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119 条记录 (耗时 0.016 秒)

    Grinding wheel
    11.
    发明授权
    Grinding wheel 有权
    砂轮

    公开(公告)号：US06926598B2

    公开(公告)日：2005-08-09

    申请号：US10626554

    申请日：2003-07-25

    申请人： Naoki Toge ,  Yasuaki Inoue

    发明人： Naoki Toge ,  Yasuaki Inoue

    IPC分类号： B24D7/00 ,  B24B5/00 ,  B24B33/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  B24D3/00 ,  B24D3/06 ,  B24D7/14

    CPC分类号： B24B53/017 ,  B24B53/12 ,  B24D7/14

    摘要： A grinding wheel having a tool portion formed by firmly fixing diamond grains to an end face of a cup-shaped core by brazing. A circumferentially continuous groove is formed in a substantially central portion of the end face of the core. The abrasive grains are firmly fixed to an end face portion excluding regions near an outer rim and near an inner rim of the end face and near the boundaries with the groove under the condition that, with respect to all the abrasive grains, skirts of a brazing material layer for holding the abrasive grains have a length one or more times an average grain size of the abrasive grains. The provision of the groove in the end face of the core can enhance the capability of ejecting chips that occur during machining; besides, chips can be captured in the groove to preclude the occurrence of scratches resulting from the chips. Moreover, sufficient lengths of skirts of the brazing material layer are secured for all the abrasive grains arranged on the end face of the core, which improves the force for holding the abrasive grains and avoids grain fall-out during machining.

    摘要翻译： 一种砂轮，其具有通过钎焊将金刚石晶粒牢固地固定在杯形芯的端面上而形成的工具部分。 在芯的端面的大致中央部形成周向连续的槽。 这些磨粒牢固地固定在除了外缘附近的区域和端面的内边缘附近的端面部分，并且在与槽的边界附近相对于所有磨料颗粒的情况下，硬钎焊的裙部 用于保持磨粒的材料层的长度为磨粒的平均粒径的一倍或更多倍。 在芯的端面上设置凹槽可以增强在加工期间排出芯片的能力; 此外，芯片可以被捕获在凹槽中以防止由芯片产生的划痕的发生。 此外，对于布置在芯的端面上的所有磨粒，固定钎焊材料层的足够长度的裙部，这改善了用于保持磨粒的力并避免了加工期间的谷物脱落。

    Chemical mechanical polishing apparatus
    12.
    发明申请
    Chemical mechanical polishing apparatus 失效
    化学机械抛光装置

    公开(公告)号：US20050113010A1

    公开(公告)日：2005-05-26

    申请号：US10997270

    申请日：2004-11-24

    申请人： Hwal Kim

    发明人： Hwal Kim

    IPC分类号： H01L21/304 ,  B24B37/04 ,  B24D7/14 ,  B24D13/14 ,  B24B5/00

    CPC分类号： B24B37/16 ,  B24D7/14

    摘要： Disclosed is a chemical mechanical polishing apparatus for polishing a surface of a wafer using a mechanical friction as well as a chemical polishing agent. The chemical mechanical polishing apparatus includes a polishing head for absorbing a wafer and a polishing means for polishing the wafer. The polishing apparatus may include a platen composed of at least three segments formed in conformity with polishing zones, a polishing pad provided on each of the segments, and a support for supporting the segments such that the segments are separately adjustable in the height depending on the polishing zones and are rotatable.

    摘要翻译： 公开了一种使用机械摩擦对化学抛光剂抛光晶片表面的化学机械抛光装置。 化学机械抛光装置包括用于吸收晶片的抛光头和用于抛光晶片的抛光装置。 抛光装置可以包括由与抛光区形成的至少三个段组成的压板，设置在每个区段上的抛光垫，以及用于支撑段的支撑件，使得该段可根据 抛光区域并且是可旋转的。

    Variable abrasive polishing pad for mechanical and chemical-mechanical planarization
    13.
    发明授权
    Variable abrasive polishing pad for mechanical and chemical-mechanical planarization 失效
    用于机械和化学机械平面化的可变研磨抛光垫

    公开(公告)号：US6062958A

    公开(公告)日：2000-05-16

    申请号：US834524

    申请日：1997-04-04

    申请人： David Q. Wright ,  John K. Skrovan

    发明人： David Q. Wright ,  John K. Skrovan

    IPC分类号： B24B37/11 ,  B24B37/24 ,  B24D7/14 ,  B24B5/00 ,  B24B29/00

    CPC分类号： B24B37/11 ,  B24B37/24 ,  B24D7/14

    摘要： An abrasive polishing pad for planarizing a substrate. In one embodiment, the abrasive polishing pad has a planarizing surface with a first planarizing region and a second planarizing region. The first planarizing region has a first abrasiveness and the second planarizing region has a second abrasiveness different than the first abrasiveness of the first region. The polishing pad preferably has a plurality of abrasive elements at the planarizing surface in at least one of the first or second planarizing regions. The abrasive elements may be abrasive particles fixedly suspended in a suspension medium, contact/non-contact regions on the pad, or other elements that mechanically remove material from the wafer. In operation of a preferred embodiment, the lesser abrasive of the first and second planarizing regions contacts a first area of the wafer where the relative velocity between the wafer and the polishing pad is relatively high, and the more abrasive of the first and second planarizing regions contacts a second area of the wafer where the relative velocity between the wafer and the polishing pad is relatively low. The different abrasivenesses of the first and second planarizing regions compensate for variations in relative velocities across the face of the wafer to more uniformly planarize the wafer.

    摘要翻译： 用于平坦化基板的研磨抛光垫。 在一个实施例中，研磨抛光垫具有带有第一平坦化区域和第二平坦化区域的平坦化表面。 第一平坦化区域具有第一磨蚀性，第二平坦化区域具有与第一区域的第一磨蚀性不同的第二磨损性。 抛光垫优选地在第一或第二平坦化区域中的至少一个中的平坦化表面处具有多个研磨元件。 研磨元件可以是固定地悬挂在悬浮介质中的磨料颗粒，垫上的接触/非接触区域或机械地从晶片上去除材料的其它元件。 在优选实施例的操作中，第一和第二平坦化区域的较小磨料接触晶片的第一区域，其中晶片和抛光垫之间的相对速度相对较高，并且第一和第二平坦化区域 接触晶片的第二区域，其中晶片和抛光垫之间的相对速度相对较低。 第一和第二平坦化区域的不同的磨损性补偿横跨晶片表面的相对速度的变化，以使晶片更均匀地平坦化。

    Saw-grinder combination for thin rock section machines
    14.
    发明授权
    Saw-grinder combination for thin rock section machines 失效
    用于薄壁部分机械的锯齿磨机组合

    公开(公告)号：US3753430A

    公开(公告)日：1973-08-21

    申请号：US3753430D

    申请日：1972-06-14

    申请人： OAS E

    发明人： OAS E

    IPC分类号： B24B27/06 ,  B24D5/12 ,  B24D7/14 ,  B24D7/16 ,  B28D1/00 ,  B28D5/02 ,  B24D7/18

    CPC分类号： B24D7/16 ,  B24B27/06 ,  B24D5/12 ,  B24D7/14 ,  B28D1/003 ,  B28D5/025

    摘要： A combination sawing and grinding instrumentality supported on a single arbor for the cutting and grinding of specimens into thin sections for microscopic analysis. An abrasive periphery of the saw is supported against dishing during cutting operations by cooperating plate and grinder means oppositely disposed on the blade. Importantly, the offset grinder means additionally serves to abrade the specimen to the required 30 micron thickness all in one operation without the use of a separate machine and without re-mounting of the slide mounted specimen.

    摘要翻译： 一个组合锯切和磨削工具支撑在单个心轴上，用于将样品切割和研磨成薄切片，用于显微镜分析。 通过配合相对设置在叶片上的板和研磨装置，在切割操作期间锯的磨损周边被支撑成凹陷。 重要的是，胶片磨削机构另外用于在一次操作中将样品磨成所需的30微米厚度，而不使用单独的机器，而不需要重新安装滑动安装的样品。

    DYNAMIC REGULATION OF CONTACT PRESSURES IN A BLADE SHARPENING SYSTEM
    20.
    发明申请
    DYNAMIC REGULATION OF CONTACT PRESSURES IN A BLADE SHARPENING SYSTEM 有权

    公开(公告)号：US20220032488A1

    公开(公告)日：2022-02-03

    申请号：US17502025

    申请日：2021-10-14

    申请人： LAWRENCE E. BAKER

    发明人： LAWRENCE E. BAKER

    IPC分类号： B26D7/12 ,  B24B3/46 ,  B24B3/36 ,  B24D7/14 ,  B24D13/14 ,  B26D1/14 ,  B26D3/16 ,  B24B49/16

    摘要： Dynamic regulation of contact pressures in a blade sharpening system is provided. An example multiphase grinding wheel has a grinding face with one or more abrasive concentric rings for sharpening the cutting blade of the log saw machine, and one or more padded concentric rings consisting of fiber padding. Sharpening with the multiphase grinding wheel improves cut quality, increases blade life, removes glues and varnishes from the cutting blade, reduces blade deformation, and hones the edge of the cutting blade. A pneumatic tensioning system uses air bladders to apply dynamic cushioning and processor-controlled contact pressure between the grinding wheels and the cutting blade during sharpening. The fiber-padded grinding wheels and the air bladder tensioner provide improved sharpness of the cutting blade and longer life for the mechanical components.