公开(公告)号：US5565033A

公开(公告)日：1996-10-15

申请号：US448958

申请日：1995-05-24

申请人： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

发明人： Michael A. Gaynes ,  George D. Oxx ,  Mark V. Pierson ,  Jerzy Zalesinski

IPC分类号： B05C5/02 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H05K3/12 ,  H05K3/32 ,  H05K3/34 ,  B05C1/16

CPC分类号： H01L24/27 ,  B23K3/0692 ,  H01L21/4853 ,  H01L21/4867 ,  H01L24/83 ,  H05K3/1233 ,  H05K3/3484 ,  B23K2201/36 ,  H01L2224/2919 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/3025 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0577 ,  H05K3/321 ,  H05K3/3452 ,  Y10T29/49165 ,  Y10T428/24917

摘要： A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.

摘要翻译： 在电子电路的制造中将焊接剂和导电粘合剂等粘合剂施加到焊盘部位的方法使用糊剂注入头。 具有腔体开口的永久性掩模施加在载体上的导电焊盘周围。 导电垫对应于芯片附接位置。 使注射头与掩模的表面接触，并且将压力施加到注射头中的粘合剂。 然后将注射头移动到掩模的表面上，用粘合剂填充空腔开口。 然后将注射头从掩模的表面去除。 如果使用焊膏，则将红外线辐射施加到填充的空腔开口，以蒸发浆料焊剂并回流焊料，以在突出在掩模上方的空腔开口内形成焊球。 如果使用导电粘合剂，则在将掩模与所述注射头接触之前，将模板施加到掩模的表面。 当腔开口被填充时，将模板从掩模中取出，并且填充空腔开口的导电粘合剂被干燥。

公开(公告)号：US5497938A

公开(公告)日：1996-03-12

申请号：US299520

申请日：1994-09-01

申请人： John F. McMahon ,  George Chiu

发明人： John F. McMahon ,  George Chiu

IPC分类号： B23K3/06 ,  B23K35/02 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/30 ,  H05K3/34 ,  B23K3/08

CPC分类号： H01L24/16 ,  B23K3/0623 ,  B23K3/0692 ,  B23K35/0222 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/81 ,  H05K3/3436 ,  H05K3/3478 ,  B23K2201/36 ,  B23K2201/40 ,  H01L2224/11003 ,  H01L2224/11013 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/27438 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81101 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/16195 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/0113 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K3/303 ,  Y02P70/613

摘要： A roll of tape with solder forms and methods for transferring the solder forms only or both the solder forms and portions of the tape to electronic components are disclosed. Electronic components may be any of integrated circuit chips, chip packages and printed circuit boards. Transferring solder forms to electronic components is a two-step process: (a) the solder forms are positioned and placed on a roll of tape off-line and (b) the solder forms on the roll of tape are transferred to the electronic components in an assembly line. The solder forms may be temporarily or permanently attached to the tape. In the first instance, only the solder forms are transferred. In the latter instance, tape portions are transferred to the electronic components with the solder forms. The solder forms may be attached to one side of the tape or in through-holes in the tape using either UV sensitive adhesives or cold adhesives such as solder flux. The solder forms may be released by pressing the solder forms against the electronic components, exposing the UV sensitive adhesives to UV light or using a "bed of nails". In addition, the solder forms may be shaped as balls, cylinders, polygonal boxes, barrels or hour glasses. The tape is thermally conductive and heat resistant and may have impregnated materials such as ceramic, aluminum nitride or solder flux to improve its thermal, mechanical and/or electrical properties.

摘要翻译： 公开了一卷带有焊料形式的胶带以及用于仅将焊料形成或将两种焊料形式和带的部分两者转移到电子部件的方法。 电子元件可以是集成电路芯片，芯片封装和印刷电路板中的任何一种。 将焊料形式转移到电子部件是一个两步的过程：（a）焊料形式定位并离线放置在一卷胶带上，（b）胶带上的焊料形式被转移到电子部件中 一条装配线。 焊料形式可能暂时或永久性地附着在磁带上。 首先，仅传送焊料形式。 在后一种情况下，带部分被转移到具有焊料形式的电子部件。 焊料形式可以使用UV敏感粘合剂或冷粘合剂（例如助焊剂）附接到带的一侧或带中的通孔中。 可以通过将焊料形式压在电子部件上，将UV敏感粘合剂暴露于UV光或使用“指甲床”来消除焊料形式。 此外，焊料形状可以形成为球，圆柱体，多边形盒，桶或小时眼镜。 胶带是导热和耐热的，并且可以具有诸如陶瓷，氮化铝或助焊剂的浸渍材料，以改善其热，机械和/或电性质。

公开(公告)号：US4858554A

公开(公告)日：1989-08-22

申请号：US238923

申请日：1988-08-31

申请人： Tomio Tsuchiya

发明人： Tomio Tsuchiya

IPC分类号： H01L23/50 ,  B23K1/08 ,  B23K3/06 ,  H01L21/00 ,  H01R43/02

CPC分类号： H01L21/67144 ,  B23K3/0692 ,  H01R43/0235

摘要： A soldering machine for simultaneously applying liquid solder to opposite sides of the leads of a lead frame having I.C. devices thereon. The machine has sidewardly spaced rolls which define a vertically extending narrow nip therebetween through which the lead frame passes. A solder bath is disposed below the rolls so that the lower portions of the rolls dip into the bath and carry a solder film to the nip for application to opposite sides of the leads. A passage extends upwardly in isolation from the bath for permitting the lead frame to be fed vertically through the nip.

摘要翻译： 一种用于将液体焊料同时施加到具有I.C.的引线框的引线的相对侧的焊接机。 设备。 机器具有侧向隔开的辊，其限定了引线框架穿过的其中的垂直延伸的狭窄辊隙。 在辊下方设置焊料槽，使得辊的下部浸入槽中，并将焊料膜携带到辊隙上，以将其施加到引线的相对侧。 通道与浴隔开而向上延伸，以允许引线框架通过辊隙垂直地进给。

公开(公告)号：US3981392A

公开(公告)日：1976-09-21

申请号：US560450

申请日：1975-03-21

申请人： David L. Booz ,  Ford J. Brown ,  Richard J. Merwarth

发明人： David L. Booz ,  Ford J. Brown ,  Richard J. Merwarth

IPC分类号： B23K3/06 ,  B65G17/18 ,  H01H11/00 ,  B65G47/24

CPC分类号： B65G17/18 ,  B23K3/0676 ,  B23K3/0692 ,  H01H11/005 ,  B65G2201/02

摘要： In fabricating sealed contacts, often their axially extending leads are solder coated to protect them from contamination and to enhance their solderability into circuits. An apparatus for solder coating the leads, which minimizes their bending, includes a conveying apparatus that moves the contacts through various stages of the solder coating apparatus to form layers of solder on the leads. These layers, which are carefully controlled, are no greater than a certain maximum thickness, and are thinner on the ends of the leads than on the side surfaces thereof.To coat the leads, the contacts are individually mounted in a plurality of holders, each of which is fixed to an individual bead of an endless bead chain of the conveying apparatus. As the chain is advanced through a passageway of a tube having various curvilinear and rectilinear slots formed in the outer surface thereof, the holders extending through these slots are oriented in various longitudinal positions along the tube and angular positions about the chain to appropriately orient the leads through the stages of the solder coating apparatus.In a first stage, the contacts are loaded into the holders from a bin and moved in a predetermined orientation to a second stage where a mixture of powdered solder and flux is applied to each lead by coating wheels having resilient peripheral surfaces. The leads are moved into simultaneous contact with these surfaces to coat the side surfaces and ends of the lead with the mixture.Next, the leads are moved in the same orientation by the chain through a heating apparatus having a baffle arrangement to substantially confine hot gases to the vicinity of the leads to melt the solder of the mixture. The chain then moves the solder coated leads longitudinally along the tube and rotatably about the chain due to the camming action of the slots on the holders. This changes the angular orientation of the leads and immerses the contacts and leads in a cleaning bath to remove any residual flux from the leads. The contacts are next rotatably and longitudinally moved out of the cleaning bath and into a rinsing bath. Finally, the contacts are moved through a drying chamber to remove any remnants of the rinsing bath and are stripped from the holders into a bin.

摘要翻译： 在制造密封触点时，通常它们的轴向延伸引线是焊接涂层的，以防止它们受到污染并增强其对电路的可焊性。 用于焊接涂覆引线的装置，其最小化其弯曲，包括使触点移动到焊料涂覆装置的各个阶段以在引线上形成焊料层的输送装置。 仔细控制的这些层不大于一定的最大厚度，并且在引线的端部上比在其侧表面上更薄。

公开(公告)号：US3172387A

公开(公告)日：1965-03-09

申请号：US2756260

申请日：1960-05-09

申请人： SPRAGUE ELECTRIC CO

发明人： BURKE EARL J

IPC分类号： B23K3/06

CPC分类号： B23K3/0692 ,  B23K2201/36

公开(公告)号：US2690005A

公开(公告)日：1954-09-28

申请号：US26309151

申请日：1951-12-24

申请人： AMERICAN CAN CO

发明人： SCHOENFELD JR WILLIAM H

IPC分类号： B23K3/06 ,  B23K35/26

CPC分类号： B23K35/268 ,  B23K3/0692

公开(公告)号：US09162249B2

公开(公告)日：2015-10-20

申请号：US12568347

申请日：2009-09-28

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

IPC分类号： B05C1/00 ,  B05C11/00 ,  B05C11/10 ,  B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  C23C14/54 ,  G01F11/20 ,  G01F11/00 ,  B05C5/02 ,  B05C9/02 ,  B05D1/26 ,  B05D3/04

CPC分类号： B05C11/1034 ,  B05C5/02 ,  B05C5/0212 ,  B05C5/0225 ,  B05C9/02 ,  B05D1/26 ,  B05D3/0466 ,  B23K1/0016 ,  B23K3/0692 ,  B23K2101/40 ,  G01F11/00 ,  H05K3/3484 ,  H05K2203/0126

摘要： A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

摘要翻译： 销（125）在喷嘴（121）中向下移动，从喷嘴（121）的排出口（122）向目标物体（102）突出的浆料（101）的端部与靶 物体（102），并且销（125）远离排出口（122）移动，以将糊剂与目标物体接触。

公开(公告)号：US20120080504A1

公开(公告)日：2012-04-05

申请号：US13315843

申请日：2011-12-09

申请人： Shigeki Sawa ,  Katsuhiko Tanno ,  Osamu Kimura ,  Koji Kuribayashi

发明人： Shigeki Sawa ,  Katsuhiko Tanno ,  Osamu Kimura ,  Koji Kuribayashi

IPC分类号： B23K3/00

CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K3/0692 ,  B23K2101/36 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557

摘要： A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

摘要翻译： 能够将焊球牢固地装载在连接焊盘上的焊球加载方法包括在印刷电路板的每个连接焊盘组上施加焊剂，焊剂不会施加到间隔件和印刷电路板之间的接触部分，以保持焊剂附着到 间隔物。 由于焊剂没有附着到间隔物上，当掩模与印刷电路板分离时，印刷电路板不需要颠倒，并且使阻焊层70的损坏最小化。 此外，通过使用间隔件使焊球的高度和掩模的上表面相等，使得可以将焊球牢固地加载在电极焊盘上，每个连接焊盘用一个焊球，并且降低概率 该焊球没有被加载，或者多个焊球被加载到单个连接焊盘上。

公开(公告)号：US06324973B2

公开(公告)日：2001-12-04

申请号：US09235034

申请日：1999-01-21

申请人： Mark Rossmeisl ,  Gary T. Freeman ,  Robert Balog

发明人： Mark Rossmeisl ,  Gary T. Freeman ,  Robert Balog

IPC分类号： B05C1704

CPC分类号： B23K3/0692 ,  B23K3/0607 ,  B23K2101/36 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2203/0126 ,  H05K2203/0783 ,  H05K2203/1105

摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

摘要翻译： 一种在基板上形成图案的预定位置印刷粘性材料的打印机。 打印机包括安装到框架上的框架，装置，其具有布置成形成图案的多个穿孔;联接到框架的支撑装置，其在设备下方的打印位置支撑基板;以及材料分配器 。 材料分配器具有容纳待印刷的粘性材料的室。 该腔室具有开口，粘性材料通过该开口分配。 材料分配器联接到框架，定位在装置上方，并被构造和布置成通过装置中的穿孔和衬底上的粘性材料分配。 材料分配器具有收回装置，其防止在分配完成之后粘性材料从开口泄漏。

公开(公告)号：US5973295A

公开(公告)日：1999-10-26

申请号：US261645

申请日：1994-06-17

申请人： Antoine Corbin ,  Philippe Demoncy ,  Jacques Foulu ,  Pierre Sudraud

发明人： Antoine Corbin ,  Philippe Demoncy ,  Jacques Foulu ,  Pierre Sudraud

IPC分类号： B23K26/00 ,  B23K3/02 ,  B23K3/06 ,  H01L21/00 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/768 ,  H01L31/0224 ,  H05K3/12

CPC分类号： H01L21/67011 ,  B23K3/02 ,  B23K3/0615 ,  B23K3/0692 ,  G03F1/74 ,  H01L21/76838 ,  H01L21/76892 ,  H01L31/022425 ,  H05K3/1241 ,  Y02E10/50 ,  Y10S977/857

摘要： A heated apparatus, positioned in the X, Y, and Z directions, for forming fine lines of molten material on a substrate. The apparatus includes a pen having a refractory tip wetted with material in a molten state. The tip is attached to a V-shaped heater to form a heater assembly. The ends of the V-shaped heater are welded to the pins of a three lead TO-5 package base. The pen is then mounted on an apparatus adapted to direct writing. To that end, the pen is attached to a supporting device capable of moving in the X, Y, and Z directions. When the welding point of the tip/heater assembly reaches the melting point of the material to be deposited, it is dipped in a crucible containing the material in a molten state. The welding point nucleates a minute drop of the molten material, forming a reservoir. A thin film of material flows from the reservoir and wets the tip, which is then brought in contact with the substrate upon which the desired pattern is to be formed.

摘要翻译： 位于X，Y，Z方向的加热装置，用于在基板上形成熔融材料的细线。 该装置包括具有用熔融状态的材料润湿的耐火端头的笔。 尖端附接到V形加热器以形成加热器组件。 V形加热器的端部焊接到三引脚TO-5封装基座的引脚上。 然后将笔安装在适于直接写入的装置上。 为此，笔连接到能够沿X，Y和Z方向移动的支撑装置。 当尖端/加热器组件的焊接点达到要沉积的材料的熔点时，将其浸入含有熔融状态的材料的坩埚中。 焊接点使熔融材料的微滴成核，形成储存器。 材料薄膜从储存器流出并润湿尖端，然后与要形成所需图案的基板接触。