METHOD AND APPARATUS FOR FINISHING THE SURFACE OF RUBBER COVERED ROLLERS
    2.
    发明申请
    METHOD AND APPARATUS FOR FINISHING THE SURFACE OF RUBBER COVERED ROLLERS 失效
    用于整理橡胶覆盖辊表面的方法和装置

    公开(公告)号:US20100297918A1

    公开(公告)日:2010-11-25

    申请号:US12446014

    申请日:2007-10-18

    IPC分类号: B24B1/00 B24B33/00

    摘要: A method and apparatus for finishing the surface of rubber or synthetic covered rollers (10) is disclosed. As seen in FIG. 3, a rotating hub (16) having a circumferential abrasion band (47) and an adjacent set of rasp blades (20) arranged end-to-end and extending circumferentially about the hub is used to progressively and sequentially removebands of surface material by cutting and then abrading as the hub and roller are rotated and one is moved axially relative to the other.

    摘要翻译: 公开了一种用于完成橡胶或合成覆盖辊(10)表面的方法和设备。 如图所示。 如图3所示,具有周向磨损带(47)的旋转轮毂(16)和邻近的一组锉刀(20)被设置成沿着毂周向周向延伸,并且通过切割逐渐地和顺序地移除表面材料带 然后随着轮毂和辊的旋转而研磨,一个相对于另一个轴向移动。

    Cutting wheel
    3.
    发明授权
    Cutting wheel 有权
    切割轮

    公开(公告)号:US07364502B2

    公开(公告)日:2008-04-29

    申请号:US11363242

    申请日:2006-02-28

    申请人: Giovanni Ficai

    发明人: Giovanni Ficai

    IPC分类号: B24B33/00

    CPC分类号: B24D5/12

    摘要: The present invention relates to an improved cutting wheel, comprising a disk-shaped abrasive body having two opposite faces and a non-uniform thickness.

    摘要翻译: 本发明涉及一种改进的切割轮,其包括具有两个相对面和不均匀厚度的盘状研磨体。

    Conditioning element for electrochemical mechanical processing
    4.
    发明申请
    Conditioning element for electrochemical mechanical processing 审中-公开
    电化学机械加工的调节元件

    公开(公告)号:US20060276111A1

    公开(公告)日:2006-12-07

    申请号:US11142918

    申请日:2005-06-02

    IPC分类号: B24B1/00 B24B33/00

    CPC分类号: B24B53/017 B24B53/12

    摘要: Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of a type selected from the group consisting of very blocky (4D), blocky (3D), and irregular (2D), and have a shape ratio less than or equal to 1.2. In one embodiment, the diamond particles have an average size of between about 85 and about 115 μm. In one embodiment, the size of the diamond particles may have a standard of deviation that is less than about 5 μm. In one embodiment, the diamond particles may have a spacing of greater than 400 μm.

    摘要翻译: 本文提供了用于调节加工垫的调节元件的实施例。 在一个实施例中,用于调节处理垫的调节元件包括具有面的主体。 多个金刚石颗粒设置在面上并限定调理表面。 金刚石颗粒是选自非常块状(4D),块状(3D)和不规则(2D)的类型,并且具有小于或等于1.2的形状比。 在一个实施方案中,金刚石颗粒的平均尺寸为约85至约115μm。 在一个实施方案中,金刚石颗粒的尺寸可以具有小于约5μm的偏差标准。 在一个实施例中,金刚石颗粒可以具有大于400μm的间隔。

    Abrasive disc
    5.
    发明申请
    Abrasive disc 有权
    研磨盘

    公开(公告)号:US20060211353A1

    公开(公告)日:2006-09-21

    申请号:US11080981

    申请日:2005-03-16

    IPC分类号: B23F21/03 B24B33/00

    CPC分类号: B24D7/06

    摘要: An abrasive disc which has plural abrasive chips having an abrasive layer on a metal piece and being arranged in a peripheral portion of a disc substrate with a predetermined space comprises a suspension plate placed between the disc substrate and abrasive chips and an elastic sheet placed between the disc substrate and the suspension plate, wherein the disc substrate consists of a plastic resin including fiber, the abrasive chips have stakes therein and the suspension plate has through-holes to which the stakes are deformed therein. Each of the abrasive chips has abrasive surfaces including a top abrasive surface and peripheral surfaces and the outer peripheral portion and the inner peripheral portion are declined to the top surface. The abrasive discs have a combination of different abrasive chips fabricated by different bonding metals for the fabrication of the abrasive chips.

    摘要翻译: 具有在金属片上具有研磨层并且具有预定间隔设置在盘基片的周边部分中的多个研磨片的研磨盘包括放置在盘基片和研磨片之间的悬挂板, 盘基片和悬挂板,其中盘基片由包括纤维的塑料树脂组成,研磨片在其中具有桩,悬挂板具有通孔,桩中的桩在其中变形。 每个研磨片具有包括顶部研磨表面和外周表面的研磨表面,并且外周部分和内周部分向下倾斜到顶表面。 研磨盘具有由用于制造磨料碎片的不同结合金属制成的不同研磨片的组合。

    Cutting tools with two-slope profile
    6.
    发明授权
    Cutting tools with two-slope profile 有权
    具有双斜率剖面的切割工具

    公开(公告)号:US07097551B2

    公开(公告)日:2006-08-29

    申请号:US11082487

    申请日:2005-03-17

    IPC分类号: B24B33/00

    CPC分类号: E21B10/5735

    摘要: An abrasive tool insert is formed from a substrate having an inner face that has a center. The inner face slopes outwardly and downwardly from the center. An annular face slopes downwardly and outwardly from the inner face. An abrasive layer, having a center and a periphery forming a cutting edge, is integrally formed on the substrate.

    摘要翻译: 研磨工具插入件由具有中心的内表面的基板形成。 内表面从中心向外和向下倾斜。 环形表面从内表面向下和向外倾斜。 在基板上一体地形成具有形成切削刃的中心和周边的磨料层。

    Grinding wheel
    7.
    发明申请
    Grinding wheel 审中-公开
    砂轮

    公开(公告)号:US20060154583A1

    公开(公告)日:2006-07-13

    申请号:US11327958

    申请日:2006-01-09

    IPC分类号: B24B33/00

    CPC分类号: B24B7/186 B24D7/06 B24D7/14

    摘要: Grinding wheel for a floor grinding machine, comprising a metal wheel (1) with a first and a second flat surface. Diamond-containing grinding elements (11, 12) are arranged on the first flat surface. Grinding elements (11, 12), preferably diamond-containing, are also arranged on the second flat surface of the wheel (1).

    摘要翻译: 一种用于地板研磨机的砂轮,包括具有第一和第二平坦表面的金属轮(1)。 含金刚石的研磨元件(11,12)设置在第一平坦表面上。 研磨元件(11,12),优选含金刚石,也布置在车轮(1)的第二平坦表面上。

    Retaining ring assembly for use in chemical mechanical polishing
    8.
    发明授权
    Retaining ring assembly for use in chemical mechanical polishing 失效
    固定环组件用于化学机械抛光

    公开(公告)号:US07029386B2

    公开(公告)日:2006-04-18

    申请号:US10865626

    申请日:2004-06-10

    申请人: Richard T. Young

    发明人: Richard T. Young

    CPC分类号: B24B37/32

    摘要: A retaining ring assembly for use in chemical mechanical polishing that includes an annular plastic retaining ring portion defining an annular projection thereon, an annular metal backing defining an annular channel therein for receiving the projection and a pair of elongated spring members concentrically disposed about the annular projection on the retaining ring. The channel in the backing is sized so as to receive the annular projection on the retaining ring and spring members therein upon the retaining ring being urged against the backing whereupon the spring members bear against the projection on the retaining ring and portions of the annular backing so as to releasably secure the retaining ring to the backing such that the retaining ring can be replaced upon becoming worn during use and the metal backing can be reused.

    摘要翻译: 一种用于化学机械抛光的保持环组件,其包括在其上限定环形突起的环形塑料保持环部分,环形金属背衬,其中限定用于接收突出部的环形通道,以及一对同心地围绕环形突起设置的细长弹簧部件 在挡环上。 背衬中的通道的尺寸被设计成在保持环被推靠在背衬上时接收保持环上的环形突起和弹簧构件,随后弹簧构件抵靠保持环上的突起和环形背衬的一部分 为了将保持环可释放地固定到背衬上,使得保持环可以在使用期间变得磨损而被替换,并且可以重新使用金属背衬。

    Chemical mechanical machining and surface finishing
    9.
    发明申请
    Chemical mechanical machining and surface finishing 审中-公开
    化学机械加工和表面处理

    公开(公告)号:US20050164610A1

    公开(公告)日:2005-07-28

    申请号:US11012518

    申请日:2004-12-15

    摘要: The invention described herein discloses a chemical mechanical machining and surface finishing process. A conversion coating is formed on the surface of a workpiece and is removed via relative motion with a tool, thereby exposing the workpiece to further reaction with the active chemistry. Low mechanical forces are used such that the plastic deformation, shear strength, tensile strength and/or thermal degradation temperature of the workpiece are not exceeded. Since the chemical mechanical machining and surface finishing process requires little force and/or speed of contact to remove the conversion coating, the equipment's mass, complexity and cost can be significantly reduced, while simultaneously increasing machining precision and accuracy. The present invention lends itself to a very controlled rate of metal removal, and can simply surface finish the workpiece, or if desired, can surface finish the workpiece simultaneously with the shaping and/or sizing process.

    摘要翻译: 本文所述的发明公开了一种化学机械加工和表面精加工方法。 在工件的表面上形成转化涂层,并通过工具的相对运动去除转化涂层,从而使工件暴露于与活性化学物质的进一步反应。 使用低机械力,使得不超过工件的塑性变形,剪切强度,拉伸强度和/或热降解温度。 由于化学机械加工和表面处理过程需要很小的力和/或接触速度来去除转换涂层,因此可以显着降低设备的质量,复杂性和成本,同时提高加工精度和精度。 本发明适用于非常受控的金属去除速率,并且可以简单地对工件进行表面光洁度,或者如果需要,可以在成形和/或定径过程中同时对工件进行表面光洁。

    Chemical mechanical polish (CMP) conditioning-disk holder
    10.
    发明授权
    Chemical mechanical polish (CMP) conditioning-disk holder 有权
    化学机械抛光(CMP)调理盘支架

    公开(公告)号:US06887138B2

    公开(公告)日:2005-05-03

    申请号:US10601248

    申请日:2003-06-20

    CPC分类号: B24B53/017 B24B53/12

    摘要: A chemical mechanical polishing (CMP) tool holds a conditioning disk that is used to remove impurities from a polishing disk used to planarize surfaces, such as a semiconductor surface. The tool uses an elastic disk that is positioned between a clamp and a gimbal hub that pivotally overlies a gimbal plate. The elastic disk is a polymer material, such as for example polytetrafluoroethylene (PTFE). The elastic disk has a central opening and is radially solid around the central opening. Alignment holes and drive mechanism holes pierce the elastic disk which functions to rotate the tool with minimal friction and provides a liquid seal from CMP fluids. Access holes in the gimbal plate permit easy installation and removal of the individual components. The PTFE disk is strong and durable enough to withstand high torque and provide lengthy operation without maintenance.

    摘要翻译: 化学机械抛光(CMP)工具保持用于从用于平坦化表面的抛光盘(例如半导体表面)去除杂质的调节盘。 该工具使用一个弹性盘,该弹性盘定位在夹具和万向枢轴之间,万向枢轴枢转地覆盖在万向节板上。 弹性盘是聚合物材料,例如聚四氟乙烯(PTFE)。 弹性盘具有中心开口并围绕中心开口径向固定。 对准孔和驱动机构孔刺穿弹性盘,其功能是以最小摩擦旋转工具,并提供CMP流体的液体密封。 万向节板上的通孔允许容易地安装和拆卸各个部件。 PTFE圆盘坚固耐用,足以承受高扭矩并提供长时间的操作,无需维护。