公开(公告)号：US20030074972A1

公开(公告)日：2003-04-24

申请号：US10215787

申请日：2002-08-09

申请人： VISTEON GLOBAL TECHNOLOGIES, INC.

发明人： Bernard A. Meyer ,  Lakhi N. Goenka ,  Debojit Barua

IPC分类号： G01L009/00

CPC分类号： F02D41/28 ,  F02B75/22 ,  F02B77/085 ,  F02B77/089 ,  F02D2400/18 ,  F02M51/005 ,  F05C2225/08 ,  G01F23/2925 ,  G01L11/02 ,  G01L23/16 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/122 ,  G02B6/4298 ,  G02B6/43 ,  G02B2006/12104 ,  G02B2006/12109 ,  G08C23/02 ,  G08C2201/31 ,  G08C2201/41

摘要： An integrated LCC-based strain gage sensor, in which at least two LCC traces or strands run across a microcavity within the cylinder head gasket. In one aspect of the present invention, a system is provided comprising a signal source and a microcavity through which an input signal from the signal source passes and which alters the input signal as a result of a response of the microcavity to a strain. An LCC connects the microcavity and the signal source and an input signal propagates through the LCC. The microcavity may comprise one or more reflective surfaces which alters the input signal as a result of a change in a dimension of the microcavity. In another aspect of the invention, the microcavity produces an output signal that has an intensity or frequency different from that of the input signal upon undergoing a deformation.

摘要翻译： 一种集成的基于LCC的应变计传感器，其中至少两个LCC迹线或股线穿过气缸盖衬垫内的微腔。 在本发明的一个方面，提供了一种系统，其包括信号源和微腔，通过该信号源和微腔，来自信号源的输入信号通过该微腔，并且由于微腔对应变的响应而改变输入信号。 LCC连接微腔和信号源，输入信号通过LCC传播。 微腔可以包括一个或多个反射表面，其由于微腔尺寸的变化而改变输入信号。 在本发明的另一方面，微腔产生的输出信号在经历变形时具有与输入信号的强度或频率不同的强度或频率。

公开(公告)号：US20030070489A1

公开(公告)日：2003-04-17

申请号：US09977931

申请日：2001-10-12

申请人： Kavlico Corporation

发明人： Kyong M. Park ,  Marcos A. Nassar

IPC分类号： G01L009/00

CPC分类号： G01L19/147 ,  G01M15/106 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/73265 ,  H01L2924/00014

摘要： A corrosion proof pressure transducer for measuring exhaust gas pressure includes a chip with a semiconductive diaphragm, electronics, and conductive pads thereon; with leads sonically bonded to the pads. To preclude degradation of the transducer by internal combustion engine exhaust gases, the chip may have (1) a thin glass passivation layer, (2) a vacuum deposited polymeric coating and (3) a layer of gel, thereon.

摘要翻译： 用于测量废气压力的耐腐蚀压力传感器包括其上具有半导体膜片，电子器件和导电焊盘的芯片; 引线与声音接合。 为了防止内燃机废气对换能器的降解，芯片可以具有（1）薄玻璃钝化层，（2）真空沉积的聚合物涂层和（3）一层凝胶。

公开(公告)号：US20030029245A1

公开(公告)日：2003-02-13

申请号：US09909847

申请日：2001-07-20

发明人： Alain Izadnegahdar ,  James Siekkinen ,  Horacio V. Estrada ,  Brad Boggs ,  Michael Nagy ,  Kevin Stark

IPC分类号： G01L009/00

CPC分类号： G01L9/0055 ,  Y10T29/42 ,  Y10T29/49082

摘要： A method for forming a sensor including the steps of providing a base wafer and forming a sensor cavity in the base wafer. The method further includes the step of coupling a diaphragm wafer to the base wafer, the diaphragm wafer including a diaphragm portion and a sacrificial portion. The diaphragm wafer is coupled to the base wafer such the diaphragm portion generally covers the sensor cavity. The method further includes the steps of reducing the thickness of the diaphragm wafer by removing the sacrificial portion, and forming or locating at least one piezo resistive portion on the diaphragm portion.

摘要翻译： 一种用于形成传感器的方法，包括以下步骤：提供基底晶片并在基底晶片中形成传感器腔。 该方法还包括将隔膜晶片连接到基底晶片的步骤，所述隔膜晶片包括隔膜部分和牺牲部分。 隔膜晶片连接到基底晶片，因此隔膜部分通常覆盖传感器腔。 该方法还包括以下步骤：通过去除牺牲部分来减小隔膜晶片的厚度，以及在隔膜部分上形成或定位至少一个压电电阻部分。

公开(公告)号：US20020148297A1

公开(公告)日：2002-10-17

申请号：US10091476

申请日：2002-03-07

发明人： Yasutoshi Suzuki ,  Hiroaki Tanaka

IPC分类号： G01L009/00

CPC分类号： G01L19/147 ,  G01L9/0042 ,  G01L9/0055

摘要： In a pressure sensor made by bonding a sensor chip and a metal stem together with a resin adhesive, fluctuation of the sensor output caused by temperature changes are maximally reduced. The resin adhesive for bonding together the sensor element and the metal stem has a creep characteristic defined as CRnullAnullnullB between its creep rate CR and stress null upon it with A and B being constants. The resin adhesive is selected to satisfy that the constant B is not greater than 3.5.

摘要翻译： 在通过将传感器芯片和金属杆与树脂粘合剂接合而制成的压力传感器中，由温度变化引起的传感器输出的波动最大程度地降低。 用于将传感器元件和金属杆粘合在一起的树脂粘合剂具有在其A和B为常数的蠕变速率CR和应力σ之间定义为CR = AxsigmaB的蠕变特性。 选择树脂粘合剂以使常数B不大于3.5。

公开(公告)号：US20020016694A1

公开(公告)日：2002-02-07

申请号：US09915427

申请日：2001-07-26

发明人： Tomoharu Tsuji

IPC分类号： G01L007/00 ,  G01N007/00 ,  G01L009/00 ,  G01L011/00 ,  G01L013/00 ,  G01L015/00 ,  G06F015/00 ,  G01L017/00 ,  G01L019/00 ,  G01L021/00 ,  G01L021/02

CPC分类号： G01C5/06 ,  B63C11/02

摘要： It is an object of the present invention to provide a portable pressure measuring apparatus to be used as an altimeter, which can be automatically switched to an optimum sampling period in accordance with a use of the apparatus before a pressure measurement at all times. A portable pressure measuring apparatus additionally comprises a pressure/altitude operation section for obtaining an altitude from a measured pressure by an arithmetic operation, a rate of pressure change operation section, and a movement detecting section, wherein, if the movement detecting section detects a movement, a pressure is measured in a sampling period, for example, in a 1-second sampling period, if a rate of altitude change is equal to or greater than a threshold or in a sampling period, for example, in a 5-second sampling period, if the rate of altitude change is smaller than the threshold and wherein, unless the movement detecting section detects any movement, the pressure sampling measurement is not performed.

摘要翻译： 本发明的目的是提供一种用作高度计的便携式压力测量装置，其可以根据在任何时候的压力测量之前的装置的使用自动切换到最佳采样周期。 便携式压力测量装置还包括压力/高度操作部分，用于通过算术运算，压力变化操作部分和运动检测部分从测量的压力获得高度，其中，如果运动检测部分检测到运动 如果高度变化率等于或大于阈值或采样周期，例如在5秒采样中，则在采样周期中例如在1秒采样周期中测量压力 如果高度变化率小于阈值，并且其中，除非移动检测部分检测到任何移动，否则不执行压力采样测量。

公开(公告)号：US20010001930A1

公开(公告)日：2001-05-31

申请号：US09755048

申请日：2001-01-08

申请人： ASMO CO., LTD. and HITACHI CABLE, LTD.

发明人： Hidenori Ishihara ,  Noboru Tsuge ,  Shigeru Kashiwazaki ,  Fumitaka Nakahigashi ,  Koji Horii

IPC分类号： G01L009/00

CPC分类号： H01H3/142 ,  H01H1/58 ,  Y10T29/49776

摘要： Support members are provided on the terminal portions of a sensor main body. In this state, a seal portion is formed by molding, and the seal portion seals the terminal portions of the sensor main body. During molding, external pressure acts on a housing. However, since four electrode wires pulled out from the housing are supported by insulating support members, the four electrode wires do not contact one another due to the pressure applied during molding, and thus do not short-circuit.

摘要翻译： 支撑构件设置在传感器主体的端子部分上。 在这种状态下，通过模制形成密封部分，并且密封部分密封传感器主体的端部。 在模制期间，外部压力作用在壳体上。 然而，由于从壳体拉出的四根电极线由绝缘支撑部件支撑，所以四根电极线由于成型时施加的压力而不会彼此接触，因此不会发生短路。

公开(公告)号：US20040154403A1

公开(公告)日：2004-08-12

申请号：US10688182

申请日：2003-10-17

发明人： Steven Petrucelli

IPC分类号： G01L009/00

CPC分类号： G01L19/086 ,  G01L17/00 ,  G01L19/08

摘要： A recall mechanism for a pressure gauge stores pressure reading outputs for effectively conveying nulllast valuenull information to a user when requested.

摘要翻译： 压力计的回收机构存储压力读数输出，以便在要求时向用户有效地传送“最后值”信息。

公开(公告)号：US20040118213A1

公开(公告)日：2004-06-24

申请号：US10325868

申请日：2002-12-23

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Yeong-Jeong Ou ,  TaiKang Shing ,  Justin Clark ,  Ke-Shieng Yang ,  Jeng-Shie Chung

IPC分类号： G01L009/00

CPC分类号： G01L9/0042 ,  G01L9/0054

摘要： A method for producing an isolated micro pressure sensor and the process for producing the same are disclosed. The method for manufacturing the isolated micro pressure sensor includes: (A) etching one surface of a substrate to form a rampart with an open cavity on the center of its top surface and with plate portions surrounding the rampart; (B) forming a plurality of first contact pads on said plate portions of the substrate outside said rampart; (C) forming a plurality of second contact pads, a plurality of piezo-resistors, thermo sensors, temperature-controlling elements and circuit patterns on a bulk silicon wafer; (D) forming a plurality of grooves on the periphery of the bulk silicon wafer; (E) bonding the bulk silicon wafer and the substrate; and (F) thinning said bulk silicon wafer until said bulk silicon wafer forming a thin membrane.

摘要翻译： 公开了一种隔离微压力传感器的制造方法及其制造方法。 隔离微压力传感器的制造方法包括：（A）蚀刻基板的一个表面，以在其顶表面的中心形成具有开放空腔的壁垒，并围绕围墙的板部分; （B）在所述挡板外部的所述基板的所述板部分上形成多个第一接触焊盘; （C）在体硅晶片上形成多个第二接触焊盘，多个压电电阻器，热传感器，温度控制元件和电路图案; （D）在本体硅晶片的周围形成多个槽; （E）接合体硅晶片和基板; 和（F）使所述体硅晶片变薄，直到所述体硅晶片形成薄膜。

公开(公告)号：US20040093954A1

公开(公告)日：2004-05-20

申请号：US10301096

申请日：2002-11-20

发明人： Alfred Gottlieb ,  Martin Schroder

IPC分类号： G01L009/00

CPC分类号： B60C23/0408 ,  G01L19/147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

摘要： The invention relates to a pressure sensor with an MEM structure (micro electro mechanical structure), which has a hollow housing (8) in which a semiconductor chip (2) with a pressure-sensitive area (4) is arranged. In its interior (12) and with parts of the semiconductor chip (2), the housing is covered by a first plastic compound (15), which has a lower level of deformation than a second plastic compound (16), which partly covers the pressure-sensitive area (4) of the semiconductor chip (2).

摘要翻译： 本发明涉及一种具有MEM结构（微机电结构）的压力传感器，其具有中空壳体（8），其中布置有具有压敏区域（4）的半导体芯片（2）。 在其内部（12）和半导体芯片（2）的部件中，壳体被第一塑料化合物（15）覆盖，第一塑料化合物（15）具有比第二塑料化合物（16）更低的变形水平，其部分地覆盖 半导体芯片（2）的压敏区域（4）。

公开(公告)号：US20040055387A1

公开(公告)日：2004-03-25

申请号：US10469387

申请日：2003-08-29

发明人： Atsushi Miyazaki ,  Katsuhiko Kikuchi ,  Masaaski Suzuki ,  Ryozo Tomosaki

IPC分类号： G01L009/00

CPC分类号： G01L19/142 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/0092 ,  G01L19/0645

摘要： The invention is intended to provide a small and highly reliable pressure sensor, which has a smaller number of components and can be produced by using a mold for resin molding in common. A sensor unit (11) is molded with resin. and includes a semiconductor chip (1) for converting the change in pressure of a medium introduced through an introduction hole for measurement into an electric signal. A lead member (12) has one end exposed in a connector (23) and is electrically connected to the semiconductor chip (1) in the sensor unit (11) beforehand. Pressure is applied to the semiconductor chip (1) through a pipe (22). An outer case (21) is integrally formed of synthetic resin by insert molding of the sensor unit (11), the lead member (12) and the pipe (22).

摘要翻译： 本发明旨在提供一种小型且高度可靠的压力传感器，其具有较少数量的部件，并且可以通过使用共同的树脂模制用模具来制造。 传感器单元（11）用树脂模制。 并且包括用于将通过测量用导入孔导入的介质的压力变化转换为电信号的半导体芯片（1）。 引线构件（12）的一端暴露在连接器（23）中，并预先在传感器单元（11）中电连接到半导体芯片（1）。 通过管道（22）向半导体芯片（1）施加压力。 外壳（21）通过传感器单元（11），引导构件（12）和管道（22）的嵌入成型而由合成树脂一体地形成。