022-09-06
申请号：US16770655
申请日：2019-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue Dong , Guangcai Yuan , Zhijun Lv , Haixu Li , Zhiwei Liang , Huijuan Wang , Ke Wang , Zhanfeng Cao , Hsuanwei Mai
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.
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公开(公告)号：US11409202B2
公开(公告)日：2022-08-09
申请号：US17199395
申请日：2021-03-11
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xinglong Luan , Fuqiang Li , Jing Feng , Zhichong Wang , Peng Liu , Guangcai Yuan , Xue Dong
Abstract: Provided is a digital exposure control method, including: performing exposure of different types of functional areas of a substrate to be exposed through one or a plurality of full-page scans, wherein scan speeds for different types of functional areas of the substrate to be exposed are different.
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Patent Agency Ranking
公开(公告)号：US11409126B2
公开(公告)日：2022-08-09
申请号：US16332114
申请日：2018-08-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Zhongxiao Li , Xue Dong , Xiaochuan Chen , Wenqing Zhao , Jinye Zhu , Chenyu Chen
IPC: G02B30/33 , G02F1/1335
Abstract: The present disclosure is related to a display panel. The display panel may include a plurality of pixel units. Each of the plurality of pixel units may include a first pixel unit or a second pixel unit. The first pixel unit may include a first light adjusting structure configured to adjust an angle of light that transmits through the first light adjusting structure. The second pixel unit may include a second light adjusting structure configured to adjust an angle of light that transmits through the second light adjusting structure. A plurality of first pixel units may be configured to display a left-eye image. A plurality of second pixel units may be configured to display a right-eye image.
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公开(公告)号：US11387289B2
公开(公告)日：2022-07-12
申请号：US16475105
申请日：2018-12-25
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yunke Qin , Xue Dong , Zhifu Li , Haisheng Wang , Yingming Liu , Yuzhen Guo , Pinchao Gu , Lin Zhou
Abstract: An array substrate includes a substrate, a packaging layer, and at least one sensor. The packaging layer is over the substrate. Each sensor includes a sensing thin-film transistor and a sensing unit, electrically coupled with each other. The sensing thin-film transistor is between the package layer and the substrate, and the sensing unit is over a side of the package layer away from the substrate. The array substrate can also include a plurality of display thin-film transistors. The sensing thin-film transistor in each sensor can be at substantially same film layers, or of a same structure and a same type, as each display thin-film transistor.
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公开(公告)号：US11375177B2
公开(公告)日：2022-06-28
申请号：US16622983
申请日：2018-10-30
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Jiayao Liu , Xue Dong , Xiaochuan Chen , Wenqing Zhao , Wei Wang , Ming Yang
Abstract: The present application provides a light-field display apparatus. The apparatus includes: a display screen, the display screen including N display regions, each display region of the N display regions including M light-emitting points, and light-emitting points at a corresponding position of the N display regions being a light-emitting point group; driving circuits, configured to drive the light-emitting points to emit light; a lens group including at least one lens, the light-emitting points in the N display regions forming view zones corresponding one by one to the N display regions by the lens group, wherein light-emitting points belonging to a same light-emitting point group in the N display regions are driven by a same driving circuit, the N view zones are not overlapped with each other, and both N and M are positive integers greater than 1.
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公开(公告)号：US11367767B2
公开(公告)日：2022-06-21
申请号：US16494463
申请日：2018-11-01
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xiaoliang Ding , Xue Dong , Haisheng Wang , Yingming Liu , Wei Liu , Xueyou Cao
Abstract: The present disclosure is related to a light emitting diode. The light emitting diode includes a first transparent electrode layer; a light emitting layer on the first transparent electrode layer; a reflective electrode layer on a surface of the light emitting layer opposite from the first transparent electrode layer, and a second transparent electrode layer. The reflective electrode layer may include transmission hole. The second transparent electrode layer may cover or fill the transmission hole. The transmission hole may be configured to transmit light emitted from the light emitting layer to pass through the second transparent electrode layer.
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公开(公告)号：US11366020B2
公开(公告)日：2022-06-21
申请号：US15772877
申请日：2017-09-15
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haisheng Wang , Xue Dong , Jing Lv , Xiaochuan Chen , Chunwei Wu , Yingming Liu , Xiaoliang Ding
Abstract: According to the embodiments of the present disclosure, there is provided a sensor for detecting a temperature. The sensor comprises a switch circuit; a charge/discharge circuit connected to the switch circuit, and configured to be charged and discharged under control of the switch circuit; a sensing circuit connected to the charge/discharge circuit, and configured to cause a charge/discharge period of the charge/discharge circuit to change with a temperature of the sensing circuit; and an oscillation circuit connected to the switch circuit and the charge/discharge circuit, and configured to generate, under action of the charge/discharge circuit, an oscillation signal for controlling the switch circuit, wherein an oscillation frequency of the oscillation signal is dependent on the charge/discharge period and thus indicates the temperature of the sensing circuit. In addition, the embodiments of the present disclosure further provide an array substrate and display comprising the sensor, and a corresponding voltage adjustment method.
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