公开(公告)号：US08291582B2

公开(公告)日：2012-10-23

申请号：US12161907

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H01L21/44

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US20090321122A1

公开(公告)日：2009-12-31

申请号：US12295119

申请日：2007-03-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/14 ,  H05K3/10

CPC分类号： H05K1/144 ,  H01R12/7076 ,  H01R12/7082 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K2201/10378 ,  H05K2201/2018 ,  Y10T29/49165

摘要： Relay substrate (1) connecting between at least a first circuit board and a second circuit board, including housing (10) having recess (10a) provided in the outer circumference and hole (22) provided in the inner circumference; plural connecting terminal electrodes (12a, 12c) connecting between the top and bottom surfaces of housing (10); shield electrode (11) provided in recess (10a); and ground electrode (13) provided on a part of the top and bottom surfaces of housing (10).

摘要翻译： 连接在至少第一电路板和第二电路板之间的继电器基板（1），包括设置在外周的具有凹部（10a）的壳体（10）和设置在内周的孔（22） 连接在壳体（10）的顶表面和底表面之间的多个连接端子电极（12a，12c） 设置在凹部（10a）中的屏蔽电极（11） 和设置在壳体（10）的顶表面和底表面的一部分上的接地电极（13）。

公开(公告)号：US07357288B2

公开(公告)日：2008-04-15

申请号：US10891524

申请日：2004-07-15

申请人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

发明人： Naoto Hosotani ,  Kazuki Fukada ,  Keiichi Iwata ,  Daido Komyoji

IPC分类号： B23K1/00

CPC分类号： B23K3/087 ,  B23K2101/40 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12042 ,  H05K3/3494 ,  H05K2201/10727 ,  H05K2203/0195 ,  H05K2203/1121 ,  H05K2203/1581 ,  H05K2203/304 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261 ,  H01L2924/00014 ,  H01L2924/00

摘要： When a component, that has a connection portion to be connected to an electrode of a board and a weak heat-resistant portion of a lower heat-resisting property than a fusing point of a connection material for connecting the electrode of the board with the connection portion, is connected to the board with interposition of connection material between the electrode of the board and the connection portion, a cooling member is brought into contact with the weak heat-resistant portion or its neighborhood while heating the connection material by heating the board brought in contact with a placement member, and a quantity of heat conducted to the weak heat-resistant portion via the board is reduced by being conducted to the cooling member, thereby performing fusing of the connection material while preventing occurrence of thermal damage to the weak heat-resistant portion.

摘要翻译： 当具有要连接到板的电极的连接部分和具有比用于将板的电极与连接件连接的连接材料的熔点低的耐热性能的弱耐热部分的部件 通过在板的电极和连接部之间插入连接材料而连接到板，冷却部件与弱耐热部或其附近接触，同时通过加热连接材料来加热板 与放置构件接触，并且通过被传导到冷却构件而减少通过板传导到弱耐热部分的热量，从而进行连接材料的熔合，同时防止对弱热的热损伤的发生 抵抗部分。

公开(公告)号：US08208270B2

公开(公告)日：2012-06-26

申请号：US12280434

申请日：2007-04-23

申请人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

发明人： Masato Mori ,  Daido Komyoji ,  Koichi Nagai ,  Yoshihiko Yagi

IPC分类号： H05K1/11

CPC分类号： H05K1/144 ,  B23K1/0016 ,  B23K2101/42 ,  H05K3/368 ,  H05K2201/10378 ,  H05K2201/10977 ,  H05K2201/2018 ,  H05K2203/1572

摘要： Three-dimensional structure (40) of the present invention includes first module board (28), second module board (37), and substrate joining member (10) that unifies board (28) and board (37) into one body, thereby electrically connecting these two elements together. The unification is done by molding the outer wall of housing (12) of substrate joining member (10) with resin (29). Substrate joining member (10) used in the three-dimensional structure (40) includes multiple lead terminals (14) made of conductive material, and a frame-shaped and insulating housing (12) to which frame the lead terminals (14) are fixed vertically in a predetermined array. Housing (12) includes projections (18) on at least two outer wall faces of its frame shape.

摘要翻译： 本发明的三维结构（40）包括将板（28）和板（37）一体化成一体的第一模块板（28），第二模块板（37）和基板接合构件（10），由此电 将这两个元素连接在一起。 通过用树脂（29）将衬底接合构件（10）的壳体（12）的外壁模制成一体。 在三维结构（40）中使用的基板接合构件（10）包括由导电材料制成的多个引线端子（14）和框架形绝缘壳体（12），引线端子（14）固定到框架形绝缘壳体 垂直于预定的阵列。 壳体（12）在其框架形状的至少两个外壁面上包括突起（18）。

公开(公告)号：US08058951B2

公开(公告)日：2011-11-15

申请号：US11997178

申请日：2006-09-22

申请人： Kenichi Yamamoto ,  Daido Komyoji ,  Keizaburo Kuramasu

发明人： Kenichi Yamamoto ,  Daido Komyoji ,  Keizaburo Kuramasu

IPC分类号： H03H7/00

CPC分类号： H05K1/16 ,  H01L23/66 ,  H01L27/016 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H7/175 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4614 ,  H05K2201/0317 ,  H05K2201/086 ,  H05K2201/09763 ,  H05K2203/1189 ,  Y10T29/49155 ,  H01L2924/00

摘要： A configuration includes a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

摘要翻译： 一种构造包括：第一薄片基板，其上形成有至少一个主面上的第一薄膜电子部件，并且用于连接到外部电路的外部连接端子形成为一个主面或另一个面; 第二片基板，在至少一个面上形成有第二薄膜电子部件; 绝缘体连接树脂层，用于将第一薄片基板和与第一薄膜电子部件相对的第二薄片基板固定在第二薄膜电子部件上; 以及用于电连接第一薄膜电子部件和第二薄膜电子部件的预先设定的电极端子的层间连接导体。

公开(公告)号：US20100090781A1

公开(公告)日：2010-04-15

申请号：US11997178

申请日：2006-09-22

申请人： Kenichi Yamamoto ,  Daido Komyoji ,  Keizaburo Kuramasu

发明人： Kenichi Yamamoto ,  Daido Komyoji ,  Keizaburo Kuramasu

IPC分类号： H03H7/00 ,  H05K3/00 ,  H05K1/02

CPC分类号： H05K1/16 ,  H01L23/66 ,  H01L27/016 ,  H01L2924/0002 ,  H03H7/0115 ,  H03H7/175 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4614 ,  H05K2201/0317 ,  H05K2201/086 ,  H05K2201/09763 ,  H05K2203/1189 ,  Y10T29/49155 ,  H01L2924/00

摘要： To provide a configuration including a first sheet substrate, on which a first thin film electronic component is formed on at least one main face, and an external connection terminal for connecting to an external circuit is formed one main face or the other face; a second sheet substrate, on which a second thin film electronic component is formed on at least one face; an insulator connection resin layer for fixing the first sheet substrate and the second sheet substrate opposing the first thin film electronic component against the second thin film electronic component; and an interlayer connection conductor for electrically connecting electrode terminals, which have been set in advance, of the first thin film electronic component and the second thin film electronic component.

摘要翻译： 为了提供一种构造，其包括在至少一个主面上形成有第一薄膜电子部件的第一片状基板和用于连接到外部电路的外部连接端子，形成为一个主面或另一个面; 第二片基板，在至少一个面上形成有第二薄膜电子部件; 绝缘体连接树脂层，用于将第一薄片基板和与第一薄膜电子部件相对的第二薄片基板固定在第二薄膜电子部件上; 以及用于电连接第一薄膜电子部件和第二薄膜电子部件的预先设定的电极端子的层间连接导体。

公开(公告)号：US20100080912A1

公开(公告)日：2010-04-01

申请号：US12568347

申请日：2009-09-28

申请人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

发明人： Masayoshi Koyama ,  Norihito Tsukahara ,  Daido Komyoji

IPC分类号： B05D5/00 ,  B05D1/02 ,  B05C11/00

CPC分类号： B05C11/1034 ,  B05C5/02 ,  B05C5/0212 ,  B05C5/0225 ,  B05C9/02 ,  B05D1/26 ,  B05D3/0466 ,  B23K1/0016 ,  B23K3/0692 ,  B23K2101/40 ,  G01F11/00 ,  H05K3/3484 ,  H05K2203/0126

摘要： A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

摘要翻译： 销（125）在喷嘴（121）中向下移动，从喷嘴（121）的排出口（122）向目标物体（102）突出的浆料（101）的端部与靶 物体（102），并且销（125）远离排出口（122）移动，以将糊剂与目标物体接触。

公开(公告)号：US20090166064A1

公开(公告)日：2009-07-02

申请号：US12161907

申请日：2007-01-31

申请人： Hidenobu Nishikawa ,  Daido Komyoji

发明人： Hidenobu Nishikawa ,  Daido Komyoji

IPC分类号： H05K1/00 ,  B32B37/00

CPC分类号： H05K3/321 ,  G06K19/07749 ,  H01L21/6835 ,  H01L23/49855 ,  H01L24/11 ,  H01L24/12 ,  H01L24/28 ,  H01L24/29 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11001 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1182 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/29036 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K1/189 ,  H05K3/305 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2201/10984 ,  Y10T29/49002 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00015 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/05599

摘要： The invention includes: applying an anisotropic conductive resin including conductive particles only to a plurality of bumps of an electronic component; placing the electronic component above a main surface of a flexible wiring board via the anisotropic conductive resin; and pressurizing the electronic component to the wiring board and curing the anisotropic conductive resin applied to the plurality of bumps to join the plurality of bumps to the electrodes of the wiring board. This can prevent a defective mounting of the electronic component.

摘要翻译： 本发明包括：将仅包含导电颗粒的各向异性导电树脂施加到电子部件的多个凸块; 通过各向异性导电树脂将电子部件放置在柔性布线板的主表面上方; 并将所述电子部件加压到所述布线基板，并固化施加到所述多个凸块的各向异性导电树脂，以将所述多个凸块接合到所述布线板的电极。 这可以防止电子部件的安装不良。

公开(公告)号：US6027807A

公开(公告)日：2000-02-22

申请号：US584328

申请日：1996-01-11

申请人： Takao Inoue ,  Junji Ikeda ,  Yasuyuki Watanabe ,  Noboru Izutani ,  Kazuhiro Mori ,  Naomi Nishiki ,  Daido Komyoji ,  Katsuhiko Yamamoto

发明人： Takao Inoue ,  Junji Ikeda ,  Yasuyuki Watanabe ,  Noboru Izutani ,  Kazuhiro Mori ,  Naomi Nishiki ,  Daido Komyoji ,  Katsuhiko Yamamoto

IPC分类号： B32B9/00 ,  C01B31/04 ,  F28D1/00 ,  F28F21/02

CPC分类号： F28F21/02 ,  Y10T428/30

摘要： It is a object of this invention to provide a graphite cladding sheet having an excellent mechanical strength and applicable to wide use and a graphite device using said sheet. The graphite cladding sheet 10 comprises a flexible thin graphite sheet having a high orientation and a supporting sheet 12 fixedly laminated on one surface of the graphite film 11. If necessary, the graphite film may be sandwiched between the supporting sheet and the interlocking element by binding them with an adhesive filled in the hole which pass through the graphite film.

摘要翻译： 本发明的目的是提供一种具有优异的机械强度并适用于广泛应用的石墨包覆片和使用该片的石墨装置。 石墨包覆片10包括具有高取向性的柔性薄型石墨片和固定层压在石墨膜11的一个表面上的支撑片12.如果需要，石墨膜可以通过结合夹在支撑片和互锁元件之间 它们具有填充在通过石墨膜的孔中的粘合剂。

公开(公告)号：US5780820A

公开(公告)日：1998-07-14

申请号：US612176

申请日：1996-03-07

申请人： Daido Komyoji ,  Takao Inoue ,  Naomi Nishiki ,  Junji Ikeda

发明人： Daido Komyoji ,  Takao Inoue ,  Naomi Nishiki ,  Junji Ikeda

IPC分类号： H05B3/20 ,  C23C14/24 ,  H05B3/14 ,  H05B3/34

CPC分类号： H05B3/145 ,  H05B3/34 ,  H05B2203/004 ,  H05B2203/013 ,  H05B2203/017 ,  H05B2203/026 ,  H05B2203/029 ,  H05B2203/036

摘要： A film-like heater which has a graphite film made of a polymer film baked at a temperature higher than 2,000 .degree. C. and having a good thermal conductivity, a good flexibility and a good resistance to high temperature, so that it is applicable to a thin face heat-retaining or heating means having various designs such as a seat heater fittable to a body shape, a vapor deposition boat operable at a high temperature and a compact heating device or apparatus.

摘要翻译： 一种膜状加热器，其具有由在高于2000℃的温度下烘烤并且具有良好的导热性，良好的柔韧性和良好的耐高温性的由聚合物膜制成的石墨膜，使得其适用于 具有各种设计的薄面保温或加热装置，例如可装配成体形的座椅加热器，可在高温下操作的气相沉积船和紧凑的加热装置或装置。