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    Solder ball loading mask, apparatus and associated methodology
    1.
    发明授权
    Solder ball loading mask, apparatus and associated methodology 有权
    焊球加载掩模，仪器和相关方法

    公开(公告)号：US08157157B2

    公开(公告)日：2012-04-17

    申请号：US12349748

    申请日：2009-01-07

    申请人： Shigeki Sawa ,  Katsuhiko Tanno ,  Osamu Kimura ,  Koji Kuribayashi

    发明人： Shigeki Sawa ,  Katsuhiko Tanno ,  Osamu Kimura ,  Koji Kuribayashi

    IPC分类号： B23K1/00 ,  B23K1/20

    CPC分类号： H05K3/3478 ,  B23K3/0623 ,  B23K3/0692 ,  B23K2101/36 ,  H05K3/3489 ,  H05K2203/041 ,  H05K2203/0485 ,  H05K2203/0557

    摘要： A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer 70 is minimized. Further, the heights of the solder balls and the upper surface of the mask are made equal by using the spacer, making it possible to securely load the solder balls on the electrode pads, one solder ball for each connection pad, and to reduce a probability that solder balls are not loaded or that a plurality of the solder balls are loaded onto a single connection pad.

    摘要翻译： 能够将焊球牢固地装载在连接焊盘上的焊球加载方法包括在印刷电路板的每个连接焊盘组上施加焊剂，焊剂不会施加到间隔件和印刷电路板之间的接触部分，以保持焊剂附着到 间隔物。 由于焊剂没有附着到间隔物上，当掩模与印刷电路板分离时，印刷电路板不需要颠倒，并且使阻焊层70的损坏最小化。 此外，通过使用间隔件使焊球的高度和掩模的上表面相等，使得可以将焊球牢固地加载在电极焊盘上，每个连接焊盘用一个焊球，并且降低概率 该焊球没有被加载，或者多个焊球被加载到单个连接焊盘上。

    Method of manufacturing an electronic component
    2.
    发明申请
    Method of manufacturing an electronic component 审中-公开
    电子部件的制造方法

    公开(公告)号：US20070228115A1

    公开(公告)日：2007-10-04

    申请号：US11542314

    申请日：2006-10-04

    申请人： Teruji Inomata ,  Masatoshi Sugiura

    发明人： Teruji Inomata ,  Masatoshi Sugiura

    IPC分类号： B23K31/02

    CPC分类号： B23K3/0692 ,  B23K2101/40 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2924/00014 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2203/043 ,  H05K2203/1476 ,  H01L2224/05599

    摘要： A method of manufacturing an electronic component which can reduce voids in a solder and can reliably melt the solder is provided. The method of manufacturing an electronic component including a member (substrate 1) having a metal junction (electrode 11) includes: the step of supplying a solder 5 containing a solvent, a resin component, an activator, and a brazing filler metal to the junction (electrode 11); the first heating step in which a first heating process to the solder 5 is performed and the solder 5 is kept at a first heating temperature for a predetermined period of time; the second heating step in which a second heating process to the solder 5 is preformed and the solder 5 is kept at a second heating temperature higher than the first heating temperature for a predetermined period of time to vaporize the solvent and the resin component; and the third heating step in which a third heating process to the solder 5 is performed and the solder 5 is melted.

    摘要翻译： 提供一种可以减少焊料中的空隙并且可以可靠地熔化焊料的电子部件的制造方法。 包括具有金属结（电极11）的部件（基板1）的电子部件的制造方法包括：向结合部供给含有溶剂，树脂成分，活化剂和钎料的焊料5的工序 （电极11）; 执行对焊料5的第一加热处理并且焊料5在第一加热温度下保持预定时间段的第一加热步骤; 预先对焊料5进行第二次加热处理的第二加热工序，使焊料5保持高于第一加热温度的规定时间的第二加热温度，使溶剂和树脂成分蒸发; 并且进行对焊料5的第三加热处理并且焊料5熔化的第三加热步骤。

    Method and apparatus for dispensing material in a printer
    3.
    发明授权
    Method and apparatus for dispensing material in a printer 有权
    用于在打印机中分配材料的方法和装置

    公开(公告)号：US06619198B2

    公开(公告)日：2003-09-16

    申请号：US10254348

    申请日：2002-09-24

    申请人： Mark Rossmeisl ,  Gary T. Freeman

    发明人： Mark Rossmeisl ,  Gary T. Freeman

    IPC分类号： B41F1540

    CPC分类号： B23K3/0607 ,  B23K3/0692 ,  B23K2101/36 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2203/0126 ,  H05K2203/0783 ,  H05K2203/1105

    摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete. The material dispenser includes a temperature control system to maintain the temperature of the viscous material contained in the chamber. The material dispenser also includes a closed-loop pressure control system to provide in-process control of the pressure of the chamber which permits uniform application of the viscous material to the substrate.

    摘要翻译： 一种在基板上形成图案的预定位置印刷粘性材料的打印机。 打印机包括安装到框架上的框架，装置，其具有布置成形成图案的多个穿孔;联接到框架的支撑装置，其在设备下方的打印位置支撑基板;以及材料分配器 。 材料分配器具有容纳待印刷的粘性材料的室。 该腔室具有开口，粘性材料通过该开口分配。 材料分配器联接到框架，定位在装置上方，并被构造和布置成通过装置中的穿孔和衬底上的粘性材料分配。 材料分配器具有收回装置，其防止在分配完成之后粘性材料从开口泄漏。 材料分配器包括温度控制系统，以保持包含在腔室中的粘性材料的温度。 材料分配器还包括一个闭环压力控制系统，以提供室内压力的过程中控制，这允许将粘性材料均匀地施加到基底上。

    METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER
    4.
    发明申请
    METHOD AND APPARATUS FOR DISPENSING MATERIAL IN A PRINTER 有权
    在打印机中分配材料的方法和装置

    公开(公告)号：US20010011506A1

    公开(公告)日：2001-08-09

    申请号：US09235034

    申请日：1999-01-21

    发明人： MARK ROSSMEISL ,  GARY T. FREEMAN ,  ROBERT BALOAG

    IPC分类号： B41L013/18 ,  B05C017/04 ,  B41L027/00

    CPC分类号： B23K3/0692 ,  B23K3/0607 ,  B23K2101/36 ,  H05K3/1233 ,  H05K3/3484 ,  H05K2203/0126 ,  H05K2203/0783 ,  H05K2203/1105

    摘要： A printer for printing a viscous material at predetermined positions forming a pattern on a substrate. The printer includes a frame, a device, mounted to the frame, having a number of perforations arranged to form the pattern, a support apparatus, coupled to the frame, that supports the substrate in a printing position beneath the device, and a material dispenser. The material dispenser has a chamber to contain the viscous material to be printed on the substrate. The chamber has an opening through which the viscous material is dispensed. The material dispenser is coupled to the frame, positioned over the device, and constructed and arranged to dispense the viscous material through the perforations in the device and onto the substrate. The material dispenser has a retraction device that prevents leakage of the viscous material from the opening after dispensing is complete.

    摘要翻译： 一种在基板上形成图案的预定位置印刷粘性材料的打印机。 打印机包括安装到框架上的框架，装置，其具有布置成形成图案的多个穿孔;联接到框架的支撑装置，其在设备下方的打印位置支撑基板;以及材料分配器 。 材料分配器具有容纳待印刷的粘性材料的室。 该腔室具有开口，粘性材料通过该开口分配。 材料分配器联接到框架，定位在装置上方，并被构造和布置成通过装置中的穿孔和衬底上的粘性材料分配。 材料分配器具有收回装置，其防止在分配完成之后粘性材料从开口泄漏。

    Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method
    8.
    发明授权
    Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method 有权
    焊接装置，焊接方法以及由焊接装置制造的基板和电子部件或焊接方法

    公开(公告)号：US09149883B2

    公开(公告)日：2015-10-06

    申请号：US13819555

    申请日：2012-04-14

    申请人： Katsumori Taniguro

    发明人： Katsumori Taniguro

    IPC分类号： B23K31/02 ,  B23K3/06 ,  H05K1/02 ,  B23K1/00 ,  B23K1/20

    CPC分类号： B23K3/0607 ,  B23K1/0016 ,  B23K1/20 ,  B23K1/206 ,  B23K3/0692 ,  H01L2924/14 ,  H05K1/0296 ,  H01L2924/00

    摘要： Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath 21 in which workpiece member 10 having a copper electrode is immersed in organic fatty acid-containing solution 31a; space section 24 having a steam atmosphere of organic fatty acid-containing solution 31b, the space section horizontally having ejection unit 33 to spray a jet stream of a molten solder to the copper electrode provided on workpiece member 10 and ejection unit 34 to spray a liquid to an excess of the molten solder for removal; and second organic fatty acid-containing solution bath 23 in which workpiece member 10 from which the excess of the molten solder is removed in space section 24 is immersed again in organic fatty acid-containing solution 31c.

    摘要翻译： 提供了一种能够以低成本，高产率和高可靠性进行焊接的焊接装置和焊接方法。 焊接装置具有：将具有铜电极的工件10浸渍在含有有机脂肪酸的溶液31a中的第一含有机脂肪酸的溶液浴21; 具有含有机脂肪酸溶液31b的蒸汽气氛的空间部分24，空间部分水平地具有喷射单元33，以将熔融焊料的喷射流喷射到设置在工件10上的铜电极和喷射单元34上以喷射液体 超过熔融焊料去除; 和第二有机脂肪酸溶液槽23，其中在空间部分24中除去过量的熔融焊料的工件10再次浸渍在含有机脂肪酸的溶液31c中。

    Spacer plate solder ball placement fixture and methods therefor
    10.
    发明授权
    Spacer plate solder ball placement fixture and methods therefor 有权
    隔板焊球放置夹具及其方法

    公开(公告)号：US06709469B1

    公开(公告)日：2004-03-23

    申请号：US09650834

    申请日：2000-08-30

    申请人： Joseph Link

    发明人： Joseph Link

    IPC分类号： H01L2100

    CPC分类号： H05K3/3478 ,  B23K3/0692 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12033 ,  H05K2201/2036 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/41 ,  H01L2924/00

    摘要： A stencil assembly for placing conductive elements over conductive pads accessible at a first surface of a microelectronic element includes a main body having a top surface and a bottom surface and a plurality of openings extending between the top and bottom surfaces, the main body being adapted for overlying the first surface of the microelectronic element so that the openings are in substantial alignment with the pads of the microelectronic element. The stencil assembly also includes a spacer element under the bottom surface of the main body, the spacer element being adapted for maintaining the main body above the first surface of the microelectronic element and remote from the pads of the microelectronic element. The main body and the spacer element have a combined thickness that is substantially equivalent to the diameter of the conductive elements.

    摘要翻译： 用于将导电元件放置在可在微电子元件的第一表面处可访问的导电焊盘上的模板组件包括具有顶表面和底表面的主体和在顶表面和底表面之间延伸的多个开口，主体适于 覆盖微电子元件的第一表面，使得开口与微电子元件的焊盘基本对齐。 模板组件还包括在主体的底表面下方的间隔元件，间隔元件适于将主体保持在微电子元件的第一表面上方并且远离微电子元件的焊盘。 主体和间隔元件的组合厚度基本上等于导电元件的直径。